ATE403938T1 - Doppelrippen-gruppenkühleinrichtungen - Google Patents

Doppelrippen-gruppenkühleinrichtungen

Info

Publication number
ATE403938T1
ATE403938T1 AT05745070T AT05745070T ATE403938T1 AT E403938 T1 ATE403938 T1 AT E403938T1 AT 05745070 T AT05745070 T AT 05745070T AT 05745070 T AT05745070 T AT 05745070T AT E403938 T1 ATE403938 T1 AT E403938T1
Authority
AT
Austria
Prior art keywords
core
twin
root
grooves
twin fins
Prior art date
Application number
AT05745070T
Other languages
English (en)
Inventor
Shankar Hegde
Original Assignee
Hewlett Packard Development Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Application granted granted Critical
Publication of ATE403938T1 publication Critical patent/ATE403938T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Motor Or Generator Cooling System (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
AT05745070T 2004-04-30 2005-04-29 Doppelrippen-gruppenkühleinrichtungen ATE403938T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/837,144 US7497248B2 (en) 2004-04-30 2004-04-30 Twin fin arrayed cooling device

Publications (1)

Publication Number Publication Date
ATE403938T1 true ATE403938T1 (de) 2008-08-15

Family

ID=34968695

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05745070T ATE403938T1 (de) 2004-04-30 2005-04-29 Doppelrippen-gruppenkühleinrichtungen

Country Status (7)

Country Link
US (1) US7497248B2 (de)
EP (1) EP1745507B1 (de)
CN (1) CN1977377A (de)
AT (1) ATE403938T1 (de)
DE (1) DE602005008734D1 (de)
TW (1) TW200603718A (de)
WO (1) WO2005109497A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8020608B2 (en) * 2004-08-31 2011-09-20 Hewlett-Packard Development Company, L.P. Heat sink fin with stator blade
US20060054311A1 (en) * 2004-09-15 2006-03-16 Andrew Douglas Delano Heat sink device with independent parts
US7164582B2 (en) * 2004-10-29 2007-01-16 Hewlett-Packard Development Company, L.P. Cooling system with submerged fan
US20080060793A1 (en) * 2006-09-08 2008-03-13 Tsung-Hsien Huang Cooler device
TW200934362A (en) * 2008-01-16 2009-08-01 Neng Tyi Prec Ind Co Ltd Method of manufacturing heat dissipaters having heat sinks and structure thereof
JP2009206404A (ja) * 2008-02-29 2009-09-10 Sanyo Denki Co Ltd 発熱体冷却装置
TWM348981U (en) * 2008-06-12 2009-01-11 Acpa Energy Conversion Devices Co Ltd Heat dissipation module
US20100044009A1 (en) * 2008-08-20 2010-02-25 Shyh-Ming Chen Annular heat dissipating device
TWI357479B (en) * 2008-11-28 2012-02-01 Univ Nat Taiwan Science Tech A thermal module for light source
JP2011154929A (ja) * 2010-02-15 2011-08-11 Sun-Lite Sockets Industry Inc 排熱装置
US8498116B2 (en) * 2010-07-16 2013-07-30 Rockwell Automation Technologies, Inc. Heat sink for power circuits
TWM422766U (en) * 2011-08-16 2012-02-11 Shi-Ming Chen Air heat sink and cooling fin with protection and improved performance
CN102527758B (zh) * 2012-01-20 2014-12-03 东莞汉旭五金塑胶科技有限公司 散热器铝底座的挤压成型模具及其制法
TWI507860B (zh) * 2012-08-01 2015-11-11 奇鋐科技股份有限公司 散熱器之結構及其製造方法
TWI475183B (zh) * 2012-08-01 2015-03-01 Asia Vital Components Co Ltd 散熱器結構及其製造方法
TWI473962B (zh) * 2012-08-01 2015-02-21 奇鋐科技股份有限公司 散熱器之製造方法
TWI512440B (zh) * 2012-08-01 2015-12-11 Asia Vital Components Co Ltd 散熱裝置及其製造方法
US9326424B2 (en) * 2014-09-10 2016-04-26 Opentv, Inc. Heat sink assembly and method of utilizing a heat sink assembly
WO2016076330A1 (ja) * 2014-11-12 2016-05-19 武延 本郷 放熱構造および照明装置
CN120402968B (zh) * 2025-05-08 2025-10-21 雷茨智能装备(广东)有限公司 基于数字孪生的热泵的污水余热回收供暖控制方法及系统

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Publication number Priority date Publication date Assignee Title
US2289984A (en) * 1940-07-12 1942-07-14 Westinghouse Electric & Mfg Co Air cooler for power tubes
US2535721A (en) * 1946-06-14 1950-12-26 Chausson Usines Sa Cylindrical heat exchanger
US3457988A (en) * 1967-05-15 1969-07-29 Westinghouse Electric Corp Integral heat sink for semiconductor devices
US5375655A (en) 1993-03-31 1994-12-27 Lee; Yong N. Heat sink apparatus
JP2000083343A (ja) * 1998-09-03 2000-03-21 Mitsubishi Electric Corp モーターフレーム及びモーターフレームの製造方法
US5964285A (en) * 1999-02-12 1999-10-12 Yung-Tsai Chu Heat sink
US6851467B1 (en) 1999-08-30 2005-02-08 Molex Incorporated Heat sink assembly
US6360816B1 (en) 1999-12-23 2002-03-26 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6680015B2 (en) * 2000-02-01 2004-01-20 Cool Options, Inc. Method of manufacturing a heat sink assembly with overmolded carbon matrix
CA2353338A1 (en) * 2000-07-21 2002-01-21 Ats Automation Tooling Systems Inc. Folded-fin heat sink manufacturing method and apparatus
US6633484B1 (en) * 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
US6396697B1 (en) * 2000-12-07 2002-05-28 Foxconn Precision Components Co., Ltd. Heat dissipation assembly
US20020121365A1 (en) * 2001-03-05 2002-09-05 Kozyra Kazimierz L. Radial folded fin heat sink
TW532738U (en) * 2001-03-27 2003-05-11 Foxconn Prec Components Co Ltd Heat sink assembly
US6827130B2 (en) * 2001-06-05 2004-12-07 Heat Technology, Inc. Heatsink assembly and method of manufacturing the same
US6505680B1 (en) 2001-07-27 2003-01-14 Hewlett-Packard Company High performance cooling device
US6508300B1 (en) 2001-07-27 2003-01-21 Hewlett Packard Company Spring clip for a cooling device
USD464938S1 (en) 2001-07-27 2002-10-29 Hewlett Packard Company High performance cooling device
US6657862B2 (en) * 2001-09-10 2003-12-02 Intel Corporation Radial folded fin heat sinks and methods of making and using same
US6543522B1 (en) 2001-10-31 2003-04-08 Hewlett-Packard Development Company, L.P. Arrayed fin cooler
US6631756B1 (en) * 2002-09-10 2003-10-14 Hewlett-Packard Development Company, L.P. High performance passive cooling device with ducting
US6714415B1 (en) * 2003-03-13 2004-03-30 Intel Corporation Split fin heat sink
US6886627B2 (en) * 2003-06-27 2005-05-03 Intel Corporation Radial heat sink with helical shaped fins

Also Published As

Publication number Publication date
US20050241800A1 (en) 2005-11-03
WO2005109497A1 (en) 2005-11-17
TW200603718A (en) 2006-01-16
EP1745507A1 (de) 2007-01-24
CN1977377A (zh) 2007-06-06
US7497248B2 (en) 2009-03-03
EP1745507B1 (de) 2008-08-06
DE602005008734D1 (de) 2008-09-18

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