ATE406425T1 - Druckempfindliches klebeband - Google Patents

Druckempfindliches klebeband

Info

Publication number
ATE406425T1
ATE406425T1 AT07003054T AT07003054T ATE406425T1 AT E406425 T1 ATE406425 T1 AT E406425T1 AT 07003054 T AT07003054 T AT 07003054T AT 07003054 T AT07003054 T AT 07003054T AT E406425 T1 ATE406425 T1 AT E406425T1
Authority
AT
Austria
Prior art keywords
sensitive adhesive
adhesive tape
weight
radiation
carbon
Prior art date
Application number
AT07003054T
Other languages
English (en)
Inventor
Fumiteru Asai
Toshio Shintani
Yuji Okawa
Tomokazu Takahashi
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE406425T1 publication Critical patent/ATE406425T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
    • C08F220/36—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate containing oxygen in addition to the carboxy oxygen, e.g. 2-N-morpholinoethyl (meth)acrylate or 2-isocyanatoethyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
    • C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
    • C08G18/6225—Polymers of esters of acrylic or methacrylic acid
    • C08G18/6229—Polymers of hydroxy groups containing esters of acrylic or methacrylic acid with aliphatic polyalcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C08G18/8108—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
    • C08G18/8116—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group esters of acrylic or alkylacrylic acid having only one isocyanate or isothiocyanate group
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/40—Compositions for pressure-sensitive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AT07003054T 2006-02-16 2007-02-13 Druckempfindliches klebeband ATE406425T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006039048A JP4799205B2 (ja) 2006-02-16 2006-02-16 活性面貼付ダイシング用粘着テープ又はシートおよび被加工物の切断片のピックアップ方法

Publications (1)

Publication Number Publication Date
ATE406425T1 true ATE406425T1 (de) 2008-09-15

Family

ID=37845121

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07003054T ATE406425T1 (de) 2006-02-16 2007-02-13 Druckempfindliches klebeband

Country Status (8)

Country Link
US (1) US20070190318A1 (de)
EP (1) EP1820834B1 (de)
JP (1) JP4799205B2 (de)
KR (1) KR101058826B1 (de)
CN (1) CN101245152B (de)
AT (1) ATE406425T1 (de)
DE (1) DE602007000090D1 (de)
TW (1) TWI391462B (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150235A (ja) * 2003-11-12 2005-06-09 Three M Innovative Properties Co 半導体表面保護シート及び方法
JP2008060151A (ja) * 2006-08-29 2008-03-13 Nitto Denko Corp 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート
JP5008999B2 (ja) * 2007-02-06 2012-08-22 リンテック株式会社 ダイシングテープおよび半導体装置の製造方法
EP2033998B1 (de) 2007-09-06 2010-11-10 Nitto Denko Corporation Druckempfindliche Klebstoffzusammensetzung, Produkt damit und Anzeige mit dem Produkt
JP2009064975A (ja) * 2007-09-06 2009-03-26 Nitto Denko Corp ダイシング用粘着シート及びダイシング方法
JP4717052B2 (ja) * 2007-11-08 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4717051B2 (ja) * 2007-11-08 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4717086B2 (ja) * 2008-01-18 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4717085B2 (ja) 2008-01-18 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4553400B2 (ja) * 2008-02-18 2010-09-29 日東電工株式会社 ダイシング・ダイボンドフィルム
CN102015943A (zh) * 2008-03-07 2011-04-13 3M创新有限公司 具有图案化背衬的切割带和晶粒附连粘合剂
EP2149900A2 (de) * 2008-08-01 2010-02-03 Nitto Denko Corporation Klebefilm zum Schneiden von Halbleiterchips
JP2010062269A (ja) * 2008-09-02 2010-03-18 Three M Innovative Properties Co ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法
KR100983026B1 (ko) * 2008-12-18 2010-09-17 주식회사 엘지화학 점착제 조성물, 편광판 및 액정표시장치
KR20120094039A (ko) * 2009-11-18 2012-08-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 조립체, 및 그의 제조 및 사용 방법
BR112012011654A2 (pt) 2009-11-18 2020-08-25 3M Innovantive Properties Company filmes opticos de multiplas camadas
JP5743555B2 (ja) * 2010-02-02 2015-07-01 リンテック株式会社 ダイシングシート
KR20120092694A (ko) * 2010-03-31 2012-08-21 후루카와 덴키 고교 가부시키가이샤 반도체 웨이퍼 가공용 점착시트
JP2011216734A (ja) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The 半導体ウエハ加工用粘着シート
JP6045056B2 (ja) * 2010-11-30 2016-12-14 日東電工株式会社 表面保護シート
EP2650912B1 (de) * 2010-12-06 2015-06-24 Kimoto Co., Ltd. Hilfsfolie für laserzerteilung
JP5687897B2 (ja) * 2010-12-28 2015-03-25 日東電工株式会社 放射線硬化型粘着剤組成物及び粘着シート
US20140120293A1 (en) * 2011-12-22 2014-05-01 Mohit Gupta Electrostatic discharge compatible dicing tape with laser scribe capability
JP5687647B2 (ja) * 2012-03-14 2015-03-18 株式会社東芝 半導体装置の製造方法、半導体製造装置
JP5945438B2 (ja) * 2012-03-26 2016-07-05 リンテック株式会社 ダイシングシート
JP5945439B2 (ja) * 2012-03-26 2016-07-05 リンテック株式会社 ダイシングシート
KR101286829B1 (ko) * 2012-05-31 2013-07-17 (주)티엠에스 광학투명접착필름 및 이를 이용한 전자기기
US20150247076A1 (en) * 2012-09-18 2015-09-03 Basf Se Polymers comprising a polyurethane backbone endcapped with reactive (meth)acrylic terminating groups and their use as adhesives
JP6264865B2 (ja) * 2013-11-29 2018-01-24 住友ベークライト株式会社 ダイシングフィルム
JP2016082162A (ja) * 2014-10-21 2016-05-16 株式会社ディスコ ウエーハの加工方法
CN104861887A (zh) * 2015-03-25 2015-08-26 上海东煦电子科技有限公司 活性面贴付用切割膜及切割后被加工物拾取的方法
CN110128958A (zh) * 2018-02-09 2019-08-16 日东电工株式会社 切割带
JP7141924B2 (ja) * 2018-02-09 2022-09-26 日東電工株式会社 ダイシングテープ
JP7404007B2 (ja) * 2019-09-11 2023-12-25 株式会社ディスコ ウエーハの加工方法
JP7689002B2 (ja) * 2021-03-31 2025-06-05 リンテック株式会社 ワーク加工用シート

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5281473A (en) * 1987-07-08 1994-01-25 Furakawa Electric Co., Ltd. Radiation-curable adhesive tape
JPH07120640B2 (ja) * 1987-07-08 1995-12-20 古河電気工業株式会社 半導体用放射線硬化性粘着テ−プ
JP2661951B2 (ja) * 1988-03-31 1997-10-08 古河電気工業株式会社 放射線硬化性粘着テープ
US4826938A (en) * 1988-04-21 1989-05-02 National Starch And Chemical Corporation Substrates coated with pressure sensitive adhesives comprising ethylene vinyl acetate dioctyl maleate polymers
JP4636513B2 (ja) * 1996-05-30 2011-02-23 日東電工株式会社 熱硬化型感圧性接着剤とその接着シ―ト類
JP4446516B2 (ja) 1999-07-09 2010-04-07 日本合成化学工業株式会社 再剥離型粘着剤組成物
JP3340979B2 (ja) * 1999-09-06 2002-11-05 日東電工株式会社 ダイシング用粘着シート
JP3906962B2 (ja) * 2000-08-31 2007-04-18 リンテック株式会社 半導体装置の製造方法
JP2003142433A (ja) * 2001-08-10 2003-05-16 Nitto Denko Corp ダイシング用粘着シートおよびダイシング方法
EP1424377A4 (de) * 2001-08-10 2005-03-23 Nitto Denko Corp Dicing-klebefolie und dicing-verfahren
TWI296279B (en) * 2002-02-27 2008-05-01 Nitto Denko Corp Acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive tape
JP3838637B2 (ja) * 2002-06-10 2006-10-25 日東電工株式会社 ガラス基板ダイシング用粘着シートおよびガラス基板ダイシング方法
KR20050098939A (ko) * 2003-02-14 2005-10-12 애버리 데니슨 코포레이션 건조 페인트 전사 라미네이트의 압출 제조 방법
JP4614416B2 (ja) * 2003-05-29 2011-01-19 日東電工株式会社 半導体チップの製造方法およびダイシング用シート貼付け装置
JP4531355B2 (ja) * 2003-06-25 2010-08-25 日東電工株式会社 ダイシング用粘着シートおよび半導体素子の製造方法
JP2005072140A (ja) * 2003-08-21 2005-03-17 Lintec Corp 半導体装置の製造方法および半導体ウエハ加工装置
JP4443962B2 (ja) * 2004-03-17 2010-03-31 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4358190B2 (ja) * 2005-03-16 2009-11-04 日東電工株式会社 粘着剤組成物、粘着シート類および表面保護フィルム
JP4800778B2 (ja) * 2005-05-16 2011-10-26 日東電工株式会社 ダイシング用粘着シート及びそれを用いた被加工物の加工方法

Also Published As

Publication number Publication date
JP2007220863A (ja) 2007-08-30
EP1820834B1 (de) 2008-08-27
KR101058826B1 (ko) 2011-08-23
CN101245152A (zh) 2008-08-20
TW200740950A (en) 2007-11-01
KR20070082556A (ko) 2007-08-21
US20070190318A1 (en) 2007-08-16
TWI391462B (zh) 2013-04-01
EP1820834A1 (de) 2007-08-22
CN101245152B (zh) 2011-07-20
JP4799205B2 (ja) 2011-10-26
DE602007000090D1 (de) 2008-10-09

Similar Documents

Publication Publication Date Title
ATE406425T1 (de) Druckempfindliches klebeband
ATE541019T1 (de) Druckempfindliches klebeband
ATE461256T1 (de) Oberflächenschutzfolie
ATE409213T1 (de) Druckempfindliche acrylatklebstoffzusammensetzung und druckempfindliches klebeband
TW200511409A (en) Re-peelable pressure-sensitive adhesive sheet
PL1574557T3 (pl) Przezroczysta dwustronna taśma samoprzylepna lub arkusz samoprzylepny oraz panel dotykowy
MY147687A (en) Wafer-processing tape
EP1582573A3 (de) Druckemfindliche Klebstoffzusammensetzung, druckempfindliche Klebefolie und Oberflächenschutzfolie
TW200732450A (en) Adhesive tape for dicing and die bond
DE602004001796D1 (de) Durch Wärmeeinwirkung wieder abziehbare druckempfindliche doppelseitige Klebefolie, Klebeverfahren von bearbeitetem Material mit der Klebefolie und elektronisches Bauteil
TW200702416A (en) Waterproof and airtight double-sided pressure-sensitive adhesive tape
TW200801155A (en) Pressure-sensitive adhesive sheet and method for processing semiconductor wafer or semiconductor substrate
CN110392942B (zh) Oled面板下部保护膜和包括其的有机发光显示设备
TW200704739A (en) Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
TW200801603A (en) Adhesive optical film, laminated optical film, and image display device
ATE542871T1 (de) Schutzfolien und druckempfindliche haftmittel
ATE527330T1 (de) Druckempfindliches acryl-klebeband oder -folie sowie herstellungsverfahren dafür
ATE492613T1 (de) Bodensubstrat mit einer beschichtung aus einer härtbaren zusammensetzung
RU2009125008A (ru) Съемная клейкая лента
ATE397052T1 (de) Beidseitiges druckempflindliches klebeband und klebeverfahren
EP1591504A4 (de) Haftklebstoffband zum ankleben von wafern daran
EP2133396A4 (de) Verfahren zur beschichtung einer schutzfolie
EP2053108A4 (de) Filmklebemittel, klebefolie und davon gebrauch machende halbleitervorrichtung
WO2008142937A1 (ja) 粘着シート
SG10201804761PA (en) Dicing tape-combined adhesive sheet

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties