ATE408112T1 - Fluidkühlsystem - Google Patents

Fluidkühlsystem

Info

Publication number
ATE408112T1
ATE408112T1 AT05706818T AT05706818T ATE408112T1 AT E408112 T1 ATE408112 T1 AT E408112T1 AT 05706818 T AT05706818 T AT 05706818T AT 05706818 T AT05706818 T AT 05706818T AT E408112 T1 ATE408112 T1 AT E408112T1
Authority
AT
Austria
Prior art keywords
chamber
cooling system
wall
component
fluid cooling
Prior art date
Application number
AT05706818T
Other languages
English (en)
Inventor
Ronald Eisele
Klaus Olesen
Original Assignee
Danfoss Silicon Power Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss Silicon Power Gmbh filed Critical Danfoss Silicon Power Gmbh
Application granted granted Critical
Publication of ATE408112T1 publication Critical patent/ATE408112T1/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/0265—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box
    • F28F9/0268—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box in the form of multiple deflectors for channeling the heat exchange medium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
AT05706818T 2004-03-11 2005-03-09 Fluidkühlsystem ATE408112T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DKPA200400393 2004-03-11

Publications (1)

Publication Number Publication Date
ATE408112T1 true ATE408112T1 (de) 2008-09-15

Family

ID=34961755

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05706818T ATE408112T1 (de) 2004-03-11 2005-03-09 Fluidkühlsystem

Country Status (5)

Country Link
US (1) US8490681B2 (de)
EP (1) EP1738128B1 (de)
AT (1) ATE408112T1 (de)
DE (1) DE602005009689D1 (de)
WO (1) WO2005088222A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1882893A3 (de) * 2006-07-26 2013-05-01 Furukawa-Sky Aluminum Corporation Wärmetauscher
US8472193B2 (en) 2008-07-04 2013-06-25 Kabushiki Kaisha Toyota Jidoshokki Semiconductor device
DE102011084000A1 (de) * 2010-11-30 2012-05-31 Behr Gmbh & Co. Kg Vorrichtung zum Führen eines Kühlfluids und Kühlsystem zum Kühlen einer elektrischen Komponente
EP2719985B1 (de) * 2012-10-09 2015-08-26 Danfoss Silicon Power GmbH Durchflussverteilungsmodul mit einer gemusterten Deckplatte
DE102014200832A1 (de) * 2014-01-17 2015-07-23 Siemens Aktiengesellschaft Flexibler Kühlkörper für unebene Kühlflächen
US20150243428A1 (en) * 2014-02-21 2015-08-27 Varentec, Inc. Methods and systems of field upgradeable transformers
EP3147940A1 (de) * 2015-09-22 2017-03-29 Siemens Aktiengesellschaft Kühlkörper
DE102016200156A1 (de) * 2016-01-08 2017-07-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Kühlelement für mindestens einen mit elektronischen und/oder elektrischen Bauelementen bestückten Träger
DE102017101126B4 (de) * 2017-01-20 2021-08-19 Danfoss Silicon Power Gmbh Leistungselektroniksystem und Verfahren zu dessen Herstellung
US10533809B1 (en) 2018-07-06 2020-01-14 Keysight Technologies, Inc. Cooling apparatus and methods of use
DE102019211019A1 (de) * 2019-07-25 2021-01-28 Zf Friedrichshafen Ag Fluidkühlung für eine elektrische Baugruppe
US12495515B2 (en) * 2022-03-04 2025-12-09 Aavid Thermalloy, Llc Liquid cooled heat exchanger
DE102023212951A1 (de) * 2023-12-19 2025-06-26 Schaeffler Technologies AG & Co. KG Leistungselektronikeinrichtung mit Kühlung, Inverter

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4072188A (en) 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
US4166665A (en) 1976-12-27 1979-09-04 Cutchaw John M Liquid cooled connector for large scale integrated circuit packages
US4938279A (en) 1988-02-05 1990-07-03 Hughes Aircraft Company Flexible membrane heat sink
JP2728518B2 (ja) 1988-09-26 1998-03-18 株式会社日立製作所 電子デバイスの冷却装置
US4933747A (en) 1989-03-27 1990-06-12 Motorola Inc. Interconnect and cooling system for a semiconductor device
JPH0612795B2 (ja) 1989-11-07 1994-02-16 株式会社日立製作所 マルチチップモジュールの冷却構造
US5079619A (en) * 1990-07-13 1992-01-07 Sun Microsystems, Inc. Apparatus for cooling compact arrays of electronic circuitry
US5046552A (en) * 1990-07-20 1991-09-10 Minnesota Mining And Manufacturing Flow-through heat transfer apparatus with movable thermal via
US5294830A (en) 1991-05-21 1994-03-15 International Business Machines Corporation Apparatus for indirect impingement cooling of integrated circuit chips
US5205348A (en) 1991-05-31 1993-04-27 Minnesota Mining And Manufacturing Company Semi-rigid heat transfer devices
US6159297A (en) * 1996-04-25 2000-12-12 Applied Materials, Inc. Semiconductor process chamber and processing method
US6420622B1 (en) * 1997-08-01 2002-07-16 3M Innovative Properties Company Medical article having fluid control film
DE19964055B4 (de) 1999-12-30 2005-03-24 DRS Broadcast Technology, Inc., Dallas Anordnung zur Abführung von Verlustwärme
US7134484B2 (en) * 2000-12-07 2006-11-14 International Business Machines Corporation Increased efficiency in liquid and gaseous planar device cooling technology
DK174881B1 (da) 2002-05-08 2004-01-19 Danfoss Silicon Power Gmbh Anordning med flere køleceller til køling af halvledere
US7007741B2 (en) * 2002-10-18 2006-03-07 Sun Microsystems, Inc. Conformal heat spreader
US7032651B2 (en) * 2003-06-23 2006-04-25 Raytheon Company Heat exchanger

Also Published As

Publication number Publication date
US20070215332A1 (en) 2007-09-20
EP1738128B1 (de) 2008-09-10
DE602005009689D1 (de) 2008-10-23
EP1738128A1 (de) 2007-01-03
WO2005088222A1 (en) 2005-09-22
US8490681B2 (en) 2013-07-23

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Legal Events

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