ATE408241T1 - Elektronische einrichtung - Google Patents

Elektronische einrichtung

Info

Publication number
ATE408241T1
ATE408241T1 AT04806599T AT04806599T ATE408241T1 AT E408241 T1 ATE408241 T1 AT E408241T1 AT 04806599 T AT04806599 T AT 04806599T AT 04806599 T AT04806599 T AT 04806599T AT E408241 T1 ATE408241 T1 AT E408241T1
Authority
AT
Austria
Prior art keywords
electrode
substrate
mems
movable
gap
Prior art date
Application number
AT04806599T
Other languages
English (en)
Inventor
Mareike Klee
Theodoor Rijks
Pieter Lok
Ruediger Mauczok
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE408241T1 publication Critical patent/ATE408241T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
    • H01G5/16—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes
    • H01G5/18—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes due to change in inclination, e.g. by flexing, by spiral wrapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
    • H01G5/40—Structural combinations of variable capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H57/00—Electrostrictive relays; Piezoelectric relays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2041—Beam type
    • H10N30/2042—Cantilevers, i.e. having one fixed end
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H57/00—Electrostrictive relays; Piezoelectric relays
    • H01H2057/006—Micromechanical piezoelectric relay

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Liquid Crystal Substances (AREA)
  • Glass Compositions (AREA)
AT04806599T 2003-12-22 2004-12-20 Elektronische einrichtung ATE408241T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03104892 2003-12-22

Publications (1)

Publication Number Publication Date
ATE408241T1 true ATE408241T1 (de) 2008-09-15

Family

ID=34717223

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04806599T ATE408241T1 (de) 2003-12-22 2004-12-20 Elektronische einrichtung

Country Status (7)

Country Link
US (1) US7345404B2 (de)
EP (1) EP1726048B1 (de)
JP (1) JP2007515306A (de)
CN (1) CN1898814B (de)
AT (1) ATE408241T1 (de)
DE (1) DE602004016569D1 (de)
WO (1) WO2005064701A2 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2382419B (en) * 2001-11-22 2005-12-14 Hewlett Packard Co Apparatus and method for creating a trusted environment
US7656071B2 (en) * 2002-10-21 2010-02-02 Hrl Laboratories, Llc Piezoelectric actuator for tunable electronic components
US7085121B2 (en) 2002-10-21 2006-08-01 Hrl Laboratories, Llc Variable capacitance membrane actuator for wide band tuning of microstrip resonators and filters
US7098577B2 (en) * 2002-10-21 2006-08-29 Hrl Laboratories, Llc Piezoelectric switch for tunable electronic components
JP2007515306A (ja) 2003-12-22 2007-06-14 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 電子装置
CN1898762A (zh) * 2003-12-22 2007-01-17 皇家飞利浦电子股份有限公司 配有一个用压电材料制成的微电子机械开关的电子装置
JP4580826B2 (ja) * 2005-06-17 2010-11-17 株式会社東芝 マイクロメカニカルデバイス、マイクロスイッチ、容量可変キャパシタ、高周波回路及び光学スイッチ
KR20070081321A (ko) * 2006-02-10 2007-08-16 삼성전자주식회사 모놀리식 ｒｆ 회로 및 이의 제조 방법
JP2008238330A (ja) * 2007-03-27 2008-10-09 Toshiba Corp Ｍｅｍｓ装置およびこのｍｅｍｓ装置を有する携帯通信端末
US7830066B2 (en) * 2007-07-26 2010-11-09 Freescale Semiconductor, Inc. Micromechanical device with piezoelectric and electrostatic actuation and method therefor
JP2009055683A (ja) * 2007-08-24 2009-03-12 Toshiba Corp 圧電駆動型ｍｅｍｓ装置および携帯端末
WO2009067222A1 (en) * 2007-11-19 2009-05-28 Xcom Wireless, Inc. Microfabricated cantilever slider with asymmetric spring constant
CN102859734B (zh) * 2010-04-23 2014-12-10 株式会社村田制作所 压电致动器以及压电致动器的制造方法
JP5644938B2 (ja) 2011-03-29 2014-12-24 富士通株式会社 電子デバイスとその製造方法
CN106918397B (zh) * 2015-12-28 2019-09-27 中芯国际集成电路制造(上海)有限公司 Mems器件、mems温度传感器及各自的制作方法
US10439581B2 (en) * 2017-03-24 2019-10-08 Zhuhai Crystal Resonance Technologies Co., Ltd. Method for fabricating RF resonators and filters
CN115274365B (zh) * 2022-07-31 2025-05-16 山东云海国创云计算装备产业创新中心有限公司 一种制作mems开关器件的方法、装置、设备及可读介质

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
US3646413A (en) * 1970-09-25 1972-02-29 Avco Corp Piezoelectric-driven variable capacitor
US4675960A (en) * 1985-12-30 1987-06-30 Motorola, Inc. Method of manufacturing an electrically variable piezoelectric hybrid capacitor
US4759823A (en) 1987-06-02 1988-07-26 Krysalis Corporation Method for patterning PLZT thin films
DE3728864A1 (de) * 1987-08-28 1989-03-09 Siemens Ag Kondensatoranordnung
DE8909563U1 (de) * 1989-08-09 1989-10-12 Siemens AG, 1000 Berlin und 8000 München Piezoelektrischer Biegewandler
CN1155123C (zh) * 1996-05-15 2004-06-23 株式会社村田制作所 电子元件
GB2353410B (en) 1999-08-18 2002-04-17 Marconi Electronic Syst Ltd Electrical switches
TW469657B (en) * 2000-11-30 2001-12-21 Ind Tech Res Inst Piezoelectric-actuated adjustable electronic device
US6903491B2 (en) * 2001-04-26 2005-06-07 Matsushita Electric Industrial Co., Ltd. Piezoelectric element, actuator, and inkjet head
JP4100202B2 (ja) * 2002-03-18 2008-06-11 セイコーエプソン株式会社 圧電アクチュエータ、及び、液体噴射ヘッド
KR100485787B1 (ko) * 2002-08-20 2005-04-28 삼성전자주식회사 마이크로 스위치
US7098577B2 (en) * 2002-10-21 2006-08-29 Hrl Laboratories, Llc Piezoelectric switch for tunable electronic components
US7132723B2 (en) * 2002-11-14 2006-11-07 Raytheon Company Micro electro-mechanical system device with piezoelectric thin film actuator
GB0320405D0 (en) * 2003-08-30 2003-10-01 Qinetiq Ltd Micro electromechanical system switch
WO2005059932A1 (de) * 2003-12-18 2005-06-30 Siemens Aktiengesellschaft Kondensator mit veränderbarer kapazität, verfahren zum herstellen des kondensators und verwendung des kondensators
JP2007515306A (ja) 2003-12-22 2007-06-14 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 電子装置
FR2864951B1 (fr) * 2004-01-14 2006-03-31 Suisse Electronique Microtech Dispositif de type microsysteme electromecanique a film mince piezoelectrique
JP4496091B2 (ja) * 2004-02-12 2010-07-07 株式会社東芝 薄膜圧電アクチュエータ
JP4408266B2 (ja) * 2004-04-22 2010-02-03 日本碍子株式会社 マイクロスイッチ及びその製造方法

Also Published As

Publication number Publication date
WO2005064701A8 (en) 2006-10-26
WO2005064701A2 (en) 2005-07-14
JP2007515306A (ja) 2007-06-14
US7345404B2 (en) 2008-03-18
US20070108875A1 (en) 2007-05-17
WO2005064701A3 (en) 2006-03-02
CN1898814A (zh) 2007-01-17
CN1898814B (zh) 2010-08-11
EP1726048A2 (de) 2006-11-29
DE602004016569D1 (de) 2008-10-23
EP1726048B1 (de) 2008-09-10

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