ATE408326T1 - Schaltungsanordnung und herstellungsverfahren - Google Patents

Schaltungsanordnung und herstellungsverfahren

Info

Publication number
ATE408326T1
ATE408326T1 AT04741835T AT04741835T ATE408326T1 AT E408326 T1 ATE408326 T1 AT E408326T1 AT 04741835 T AT04741835 T AT 04741835T AT 04741835 T AT04741835 T AT 04741835T AT E408326 T1 ATE408326 T1 AT E408326T1
Authority
AT
Austria
Prior art keywords
circuit board
production method
circuit arrangement
circuit
gap
Prior art date
Application number
AT04741835T
Other languages
English (en)
Inventor
Reinhold Schmitt
Willibald Konrath
Klaus Scholl
Hailko Schmelcher
Original Assignee
Ericsson Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Ab filed Critical Ericsson Ab
Application granted granted Critical
Publication of ATE408326T1 publication Critical patent/ATE408326T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Burglar Alarm Systems (AREA)
  • Transmitters (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT04741835T 2003-06-18 2004-06-18 Schaltungsanordnung und herstellungsverfahren ATE408326T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2003127767 DE10327767A1 (de) 2003-06-18 2003-06-18 Schaltungsbaugruppe und Herstellungsverfahren dafür

Publications (1)

Publication Number Publication Date
ATE408326T1 true ATE408326T1 (de) 2008-09-15

Family

ID=33495186

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04741835T ATE408326T1 (de) 2003-06-18 2004-06-18 Schaltungsanordnung und herstellungsverfahren

Country Status (6)

Country Link
US (1) US20070274056A1 (de)
EP (1) EP1634486B1 (de)
CN (1) CN1810066A (de)
AT (1) ATE408326T1 (de)
DE (2) DE10327767A1 (de)
WO (1) WO2004114734A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006041610B3 (de) * 2006-09-05 2008-05-08 Harting Mitronics Ag Metallisierte Kunststoffoberfläche und Verfahren zum Bearbeiten von metallisierten Kunststoffoberflächen
US12032791B2 (en) * 2021-05-28 2024-07-09 Qualcomm Incorporated Verification of a user input of a user interface

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4242157A (en) * 1979-04-20 1980-12-30 Rockwell International Corporation Method of assembly of microwave integrated circuits having a structurally continuous ground plane
FR2523397A1 (fr) * 1982-03-08 1983-09-16 Matra Procede de montage de composants electroniques sur un support et produit realisable par le procede
JPH0212988A (ja) * 1988-06-30 1990-01-17 Nec Corp フレキシブルプリント回路の接続方法
JPH03215991A (ja) * 1990-01-20 1991-09-20 Fujitsu General Ltd プリント配線板間の電気的接続構造
DE4118308C2 (de) * 1991-06-04 1994-12-22 Siemens Ag Schaltungsträger für SMD-Bauelemente
JP3157362B2 (ja) * 1993-09-03 2001-04-16 株式会社東芝 半導体装置
JPH07202387A (ja) * 1994-01-06 1995-08-04 Pack Vision:Kk ボール・グリッド・アレイ
DE19729073A1 (de) * 1997-07-08 1999-01-14 Bosch Gmbh Robert Verfahren zur Herstellung einer Klebeverbindung zwischen einem elektronischen Bauelement und einem Trägersubstrat
DE19924994A1 (de) * 1999-05-31 2000-12-21 Tyco Electronics Logistics Ag Intelligentes Leistungsmodul
DE19961116A1 (de) * 1999-12-17 2001-07-05 Siemens Ag Leiterplattenanordnung
DE60043776D1 (de) * 2000-08-16 2010-03-18 Ericsson Ab Verfahren zur Abgabe eines Klebstoffs auf einem Leiterplattenträgerelement und so hergestellte Leiterplatte
DE10160041A1 (de) * 2001-12-06 2003-09-25 Marconi Comm Gmbh Elektronisches Schaltungsmodul und Verfahren zu dessen Montage
US7754976B2 (en) * 2002-04-15 2010-07-13 Hamilton Sundstrand Corporation Compact circuit carrier package

Also Published As

Publication number Publication date
EP1634486B1 (de) 2008-09-10
CN1810066A (zh) 2006-07-26
DE602004016505D1 (de) 2008-10-23
EP1634486A1 (de) 2006-03-15
US20070274056A1 (en) 2007-11-29
DE10327767A1 (de) 2005-01-05
WO2004114734A1 (en) 2004-12-29

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties