ATE409201T1 - Härtbare silikonzusammensetzung und ihre verwendung als klebstoff - Google Patents

Härtbare silikonzusammensetzung und ihre verwendung als klebstoff

Info

Publication number
ATE409201T1
ATE409201T1 AT04807844T AT04807844T ATE409201T1 AT E409201 T1 ATE409201 T1 AT E409201T1 AT 04807844 T AT04807844 T AT 04807844T AT 04807844 T AT04807844 T AT 04807844T AT E409201 T1 ATE409201 T1 AT E409201T1
Authority
AT
Austria
Prior art keywords
silicone composition
curable silicone
adhesive
groups
univalent
Prior art date
Application number
AT04807844T
Other languages
English (en)
Inventor
Yoshitsugu Morita
Minoru Isshiki
Hiroshi Ueki
Hiroji Enami
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE409201T1 publication Critical patent/ATE409201T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AT04807844T 2003-12-26 2004-12-20 Härtbare silikonzusammensetzung und ihre verwendung als klebstoff ATE409201T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003433628 2003-12-26

Publications (1)

Publication Number Publication Date
ATE409201T1 true ATE409201T1 (de) 2008-10-15

Family

ID=34736522

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04807844T ATE409201T1 (de) 2003-12-26 2004-12-20 Härtbare silikonzusammensetzung und ihre verwendung als klebstoff

Country Status (9)

Country Link
US (1) US7863399B2 (de)
EP (1) EP1702938B1 (de)
JP (1) JP5285838B2 (de)
KR (1) KR101159050B1 (de)
CN (1) CN100503681C (de)
AT (1) ATE409201T1 (de)
DE (1) DE602004016776D1 (de)
TW (1) TWI357918B (de)
WO (1) WO2005063843A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8734708B2 (en) * 2007-10-29 2014-05-27 Dow Corning Corporation Polar polydimethysiloxane molds, methods of making the molds, and methods of using the molds for pattern transfer
EP2599835B1 (de) * 2008-06-06 2016-07-20 Koninklijke Philips N.V. Silikon-Gummi Material für Weich-Lithographie
KR101204116B1 (ko) 2011-05-04 2012-11-22 주식회사 엘지화학 경화성 조성물
TW201319170A (zh) 2011-05-25 2013-05-16 Dow Corning 在溶劑顯影期間增強膜保留和黏附之含有環氧官能化矽氧烷寡聚物的環氧官能化的可輻射固化組合物
WO2013077706A1 (ko) * 2011-11-25 2013-05-30 주식회사 엘지화학 경화성 조성물
EP2878634B1 (de) 2012-07-27 2017-10-04 LG Chem, Ltd. Härtbare zusammensetzung
JP2017066364A (ja) * 2015-10-02 2017-04-06 三菱化学株式会社 樹脂組成物
KR102821589B1 (ko) * 2018-06-28 2025-06-18 신에쓰 가가꾸 고교 가부시끼가이샤 실리콘 조성물 및 그것을 사용한 섬유 처리제
CN113736383B (zh) * 2021-08-26 2022-08-12 深圳市明粤科技有限公司 一种有机硅导热粘接胶膜及其制备方法与应用

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60179417A (ja) 1984-02-27 1985-09-13 Shin Etsu Chem Co Ltd 液状シリコ−ンゴム組成物
JP2723348B2 (ja) * 1990-03-23 1998-03-09 三菱電機株式会社 半導体封止用エポキシ樹脂組成物
JP3367964B2 (ja) 1992-04-21 2003-01-20 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
JP3786139B2 (ja) * 1992-05-26 2006-06-14 東レ・ダウコーニング株式会社 硬化性シリコーン組成物
JPH06161740A (ja) * 1992-11-25 1994-06-10 Shinko Seisakusho Co Ltd マイクロプログラム制御装置
JP3339910B2 (ja) * 1993-04-15 2002-10-28 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
JP2812139B2 (ja) * 1993-04-27 1998-10-22 信越化学工業株式会社 エポキシ樹脂組成物
JP2695598B2 (ja) 1993-06-30 1997-12-24 住友ベークライト株式会社 ダイボンディング材
JP3277619B2 (ja) 1993-07-13 2002-04-22 東海ゴム工業株式会社 導電性ロール
JP3035135B2 (ja) 1993-10-25 2000-04-17 住友ベークライト株式会社 ダイボンディング材
JP2834658B2 (ja) * 1993-12-02 1998-12-09 住友ベークライト株式会社 半導体用導電性樹脂ペースト
FR2727119B1 (fr) * 1994-11-18 1997-01-03 Rhone Poulenc Chimie Polyorganosiloxanes fonctionnalises et l'un de leurs procedes de preparation
JP3411164B2 (ja) 1996-10-31 2003-05-26 住友ベークライト株式会社 ダイアタッチペースト
JPH10147764A (ja) 1996-11-20 1998-06-02 Sumitomo Bakelite Co Ltd ダイアタッチペースト及び半導体装置
US5998509A (en) * 1996-11-29 1999-12-07 Kabushiki Kaisha Toshiba Resin composition and semiconductor device employing the same
JP3313292B2 (ja) 1996-12-04 2002-08-12 住友ベークライト株式会社 ダイアタッチペースト
JP3685253B2 (ja) * 2001-02-23 2005-08-17 信越化学工業株式会社 シリコーン変性エポキシ樹脂又はシリコーン変性フェノール樹脂を含有する樹脂組成物、並びにこれを用いた半導体装置
US6706405B2 (en) * 2002-02-11 2004-03-16 Analytical Services & Materials, Inc. Composite coating for imparting particel erosion resistance
TWI345576B (en) * 2003-11-07 2011-07-21 Dow Corning Toray Silicone Curable silicone composition and cured product thereof

Also Published As

Publication number Publication date
CN100503681C (zh) 2009-06-24
TWI357918B (en) 2012-02-11
JPWO2005063843A1 (ja) 2007-07-19
JP5285838B2 (ja) 2013-09-11
US20070282058A1 (en) 2007-12-06
EP1702938A1 (de) 2006-09-20
DE602004016776D1 (de) 2008-11-06
EP1702938A4 (de) 2007-12-19
KR20070004594A (ko) 2007-01-09
KR101159050B1 (ko) 2012-06-22
WO2005063843A1 (ja) 2005-07-14
CN1906226A (zh) 2007-01-31
EP1702938B1 (de) 2008-09-24
TW200526740A (en) 2005-08-16
US7863399B2 (en) 2011-01-04

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