ATE410905T1 - Mehrzonen-keramikheizsystem und verfahren zu seiner herstellung - Google Patents

Mehrzonen-keramikheizsystem und verfahren zu seiner herstellung

Info

Publication number
ATE410905T1
ATE410905T1 AT04711141T AT04711141T ATE410905T1 AT E410905 T1 ATE410905 T1 AT E410905T1 AT 04711141 T AT04711141 T AT 04711141T AT 04711141 T AT04711141 T AT 04711141T AT E410905 T1 ATE410905 T1 AT E410905T1
Authority
AT
Austria
Prior art keywords
sensor arrangement
temperature sensor
heating elements
ceramic heater
heating
Prior art date
Application number
AT04711141T
Other languages
English (en)
Inventor
Hongy Lin
Thomas Laskowski
Jason Smith
Daniel Block
Original Assignee
Watlow Electric Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Watlow Electric Mfg filed Critical Watlow Electric Mfg
Application granted granted Critical
Publication of ATE410905T1 publication Critical patent/ATE410905T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)
  • Tunnel Furnaces (AREA)
  • Drying Of Semiconductors (AREA)
  • Ceramic Products (AREA)
AT04711141T 2003-05-08 2004-02-13 Mehrzonen-keramikheizsystem und verfahren zu seiner herstellung ATE410905T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/431,758 US20040222210A1 (en) 2003-05-08 2003-05-08 Multi-zone ceramic heating system and method of manufacture thereof

Publications (1)

Publication Number Publication Date
ATE410905T1 true ATE410905T1 (de) 2008-10-15

Family

ID=33416519

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04711141T ATE410905T1 (de) 2003-05-08 2004-02-13 Mehrzonen-keramikheizsystem und verfahren zu seiner herstellung

Country Status (6)

Country Link
US (1) US20040222210A1 (de)
EP (1) EP1621048B1 (de)
JP (1) JP4908217B2 (de)
AT (1) ATE410905T1 (de)
DE (1) DE602004016985D1 (de)
WO (1) WO2004102076A2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8206996B2 (en) * 2006-03-28 2012-06-26 Lam Research Corporation Etch tool process indicator method and apparatus
US7951616B2 (en) * 2006-03-28 2011-05-31 Lam Research Corporation Process for wafer temperature verification in etch tools
US7572480B2 (en) * 2006-10-19 2009-08-11 Federal-Mogul World Wide, Inc. Method of fabricating a multilayer ceramic heating element
JP4879060B2 (ja) * 2007-03-26 2012-02-15 日本碍子株式会社 基板加熱装置
US8637794B2 (en) * 2009-10-21 2014-01-28 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing
US8791392B2 (en) 2010-10-22 2014-07-29 Lam Research Corporation Methods of fault detection for multiplexed heater array
US8546732B2 (en) * 2010-11-10 2013-10-01 Lam Research Corporation Heating plate with planar heater zones for semiconductor processing
EP2820915B1 (de) * 2012-02-27 2017-01-04 Watlow Electric Manufacturing Company Temperaturerfassungs- und -steuersystem für geschichtete heizgeräte
DE102012101717A1 (de) * 2012-03-01 2013-09-05 Aixtron Se Verfahren und Vorrichtung zur Regelung der Oberflächentemperatur eines Suszeptors einer Substratbeschichtungseinrichtung
US9224626B2 (en) * 2012-07-03 2015-12-29 Watlow Electric Manufacturing Company Composite substrate for layered heaters
DE102012111458B4 (de) * 2012-11-27 2022-12-08 Tdk Electronics Ag Halbleitervorrichtung
CN104131268B (zh) * 2013-05-03 2017-02-08 北京北方微电子基地设备工艺研究中心有限责任公司 分区域加热方法、装置和半导体设备
JP6084906B2 (ja) * 2013-07-11 2017-02-22 日本碍子株式会社 セラミックヒータ
CN103874243B (zh) * 2014-03-27 2016-06-01 福建闽航电子有限公司 一种带温控的陶瓷发热片
WO2017127163A1 (en) * 2016-01-22 2017-07-27 Applied Materials, Inc. Ceramic showerhead with embedded conductive layers
JP6758143B2 (ja) * 2016-09-29 2020-09-23 日本特殊陶業株式会社 加熱装置
US10679873B2 (en) * 2016-09-30 2020-06-09 Ngk Spark Plug Co., Ltd. Ceramic heater
US10796935B2 (en) * 2017-03-17 2020-10-06 Applied Materials, Inc. Electronic device manufacturing systems, methods, and apparatus for heating substrates and reducing contamination in loadlocks
GB2562075B (en) * 2017-05-03 2022-03-16 Jemella Ltd Barrel for hair styling appliance
US20210159102A1 (en) * 2019-11-26 2021-05-27 Tokyo Electron Limited THERMAL TREATMENTS USING A PLURALITY OF EMBEDDED RESISTANCE TEMPERATURE DETECTORS (RTDs)
US20230245905A1 (en) * 2022-01-31 2023-08-03 Asm Ip Holding B.V. Multi-zone laminate heater plate
CN116321548A (zh) * 2023-03-14 2023-06-23 盐城莱尔电热科技有限公司 一种高耐久氮化硅陶瓷加热器

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US166854A (en) * 1875-08-17 Improvement in vehicle fifth-wheels
US134775A (en) * 1873-01-14 Improvement in transplanters
US2938103A (en) * 1958-04-11 1960-05-24 Electrofilm Inc Thermostat-carrying electrical heating materials for surface application
US3789190A (en) * 1972-10-17 1974-01-29 A J Matlen Temperature regulation for electrical heater
US3813520A (en) * 1973-03-28 1974-05-28 Corning Glass Works Electric heating unit
US4549073A (en) * 1981-11-06 1985-10-22 Oximetrix, Inc. Current controller for resistive heating element
JPH0719645B2 (ja) * 1984-09-07 1995-03-06 日本電装株式会社 自己温度制御型発熱装置
JPS6183825A (ja) * 1984-10-02 1986-04-28 Babcock Hitachi Kk バ−ナ点火装置
GB8514785D0 (en) * 1985-06-11 1985-07-10 Micropore International Ltd Infra-red heaters
US4640224A (en) * 1985-08-05 1987-02-03 Spectrum Cvd, Inc. CVD heat source
US4607591A (en) * 1985-08-06 1986-08-26 Spectrum Cvd, Inc. CVD heater control circuit
JPH0617272B2 (ja) * 1986-02-12 1994-03-09 株式会社日本自動車部品総合研究所 窒化珪素−アルミナ系複合セラミツクスおよびその製造方法
US4778559A (en) * 1986-10-15 1988-10-18 Advantage Production Technology Semiconductor substrate heater and reactor process and apparatus
US4937435A (en) * 1987-12-14 1990-06-26 Thermon Manufacturing Company Flexible electric heating pad using PTC ceramic thermistor chip heating elements
US5001423A (en) * 1990-01-24 1991-03-19 International Business Machines Corporation Dry interface thermal chuck temperature control system for semiconductor wafer testing
JPH0628258B2 (ja) * 1990-07-20 1994-04-13 日本碍子株式会社 半導体ウエハー加熱装置及びその製造方法
US5134248A (en) * 1990-08-15 1992-07-28 Advanced Temperature Devices, Inc. Thin film flexible electrical connector
GB9020400D0 (en) * 1990-09-19 1990-10-31 Raychem Sa Nv Electrical heating tape
DE69130205T2 (de) * 1990-12-25 1999-03-25 Ngk Insulators, Ltd., Nagoya, Aichi Heizungsapparat für eine Halbleiterscheibe und Verfahren zum Herstellen desselben
US5264681A (en) * 1991-02-14 1993-11-23 Ngk Spark Plug Co., Ltd. Ceramic heater
US5436172A (en) * 1991-05-20 1995-07-25 Texas Instruments Incorporated Real-time multi-zone semiconductor wafer temperature and process uniformity control system
DE4130337C2 (de) * 1991-09-12 2002-05-02 Ego Elektro Blanc & Fischer Verfahren zum Betrieb einer elektrischen Heizeinheit und elektrische Heizeinheit
FR2682253A1 (fr) * 1991-10-07 1993-04-09 Commissariat Energie Atomique Sole chauffante destinee a assurer le chauffage d'un objet dispose a sa surface et reacteur de traitement chimique muni de ladite sole.
US5268989A (en) * 1992-04-16 1993-12-07 Texas Instruments Incorporated Multi zone illuminator with embeded process control sensors and light interference elimination circuit
US5783805A (en) * 1992-06-05 1998-07-21 Katzmann; Fred L. Electrothermal conversion elements, apparatus and methods for use in comparing, calibrating and measuring electrical signals
JP2828575B2 (ja) * 1993-11-12 1998-11-25 京セラ株式会社 窒化珪素質セラミックヒータ
JPH08274147A (ja) * 1995-03-30 1996-10-18 Kyocera Corp ウェハ保持装置
US6133557A (en) * 1995-01-31 2000-10-17 Kyocera Corporation Wafer holding member
US5715361A (en) * 1995-04-13 1998-02-03 Cvc Products, Inc. Rapid thermal processing high-performance multizone illuminator for wafer backside heating
US5830277A (en) * 1995-05-26 1998-11-03 Mattson Technology, Inc. Thermal processing system with supplemental resistive heater and shielded optical pyrometry
US5881208A (en) * 1995-12-20 1999-03-09 Sematech, Inc. Heater and temperature sensor array for rapid thermal processing thermal core
KR100280634B1 (ko) * 1996-05-05 2001-02-01 세이이치로 미야타 전기 발열체 및 이를 이용한 정전 척
US5885353A (en) * 1996-06-21 1999-03-23 Micron Technology, Inc. Thermal conditioning apparatus
US6066836A (en) * 1996-09-23 2000-05-23 Applied Materials, Inc. High temperature resistive heater for a process chamber
US6121061A (en) * 1997-11-03 2000-09-19 Asm America, Inc. Method of processing wafers with low mass support
JPH11214127A (ja) * 1998-01-21 1999-08-06 Riken Corp ヒーター装置及びその製造方法
US5970214A (en) * 1998-05-14 1999-10-19 Ag Associates Heating device for semiconductor wafers
JP2000058237A (ja) * 1998-06-05 2000-02-25 Ngk Spark Plug Co Ltd セラミックヒ―タ及びそれを用いた酸素センサ
JP3764278B2 (ja) * 1998-07-13 2006-04-05 株式会社東芝 基板加熱装置、基板加熱方法及び基板処理方法
JP3892609B2 (ja) * 1999-02-16 2007-03-14 株式会社東芝 ホットプレートおよび半導体装置の製造方法
US6469283B1 (en) * 1999-03-04 2002-10-22 Applied Materials, Inc. Method and apparatus for reducing thermal gradients within a substrate support
US6231933B1 (en) * 1999-03-18 2001-05-15 Primaxx, Inc. Method and apparatus for metal oxide chemical vapor deposition on a substrate surface
US6191394B1 (en) * 1999-05-19 2001-02-20 Tokyo Electron Ltd. Heat treating apparatus
JP3228923B2 (ja) * 2000-01-18 2001-11-12 イビデン株式会社 半導体製造・検査装置用セラミックヒータ
JP4028149B2 (ja) * 2000-02-03 2007-12-26 日本碍子株式会社 加熱装置
EP1204299A1 (de) * 2000-04-29 2002-05-08 Ibiden Co., Ltd. Keramisches heizelement und verfahren zur regelung der temperatur des heizelement.
JPWO2002084717A1 (ja) * 2001-04-11 2004-08-05 イビデン株式会社 半導体製造・検査装置用セラミックヒータ
EP1391140B1 (de) * 2001-04-30 2012-10-10 Lam Research Corporation Verfahren und Vorrichtung zur Regelung der räumlichen Temperaturverteilung über die Oberfläche eines Arbeitsstückträgers hinweg
DE10125350A1 (de) * 2001-05-23 2002-11-28 Linde Ag Vorrichtung zur Kühlung von Bauteilen mittels Hydraulikflüssigkeit aus einem hydraulischen Kreislauf
US6529686B2 (en) * 2001-06-06 2003-03-04 Fsi International, Inc. Heating member for combination heating and chilling apparatus, and methods
JP3888531B2 (ja) * 2002-03-27 2007-03-07 日本碍子株式会社 セラミックヒーター、セラミックヒーターの製造方法、および金属部材の埋設品
JP4136696B2 (ja) * 2003-02-12 2008-08-20 キヤノン株式会社 画像形成装置および画像形成方法

Also Published As

Publication number Publication date
DE602004016985D1 (de) 2008-11-20
US20040222210A1 (en) 2004-11-11
EP1621048A4 (de) 2007-04-11
JP4908217B2 (ja) 2012-04-04
EP1621048A2 (de) 2006-02-01
WO2004102076A3 (en) 2005-06-16
JP2007515778A (ja) 2007-06-14
EP1621048B1 (de) 2008-10-08
WO2004102076A2 (en) 2004-11-25

Similar Documents

Publication Publication Date Title
ATE410905T1 (de) Mehrzonen-keramikheizsystem und verfahren zu seiner herstellung
WO2008120469A1 (ja) 炭化珪素半導体素子の製造方法
EP1122982B1 (de) Heizungsgerät
DE602005025976D1 (de) Herstellungsverfahren für ein siliziumcarbidhalbleiterbauelement
US7126092B2 (en) Heater for wafer processing and methods of operating and manufacturing the same
TW200717753A (en) Cladding material and its fabrication method, method for molding cladding material, and heat sink using cladding material
WO2007130398A3 (en) Power terminals for ceramic heater and method of making the same
SG159470A1 (en) Ceramic heater, method of manufacturing the same, and apparatus for forming a thin layer having the same
WO2008142568A3 (en) Thermally insulating ceramic substrates for gas sensors
TW200723370A (en) Multi-zone resistive heater
WO2009075124A1 (ja) 半導体装置の製造方法および半導体装置
TWI249187B (en) Rapid temperature compensation module for semiconductor tool
JP2003317906A (ja) セラミックスヒータ
US20180122624A1 (en) System and method for plasma head thermal control
DK1605238T3 (da) Elektronisk varmefordelingsmåler
ATE473424T1 (de) Füllstandssensor und zugehöriges betriebs-und herstellungsverfahren sowie entsprechende verwendung
MXPA04000132A (es) Calentador de pelicula gruesa integrado con componentes de baja temperatura y metodo de fabricacion del mismo.
ATE470234T1 (de) Infrarotes licht emittierendes bauelement und gassensor damit
WO2009020023A1 (ja) 出力調整方法、シリコンエピタキシャルウェーハの製造方法、及びサセプタ
TW200746875A (en) Thermal chuck and processes for manufacturing the thermal chuck
WO2005027575A3 (en) Method of microwave processing ceramics and microwave hybrid heating system for same
DK1762157T3 (da) Böjeligt varmeapparat
DE10083600D2 (de) Siliziumcarbid-Element
JP2004157989A (ja) 温度制御装置及び処理装置
JP2010141060A5 (de)

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties