ATE414274T1 - Verfahren und gerät zur schnellen on-line und elektro-optischen defekterkennung an wafern - Google Patents

Verfahren und gerät zur schnellen on-line und elektro-optischen defekterkennung an wafern

Info

Publication number
ATE414274T1
ATE414274T1 AT03250255T AT03250255T ATE414274T1 AT E414274 T1 ATE414274 T1 AT E414274T1 AT 03250255 T AT03250255 T AT 03250255T AT 03250255 T AT03250255 T AT 03250255T AT E414274 T1 ATE414274 T1 AT E414274T1
Authority
AT
Austria
Prior art keywords
wafer
view
ccd matrix
image
electro
Prior art date
Application number
AT03250255T
Other languages
English (en)
Inventor
Gad Neumann
Original Assignee
Negevtech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Negevtech Ltd filed Critical Negevtech Ltd
Application granted granted Critical
Publication of ATE414274T1 publication Critical patent/ATE414274T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AT03250255T 2003-01-15 2003-01-15 Verfahren und gerät zur schnellen on-line und elektro-optischen defekterkennung an wafern ATE414274T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03250255A EP1439385B1 (de) 2003-01-15 2003-01-15 Verfahren und Gerät zur schnellen on-line und elektro-optischen Defekterkennung an Wafern

Publications (1)

Publication Number Publication Date
ATE414274T1 true ATE414274T1 (de) 2008-11-15

Family

ID=32524244

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03250255T ATE414274T1 (de) 2003-01-15 2003-01-15 Verfahren und gerät zur schnellen on-line und elektro-optischen defekterkennung an wafern

Country Status (3)

Country Link
EP (1) EP1439385B1 (de)
AT (1) ATE414274T1 (de)
DE (1) DE60324656D1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8038897B2 (en) * 2007-02-06 2011-10-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for wafer inspection
DE102008025062B4 (de) * 2008-05-26 2016-07-28 Airbus Defence and Space GmbH Stroboskopisches Messvorrichtung und Verfahren hierzu
CN102053093A (zh) * 2010-11-08 2011-05-11 北京大学深圳研究生院 一种晶圆表面切割芯片的表面缺陷检测方法
JP6154291B2 (ja) * 2013-11-01 2017-06-28 浜松ホトニクス株式会社 画像取得装置及び画像取得装置の画像取得方法
JP6134249B2 (ja) 2013-11-01 2017-05-24 浜松ホトニクス株式会社 画像取得装置及び画像取得装置の画像取得方法
CN111855663B (zh) * 2019-04-30 2023-06-27 芯恩（青岛）集成电路有限公司 一种检测晶圆缺陷的设备和方法
CA3187935A1 (en) * 2020-11-06 2022-05-12 Illumina, Inc. Apparatus and method of obtaining an image of a sample in motion
CN116087731B (zh) * 2021-12-31 2025-12-19 杭州广立微电子股份有限公司 一种用于芯片分析的器件选择方法及系统
CN115078402B (zh) * 2022-06-15 2025-02-11 西安奕斯伟材料科技股份有限公司 一种用于检测硅片的系统

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4760265A (en) * 1986-01-18 1988-07-26 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Method and device for detecting defects of patterns in microelectronic devices
US4734923A (en) * 1986-05-19 1988-03-29 Hampshire Instruments, Inc Lithographic system mask inspection device
JP2908099B2 (ja) * 1992-01-17 1999-06-21 キヤノン株式会社 基板の位置合わせ方法
US5298963A (en) * 1992-02-26 1994-03-29 Mitsui Mining & Smelting Co., Ltd. Apparatus for inspecting the surface of materials
JPH08154210A (ja) * 1994-11-28 1996-06-11 Kubota Corp 撮像装置
JPH08292361A (ja) * 1995-04-24 1996-11-05 Olympus Optical Co Ltd プリズム固定装置
JP3647608B2 (ja) * 1997-06-20 2005-05-18 株式会社ソキア 測量機の自動追尾装置
WO2000070332A1 (en) * 1999-05-18 2000-11-23 Applied Materials, Inc. Method of and apparatus for inspection of articles by comparison with a master
US6369888B1 (en) * 1999-11-17 2002-04-09 Applied Materials, Inc. Method and apparatus for article inspection including speckle reduction
JP4131899B2 (ja) * 2000-09-28 2008-08-13 株式会社東芝 パターン検査装置

Also Published As

Publication number Publication date
DE60324656D1 (de) 2008-12-24
EP1439385A1 (de) 2004-07-21
EP1439385B1 (de) 2008-11-12

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