ATE416410T1 - Vorrichtung und verfahren zum regeln der temperatur in einem einspannsystem - Google Patents

Vorrichtung und verfahren zum regeln der temperatur in einem einspannsystem

Info

Publication number
ATE416410T1
ATE416410T1 AT06736186T AT06736186T ATE416410T1 AT E416410 T1 ATE416410 T1 AT E416410T1 AT 06736186 T AT06736186 T AT 06736186T AT 06736186 T AT06736186 T AT 06736186T AT E416410 T1 ATE416410 T1 AT E416410T1
Authority
AT
Austria
Prior art keywords
temperature
air
fluid
controlling
chuck
Prior art date
Application number
AT06736186T
Other languages
English (en)
Inventor
Norbert Elsdoerfer
Olga Mikulina
Abdellah Mourchid
Original Assignee
Temptronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Temptronic Corp filed Critical Temptronic Corp
Application granted granted Critical
Publication of ATE416410T1 publication Critical patent/ATE416410T1/de

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1919—Control of temperature characterised by the use of electric means characterised by the type of controller
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Control Of Temperature (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Physical Vapour Deposition (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AT06736186T 2005-03-04 2006-02-27 Vorrichtung und verfahren zum regeln der temperatur in einem einspannsystem ATE416410T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65845205P 2005-03-04 2005-03-04
US66968505P 2005-04-08 2005-04-08

Publications (1)

Publication Number Publication Date
ATE416410T1 true ATE416410T1 (de) 2008-12-15

Family

ID=36686031

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06736186T ATE416410T1 (de) 2005-03-04 2006-02-27 Vorrichtung und verfahren zum regeln der temperatur in einem einspannsystem

Country Status (7)

Country Link
US (3) US20060196653A1 (de)
EP (1) EP1861759B1 (de)
JP (1) JP2008537322A (de)
AT (1) ATE416410T1 (de)
DE (1) DE602006004018D1 (de)
TW (1) TW200707149A (de)
WO (1) WO2006096361A2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI339737B (en) 2005-04-27 2011-04-01 Aehr Test Systems Contactor assembly, cartridge, and apparatus and method for testing integrated circuit of device
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
US7848840B2 (en) * 2008-01-04 2010-12-07 Applied Materials, Inc. Method of controlling process parameters for semiconductor manufacturing apparatus
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
TWI402644B (zh) * 2010-01-15 2013-07-21 Moxa Inc 溫度增益控制裝置及其方法
US9335080B2 (en) * 2011-10-17 2016-05-10 Temptronic Corporation Temperature system having an impurity filter
US20140167795A1 (en) * 2012-12-14 2014-06-19 Texas Instruments Incorporated Active feedback silicon failure analysis die temperature control system
US12255123B2 (en) 2015-09-30 2025-03-18 Microfabrica Inc. Micro heat transfer arrays, micro cold plates, and thermal management systems for semiconductor devices, and methods for using and making such arrays, plates, and systems
KR102842851B1 (ko) 2016-01-08 2025-08-05 에어 테스트 시스템즈 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
US20170248973A1 (en) * 2016-02-29 2017-08-31 Cascade Microtech, Inc. Probe systems and methods including active environmental control
KR20250126857A (ko) 2017-03-03 2025-08-25 에어 테스트 시스템즈 카트리지, 테스트 피스 및 하나 이상의 전자 디바이스들을 테스팅하는 방법
JP7132484B2 (ja) * 2018-03-22 2022-09-07 株式会社東京精密 プローバの冷却システム
KR102639158B1 (ko) * 2019-07-23 2024-02-22 삼성전자주식회사 웨이퍼 처리 장치 및 이를 이용한 웨이퍼 처리 방법
JP7667260B2 (ja) 2020-10-07 2025-04-22 エイアー テスト システムズ 電子試験器
KR102804411B1 (ko) * 2022-10-13 2025-05-07 세메스 주식회사 기판 처리 장치 및 기판 온도 제어 방법
CN121114724A (zh) 2022-12-30 2025-12-12 雅赫测试系统公司 电子测试器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3710251A (en) * 1971-04-07 1973-01-09 Collins Radio Co Microelectric heat exchanger pedestal
US4056708A (en) * 1975-07-22 1977-11-01 Baxter Travenol Laboratories, Inc. Digital temperature controller
US4547977A (en) * 1984-05-21 1985-10-22 The Virtis Company, Inc. Freeze dryer with improved temperature control
US5205132A (en) * 1992-06-12 1993-04-27 Thermonics Incorporated Computer-implemented method and system for precise temperature control of a device under test
US5977785A (en) * 1996-05-28 1999-11-02 Burward-Hoy; Trevor Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment
US6866094B2 (en) * 1997-12-31 2005-03-15 Temptronic Corporation Temperature-controlled chuck with recovery of circulating temperature control fluid
KR100681981B1 (ko) * 1998-07-14 2007-02-15 델타 디자인, 인코포레이티드 전자소자들에 대해 액체기반, 광역, 고속응답하는 온도순환 제어를 하는 장치, 방법 및 시스템
US6076803A (en) * 1999-03-12 2000-06-20 Snap-Tite Technologies, Inc. Axial flow solenoid valve
JP2004505443A (ja) * 2000-07-10 2004-02-19 テンプトロニック　コーポレイション 交互配置された加熱および冷却要素と交換可能な上面アセンブリと硬膜層表面とをもつ熱プレートを有するウェーハチャック
US6771086B2 (en) * 2002-02-19 2004-08-03 Lucas/Signatone Corporation Semiconductor wafer electrical testing with a mobile chiller plate for rapid and precise test temperature control

Also Published As

Publication number Publication date
US20060196653A1 (en) 2006-09-07
EP1861759A2 (de) 2007-12-05
US20080188990A1 (en) 2008-08-07
JP2008537322A (ja) 2008-09-11
EP1861759B1 (de) 2008-12-03
TW200707149A (en) 2007-02-16
WO2006096361A2 (en) 2006-09-14
US20080231304A1 (en) 2008-09-25
DE602006004018D1 (de) 2009-01-15
WO2006096361A3 (en) 2007-04-19

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Legal Events

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