ATE419645T1 - Vorrichtung zum transport von scheibenförmigen gegenständen - Google Patents
Vorrichtung zum transport von scheibenförmigen gegenständenInfo
- Publication number
- ATE419645T1 ATE419645T1 AT03785610T AT03785610T ATE419645T1 AT E419645 T1 ATE419645 T1 AT E419645T1 AT 03785610 T AT03785610 T AT 03785610T AT 03785610 T AT03785610 T AT 03785610T AT E419645 T1 ATE419645 T1 AT E419645T1
- Authority
- AT
- Austria
- Prior art keywords
- wafer
- shaped article
- holding
- cassette
- unit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
- H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/38—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations with angular orientation of workpieces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Automatic Disk Changers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT15652002 | 2002-10-16 | ||
| EP03785610A EP1554748B1 (de) | 2002-10-16 | 2003-10-09 | Vorrichtung zum transport von scheibenförmigen gegenständen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE419645T1 true ATE419645T1 (de) | 2009-01-15 |
Family
ID=32097256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03785610T ATE419645T1 (de) | 2002-10-16 | 2003-10-09 | Vorrichtung zum transport von scheibenförmigen gegenständen |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7270510B2 (de) |
| EP (1) | EP1554748B1 (de) |
| JP (2) | JP4986399B2 (de) |
| KR (2) | KR101028782B1 (de) |
| CN (1) | CN100369185C (de) |
| AT (1) | ATE419645T1 (de) |
| AU (1) | AU2003294674A1 (de) |
| DE (1) | DE60325626D1 (de) |
| TW (1) | TWI262165B (de) |
| WO (1) | WO2004036628A2 (de) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101024789B1 (ko) | 2003-12-03 | 2011-03-24 | 주식회사 하이닉스반도체 | 반도체소자의 트랜지스터 형성방법 |
| US7371022B2 (en) | 2004-12-22 | 2008-05-13 | Sokudo Co., Ltd. | Developer endpoint detection in a track lithography system |
| US7798764B2 (en) * | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
| KR101075053B1 (ko) * | 2006-02-22 | 2011-10-21 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판처리장치, 기판반송장치, 기판파지장치, 및 약액처리장치 |
| US7901539B2 (en) * | 2006-09-19 | 2011-03-08 | Intevac, Inc. | Apparatus and methods for transporting and processing substrates |
| DE102006049488A1 (de) * | 2006-10-17 | 2008-04-30 | Höllmüller Maschinenbau GmbH | Vorrichtung zum Behandeln von flachen, zerbrechlichen Substraten |
| JP4726776B2 (ja) | 2006-12-27 | 2011-07-20 | 大日本スクリーン製造株式会社 | 反転装置およびそれを備えた基板処理装置 |
| JP4744426B2 (ja) * | 2006-12-27 | 2011-08-10 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| JP2008172062A (ja) * | 2007-01-12 | 2008-07-24 | Murata Mach Ltd | 物品供給装置 |
| JP2008172160A (ja) * | 2007-01-15 | 2008-07-24 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
| US20080310939A1 (en) * | 2007-06-15 | 2008-12-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for use in a lithography tool |
| US20090162170A1 (en) * | 2007-12-19 | 2009-06-25 | Asm Japan K.K. | Tandem type semiconductor-processing apparatus |
| JP4980978B2 (ja) * | 2008-04-17 | 2012-07-18 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| CN101990585B (zh) * | 2008-06-06 | 2013-07-24 | 株式会社爱发科 | 成膜装置 |
| JP4757924B2 (ja) * | 2009-02-26 | 2011-08-24 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP5060517B2 (ja) * | 2009-06-24 | 2012-10-31 | 東京エレクトロン株式会社 | インプリントシステム |
| JP2011009362A (ja) * | 2009-06-24 | 2011-01-13 | Tokyo Electron Ltd | インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体 |
| JP5657948B2 (ja) * | 2009-09-02 | 2015-01-21 | キヤノンアネルバ株式会社 | 真空処理装置及び基板移載方法 |
| US8911554B2 (en) * | 2010-01-05 | 2014-12-16 | Applied Materials, Inc. | System for batch processing of magnetic media |
| KR101796656B1 (ko) * | 2010-04-30 | 2017-11-13 | 어플라이드 머티어리얼스, 인코포레이티드 | 수직 인라인 화학기상증착 시스템 |
| US9869021B2 (en) | 2010-05-25 | 2018-01-16 | Aventa Technologies, Inc. | Showerhead apparatus for a linear batch chemical vapor deposition system |
| US9169562B2 (en) * | 2010-05-25 | 2015-10-27 | Singulus Mocvd Gmbh I. Gr. | Parallel batch chemical vapor deposition system |
| US20120305193A1 (en) | 2011-06-03 | 2012-12-06 | Arthur Keigler | Parallel single substrate processing agitation module |
| JP5993625B2 (ja) * | 2012-06-15 | 2016-09-14 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板反転装置、および、基板処理装置 |
| US9099510B2 (en) * | 2013-03-15 | 2015-08-04 | Genmark Automation, Inc. | Workpiece flipping mechanism for space-constrained environment |
| US9245783B2 (en) | 2013-05-24 | 2016-01-26 | Novellus Systems, Inc. | Vacuum robot with linear translation carriage |
| JP6346509B2 (ja) * | 2014-07-07 | 2018-06-20 | 株式会社荏原製作所 | 基板処理装置及び基板搬送方法 |
| JP2017183665A (ja) * | 2016-03-31 | 2017-10-05 | 芝浦メカトロニクス株式会社 | 基板搬送装置、基板処理装置及び基板処理方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR970003907B1 (ko) | 1988-02-12 | 1997-03-22 | 도오교오 에레구토론 가부시끼 가이샤 | 기판처리 장치 및 기판처리 방법 |
| US4981408A (en) * | 1989-12-18 | 1991-01-01 | Varian Associates, Inc. | Dual track handling and processing system |
| JPH0917835A (ja) * | 1995-04-27 | 1997-01-17 | Sony Corp | 偏平な被加工物の搬送方法 |
| JPH1022359A (ja) | 1996-07-01 | 1998-01-23 | Dainippon Screen Mfg Co Ltd | 基板搬送装置 |
| US6318951B1 (en) * | 1999-07-09 | 2001-11-20 | Semitool, Inc. | Robots for microelectronic workpiece handling |
| JP2000049206A (ja) | 1998-07-28 | 2000-02-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP2000138276A (ja) * | 1998-10-30 | 2000-05-16 | Tokyo Electron Ltd | 基板処理装置 |
| US6156580A (en) * | 1998-11-18 | 2000-12-05 | Advanced Micro Devices, Inc. | Semiconductor wafer analysis system and method |
| JP2000260857A (ja) * | 1999-03-12 | 2000-09-22 | Sumitomo Heavy Ind Ltd | ウェハ搬送ロボットを用いたウェハ受渡し方法、及び、ウェハ処理装置 |
| JP2001219391A (ja) * | 1999-12-01 | 2001-08-14 | Ses Co Ltd | 基板反転装置および基板洗浄システム |
| US6488462B1 (en) * | 2000-01-12 | 2002-12-03 | Quantum Corporation | Transport mechanism for a storage system |
| JP2001274232A (ja) * | 2000-03-27 | 2001-10-05 | Tokyo Electron Ltd | 基板処理装置 |
| JP2002110609A (ja) * | 2000-10-02 | 2002-04-12 | Tokyo Electron Ltd | 洗浄処理装置 |
| US20020071756A1 (en) * | 2000-12-13 | 2002-06-13 | Gonzalez Jose R. | Dual wafer edge gripping end effector and method therefor |
| JP4856308B2 (ja) * | 2000-12-27 | 2012-01-18 | キヤノンアネルバ株式会社 | 基板処理装置及び経由チャンバー |
| US6494666B2 (en) * | 2001-01-26 | 2002-12-17 | Fortrend Engineering Corporation | Simplified and enhanced SCARA arm |
| JP2005510055A (ja) * | 2001-11-13 | 2005-04-14 | エフエスアイ インターナショナル インコーポレイテッド | マイクロエレクトロニクス基板の自動処理用の低減フットプリントツール |
-
2003
- 2003-09-25 TW TW092126529A patent/TWI262165B/zh not_active IP Right Cessation
- 2003-10-09 KR KR1020057006545A patent/KR101028782B1/ko not_active Expired - Fee Related
- 2003-10-09 EP EP03785610A patent/EP1554748B1/de not_active Expired - Lifetime
- 2003-10-09 KR KR1020107029022A patent/KR101276785B1/ko not_active Expired - Fee Related
- 2003-10-09 CN CNB2003801015288A patent/CN100369185C/zh not_active Expired - Lifetime
- 2003-10-09 AU AU2003294674A patent/AU2003294674A1/en not_active Abandoned
- 2003-10-09 WO PCT/EP2003/011178 patent/WO2004036628A2/en not_active Ceased
- 2003-10-09 AT AT03785610T patent/ATE419645T1/de active
- 2003-10-09 DE DE60325626T patent/DE60325626D1/de not_active Expired - Lifetime
- 2003-10-09 US US10/531,419 patent/US7270510B2/en not_active Expired - Lifetime
- 2003-10-09 JP JP2004544119A patent/JP4986399B2/ja not_active Expired - Fee Related
-
2012
- 2012-02-29 JP JP2012043009A patent/JP5367105B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US7270510B2 (en) | 2007-09-18 |
| JP2012134533A (ja) | 2012-07-12 |
| KR101276785B1 (ko) | 2013-06-24 |
| KR20050052539A (ko) | 2005-06-02 |
| JP2006503428A (ja) | 2006-01-26 |
| JP4986399B2 (ja) | 2012-07-25 |
| US20060008342A1 (en) | 2006-01-12 |
| AU2003294674A1 (en) | 2004-05-04 |
| DE60325626D1 (de) | 2009-02-12 |
| WO2004036628A3 (en) | 2004-07-01 |
| TW200416188A (en) | 2004-09-01 |
| TWI262165B (en) | 2006-09-21 |
| KR20110014663A (ko) | 2011-02-11 |
| CN100369185C (zh) | 2008-02-13 |
| EP1554748A2 (de) | 2005-07-20 |
| EP1554748B1 (de) | 2008-12-31 |
| CN1706024A (zh) | 2005-12-07 |
| JP5367105B2 (ja) | 2013-12-11 |
| WO2004036628A2 (en) | 2004-04-29 |
| KR101028782B1 (ko) | 2011-04-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification |
Ref document number: 1554748 Country of ref document: EP |
|
| EEFA | Change of the company name |