ATE420440T1 - Verfahren zum regeln des zuerst schmelzenden bereiches einer pcm-zelle und damit hergestellte vorrichtungen - Google Patents

Verfahren zum regeln des zuerst schmelzenden bereiches einer pcm-zelle und damit hergestellte vorrichtungen

Info

Publication number
ATE420440T1
ATE420440T1 AT06744974T AT06744974T ATE420440T1 AT E420440 T1 ATE420440 T1 AT E420440T1 AT 06744974 T AT06744974 T AT 06744974T AT 06744974 T AT06744974 T AT 06744974T AT E420440 T1 ATE420440 T1 AT E420440T1
Authority
AT
Austria
Prior art keywords
phase
controlling
produced therefrom
devices produced
pcm cell
Prior art date
Application number
AT06744974T
Other languages
English (en)
Inventor
Ludovic Goux
Dirk Wouters
Judith Lisoni
Thomas Gille
Original Assignee
Koninkl Philips Electronics Nv
Imec Inter Uni Micro Electr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Imec Inter Uni Micro Electr filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE420440T1 publication Critical patent/ATE420440T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828Tellurides, e.g. GeSbTe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/823Device geometry adapted for essentially horizontal current flow, e.g. bridge type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011Manufacture or treatment of multistable switching devices
    • H10N70/061Shaping switching materials
    • H10N70/063Shaping switching materials by etching of pre-deposited switching material layers, e.g. lithography
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/231Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/884Switching materials based on at least one element of group IIIA, IVA or VA, e.g. elemental or compound semiconductors
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0004Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Control For Baths (AREA)
  • External Artificial Organs (AREA)
AT06744974T 2005-05-19 2006-05-18 Verfahren zum regeln des zuerst schmelzenden bereiches einer pcm-zelle und damit hergestellte vorrichtungen ATE420440T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68345905P 2005-05-19 2005-05-19

Publications (1)

Publication Number Publication Date
ATE420440T1 true ATE420440T1 (de) 2009-01-15

Family

ID=36942608

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06744974T ATE420440T1 (de) 2005-05-19 2006-05-18 Verfahren zum regeln des zuerst schmelzenden bereiches einer pcm-zelle und damit hergestellte vorrichtungen

Country Status (7)

Country Link
US (1) US8008644B2 (de)
EP (1) EP1886317B8 (de)
JP (1) JP4862113B2 (de)
CN (1) CN101213612B (de)
AT (1) ATE420440T1 (de)
DE (1) DE602006004729D1 (de)
WO (1) WO2006123305A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008155724A1 (en) * 2007-06-20 2008-12-24 Taiwan Semiconductor Manufacturing Co., Ltd. An electronic component, and a method of manufacturing an electronic component
US8649213B2 (en) 2008-04-01 2014-02-11 Nxp B.V. Multiple bit phase change memory cell
WO2009122349A2 (en) 2008-04-01 2009-10-08 Nxp B.V. Vertical phase change memory cell
US8735862B2 (en) * 2011-04-11 2014-05-27 Micron Technology, Inc. Memory cells, methods of forming memory cells and methods of forming memory arrays
US8932900B2 (en) 2011-08-24 2015-01-13 Taiwan Semiconductor Manufacturing Company, Ltd. Phase change memory and method of fabricating same
CN103346258B (zh) * 2013-07-19 2015-08-26 中国科学院上海微系统与信息技术研究所 相变存储单元及其制备方法
US10103325B2 (en) * 2016-12-15 2018-10-16 Winbond Electronics Corp. Resistance change memory device and fabrication method thereof
US20210288250A1 (en) * 2020-03-13 2021-09-16 International Business Machines Corporation Phase Change Memory Having Gradual Reset

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6809401B2 (en) * 2000-10-27 2004-10-26 Matsushita Electric Industrial Co., Ltd. Memory, writing apparatus, reading apparatus, writing method, and reading method
US6566700B2 (en) * 2001-10-11 2003-05-20 Ovonyx, Inc. Carbon-containing interfacial layer for phase-change memory
EP1326254B1 (de) * 2001-12-27 2009-02-25 STMicroelectronics S.r.l. Architektur einer nichtflüchtigen Phasenwechsel -Speichermatrix
US7151273B2 (en) * 2002-02-20 2006-12-19 Micron Technology, Inc. Silver-selenide/chalcogenide glass stack for resistance variable memory
KR100543445B1 (ko) * 2003-03-04 2006-01-23 삼성전자주식회사 상변화 기억 소자 및 그 형성방법
KR100532462B1 (ko) * 2003-08-22 2005-12-01 삼성전자주식회사 상 변화 메모리 장치의 기입 전류 량을 제어하는프로그래밍 방법 및 프로그래밍 방법을 구현하는 기입드라이버 회로
KR100569550B1 (ko) * 2003-12-13 2006-04-10 주식회사 하이닉스반도체 상 변화 저항 셀 및 이를 이용한 불휘발성 메모리 장치
CN101228588B (zh) * 2005-05-19 2012-12-05 Nxp股份有限公司 用于控制pcm单元中“首先熔化”区的方法及其获得的器件

Also Published As

Publication number Publication date
DE602006004729D1 (de) 2009-02-26
EP1886317A1 (de) 2008-02-13
JP2008541474A (ja) 2008-11-20
US8008644B2 (en) 2011-08-30
EP1886317B1 (de) 2009-01-07
WO2006123305A1 (en) 2006-11-23
US20080265237A1 (en) 2008-10-30
JP4862113B2 (ja) 2012-01-25
CN101213612B (zh) 2010-09-29
EP1886317B8 (de) 2009-04-08
CN101213612A (zh) 2008-07-02

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