ATE420769T1 - Verfahren zur herstellung einer microstruktur - Google Patents
Verfahren zur herstellung einer microstrukturInfo
- Publication number
- ATE420769T1 ATE420769T1 AT02015373T AT02015373T ATE420769T1 AT E420769 T1 ATE420769 T1 AT E420769T1 AT 02015373 T AT02015373 T AT 02015373T AT 02015373 T AT02015373 T AT 02015373T AT E420769 T1 ATE420769 T1 AT E420769T1
- Authority
- AT
- Austria
- Prior art keywords
- positive type
- resist layer
- type resist
- image
- pmipk
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Lubricants (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001210933A JP4532785B2 (ja) | 2001-07-11 | 2001-07-11 | 構造体の製造方法、および液体吐出ヘッドの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE420769T1 true ATE420769T1 (de) | 2009-01-15 |
Family
ID=19046331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02015373T ATE420769T1 (de) | 2001-07-11 | 2002-07-10 | Verfahren zur herstellung einer microstruktur |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6960424B2 (de) |
| EP (1) | EP1275508B1 (de) |
| JP (1) | JP4532785B2 (de) |
| AT (1) | ATE420769T1 (de) |
| DE (1) | DE60230838D1 (de) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4078070B2 (ja) * | 2000-12-28 | 2008-04-23 | キヤノン株式会社 | インクジェットヘッドの製造方法 |
| JP4095368B2 (ja) | 2001-08-10 | 2008-06-04 | キヤノン株式会社 | インクジェット記録ヘッドの作成方法 |
| JP3862624B2 (ja) * | 2002-07-10 | 2006-12-27 | キヤノン株式会社 | 液体吐出ヘッドおよび、該ヘッドの製造方法 |
| JP4280574B2 (ja) | 2002-07-10 | 2009-06-17 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
| JP3890268B2 (ja) * | 2002-07-10 | 2007-03-07 | キヤノン株式会社 | 液体吐出ヘッドおよび、該ヘッドの製造方法 |
| JP2004042389A (ja) * | 2002-07-10 | 2004-02-12 | Canon Inc | 微細構造体の製造方法、液体吐出ヘッドの製造方法および液体吐出ヘッド |
| JP2005074747A (ja) * | 2003-08-29 | 2005-03-24 | Canon Inc | インクジェットヘッドの製造方法およびインクジェットヘッド |
| DE10353767B4 (de) * | 2003-11-17 | 2005-09-29 | Infineon Technologies Ag | Vorrichtung zur Häusung einer mikromechanischen Struktur und Verfahren zur Herstellung derselben |
| JP4455287B2 (ja) * | 2003-12-26 | 2010-04-21 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
| US7399067B2 (en) * | 2004-02-27 | 2008-07-15 | Canon Kabushiki Kaisha | Piezoelectric thin film, method of manufacturing piezoelectric thin film, piezoelectric element, and ink jet recording head |
| US7629111B2 (en) | 2004-06-28 | 2009-12-08 | Canon Kabushiki Kaisha | Liquid discharge head manufacturing method, and liquid discharge head obtained using this method |
| CN1977219B (zh) * | 2004-06-28 | 2011-12-28 | 佳能株式会社 | 制造微细结构的方法、制造排液头的方法以及排液头 |
| JP4761498B2 (ja) * | 2004-06-28 | 2011-08-31 | キヤノン株式会社 | 感光性樹脂組成物、ならびにこれを用いた段差パターンの製造方法及びインクジェットヘッドの製造方法 |
| JP4533256B2 (ja) * | 2004-06-28 | 2010-09-01 | キヤノン株式会社 | 微細構造体の製造方法および液体吐出ヘッドの製造方法 |
| WO2006001531A1 (en) | 2004-06-28 | 2006-01-05 | Canon Kabushiki Kaisha | Liquid discharge head manufacturing method, and liquid discharge head obtained using this method |
| JP4480141B2 (ja) * | 2004-06-28 | 2010-06-16 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
| US7370944B2 (en) * | 2004-08-30 | 2008-05-13 | Eastman Kodak Company | Liquid ejector having internal filters |
| JP5027991B2 (ja) * | 2004-12-03 | 2012-09-19 | キヤノン株式会社 | インクジェットヘッドおよびその製造方法 |
| JP4241605B2 (ja) * | 2004-12-21 | 2009-03-18 | ソニー株式会社 | 液体吐出ヘッドの製造方法 |
| KR20060071228A (ko) * | 2004-12-21 | 2006-06-26 | 동부일렉트로닉스 주식회사 | 반도체 소자의 패턴 및 그 형성방법 |
| JP4724490B2 (ja) * | 2005-08-09 | 2011-07-13 | キヤノン株式会社 | 液体吐出ヘッド |
| JP4845692B2 (ja) * | 2005-12-02 | 2011-12-28 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
| EP1957282B1 (de) * | 2005-12-02 | 2013-04-10 | Canon Kabushiki Kaisha | Verfahren zur herstellung eines flüssigkeitsausstosskopfs |
| JP4974751B2 (ja) * | 2006-04-27 | 2012-07-11 | キヤノン株式会社 | インクジェットヘッドおよびその製造方法 |
| US8037603B2 (en) * | 2006-04-27 | 2011-10-18 | Canon Kabushiki Kaisha | Ink jet head and producing method therefor |
| RU2409472C2 (ru) * | 2006-05-02 | 2011-01-20 | Кэнон Кабусики Кайся | Головка для струйного печатающего устройства |
| US8376525B2 (en) * | 2006-09-08 | 2013-02-19 | Canon Kabushiki Kaisha | Liquid discharge head and method of manufacturing the same |
| JP5094290B2 (ja) * | 2006-09-08 | 2012-12-12 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
| JP2009119650A (ja) * | 2007-11-13 | 2009-06-04 | Canon Inc | インクジェットヘッドの製造方法 |
| US20090136875A1 (en) * | 2007-11-15 | 2009-05-28 | Canon Kabushiki Kaisha | Manufacturing method of liquid ejection head |
| JP2010131954A (ja) * | 2007-12-19 | 2010-06-17 | Canon Inc | 液体吐出ヘッドの製造方法 |
| KR101452705B1 (ko) | 2008-01-10 | 2014-10-24 | 삼성전자주식회사 | 잉크젯 프린터 헤드의 제조 방법 및 상기 방법에 의하여제조된 잉크젯 프린터 헤드 |
| JP2009220286A (ja) * | 2008-03-13 | 2009-10-01 | Canon Inc | 液体吐出記録ヘッド及その製造方法 |
| KR101249580B1 (ko) | 2008-05-22 | 2013-04-01 | 캐논 가부시끼가이샤 | 액체 토출 헤드 및 액체 토출 헤드의 제조 방법 |
| US8499453B2 (en) * | 2009-11-26 | 2013-08-06 | Canon Kabushiki Kaisha | Method of manufacturing liquid discharge head, and method of manufacturing discharge port member |
| US8434229B2 (en) * | 2010-11-24 | 2013-05-07 | Canon Kabushiki Kaisha | Liquid ejection head manufacturing method |
| JP2012121168A (ja) * | 2010-12-06 | 2012-06-28 | Canon Inc | 液体吐出ヘッド及びその製造方法 |
| FR2974194B1 (fr) * | 2011-04-12 | 2013-11-15 | Commissariat Energie Atomique | Procede de lithographie |
| JP5854682B2 (ja) * | 2011-07-27 | 2016-02-09 | キヤノン株式会社 | 記録ヘッドとその製造方法 |
| JP5410488B2 (ja) * | 2011-09-27 | 2014-02-05 | 富士フイルム株式会社 | インクジェットヘッドおよびインクジェット記録装置 |
| US10194537B2 (en) * | 2013-03-25 | 2019-01-29 | International Business Machines Corporation | Minimizing printed circuit board warpage |
| JP6327836B2 (ja) * | 2013-11-13 | 2018-05-23 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
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| JPS5595324A (en) * | 1978-12-30 | 1980-07-19 | Fujitsu Ltd | Manufacturing method of semiconductor device |
| JPS56162744A (en) * | 1980-05-19 | 1981-12-14 | Hitachi Ltd | Formation of fine pattern |
| US4609427A (en) * | 1982-06-25 | 1986-09-02 | Canon Kabushiki Kaisha | Method for producing ink jet recording head |
| JPH0645242B2 (ja) | 1984-12-28 | 1994-06-15 | キヤノン株式会社 | 液体噴射記録ヘツドの製造方法 |
| JPS62127735A (ja) * | 1985-11-29 | 1987-06-10 | Toshiba Corp | 感光性樹脂組成物及びこれを用いたカラ−フイルタ−の製造方法 |
| JPH0698755B2 (ja) * | 1986-04-28 | 1994-12-07 | キヤノン株式会社 | 液体噴射記録ヘツドの製造方法 |
| US4882595A (en) | 1987-10-30 | 1989-11-21 | Hewlett-Packard Company | Hydraulically tuned channel architecture |
| JPH0740808B2 (ja) | 1990-10-17 | 1995-05-10 | 井関農機株式会社 | トラクターの油圧昇降制御装置 |
| JPH04194939A (ja) * | 1990-11-27 | 1992-07-14 | Matsushita Electric Ind Co Ltd | マスク形成方法およびパターン形成方法 |
| JP2694054B2 (ja) * | 1990-12-19 | 1997-12-24 | キヤノン株式会社 | 液体噴射記録ヘッド、その製造方法、及び液体噴射記録ヘッドを備えた記録装置 |
| EP0491560B1 (de) | 1990-12-19 | 1997-10-01 | Canon Kabushiki Kaisha | Herstellungsverfahren für flüssigkeitsausströmenden Aufzeichnungskopf |
| EP0572948B1 (de) * | 1992-06-01 | 2000-09-06 | Canon Kabushiki Kaisha | Verfahren zur Herstellung eines Tintenstrahlaufzeichnungskopfes |
| JP2960608B2 (ja) * | 1992-06-04 | 1999-10-12 | キヤノン株式会社 | 液体噴射記録ヘッドの製造方法 |
| JPH0645242A (ja) | 1992-07-24 | 1994-02-18 | Hitachi Ltd | レジスト塗布方法及びその装置 |
| JP3143307B2 (ja) | 1993-02-03 | 2001-03-07 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
| JPH07156409A (ja) * | 1993-10-04 | 1995-06-20 | Xerox Corp | 一体形成した流路構造を有するインクジェット・プリントヘッドおよびその作製方法 |
| JP3143308B2 (ja) | 1994-01-31 | 2001-03-07 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
| DE69603639T2 (de) | 1995-03-31 | 2000-04-13 | Canon K.K., Tokio/Tokyo | Verfahren zum Herstellen eines Tintenstrahlkopfes |
| JPH09109392A (ja) | 1995-10-13 | 1997-04-28 | Canon Inc | インクジェット記録ヘッドの製造方法および同方法により製造されたインクジェット記録ヘッド、並びにインクジェット記録装置 |
| EP0800921B1 (de) | 1996-04-12 | 2005-02-02 | Canon Kabushiki Kaisha | Tintenstrahldruckkopfherstellungsverfahren |
| US6158843A (en) | 1997-03-28 | 2000-12-12 | Lexmark International, Inc. | Ink jet printer nozzle plates with ink filtering projections |
| EP0895861B1 (de) | 1997-08-05 | 2003-11-26 | Canon Kabushiki Kaisha | Flüssigkeitsausstosskopf, Substrat und Herstelllungsverfahren |
| JPH11227210A (ja) * | 1997-12-05 | 1999-08-24 | Canon Inc | 液体吐出ヘッド、該ヘッドの製造方法、ヘッドカートリッジおよび液体吐出装置 |
| JP2000198199A (ja) * | 1997-12-05 | 2000-07-18 | Canon Inc | 液体吐出ヘッドおよびヘッドカートリッジおよび液体吐出装置および液体吐出ヘッドの製造方法 |
| EP1020291A3 (de) * | 1999-01-18 | 2001-04-11 | Canon Kabushiki Kaisha | Flüssigkeitsausstosskopf und Verfahren zur Herstellung desselben |
| US6447984B1 (en) | 1999-02-10 | 2002-09-10 | Canon Kabushiki Kaisha | Liquid discharge head, method of manufacture therefor and liquid discharge recording apparatus |
| JP4497633B2 (ja) * | 1999-03-15 | 2010-07-07 | キヤノン株式会社 | 撥液体層の形成方法及び液体吐出ヘッドの製造方法 |
| US6474769B1 (en) * | 1999-06-04 | 2002-11-05 | Canon Kabushiki Kaisha | Liquid discharge head, liquid discharge apparatus and method for manufacturing liquid discharge head |
| US6591500B1 (en) * | 1999-06-04 | 2003-07-15 | Canon Kabushiki Kaisha | Method of manufacturing a liquid discharge head |
| US6426481B1 (en) | 1999-06-29 | 2002-07-30 | Canon Kabushiki Kaisha | Method for manufacturing discharge nozzle of liquid jet recording head and method for manufacturing the same head |
| JP2001018395A (ja) * | 1999-07-02 | 2001-01-23 | Canon Inc | 液体吐出ヘッドおよびその製造方法 |
| US6569343B1 (en) * | 1999-07-02 | 2003-05-27 | Canon Kabushiki Kaisha | Method for producing liquid discharge head, liquid discharge head, head cartridge, liquid discharging recording apparatus, method for producing silicon plate and silicon plate |
| US6472125B1 (en) * | 1999-11-30 | 2002-10-29 | Canon Kabushiki Kaisha | Method for manufacturing ink jet recording head and ink jet recording head manufactured by such method of manufacture |
| JP4078070B2 (ja) * | 2000-12-28 | 2008-04-23 | キヤノン株式会社 | インクジェットヘッドの製造方法 |
| JP2004042389A (ja) * | 2002-07-10 | 2004-02-12 | Canon Inc | 微細構造体の製造方法、液体吐出ヘッドの製造方法および液体吐出ヘッド |
-
2001
- 2001-07-11 JP JP2001210933A patent/JP4532785B2/ja not_active Expired - Fee Related
-
2002
- 2002-07-10 US US10/191,510 patent/US6960424B2/en not_active Expired - Fee Related
- 2002-07-10 AT AT02015373T patent/ATE420769T1/de not_active IP Right Cessation
- 2002-07-10 DE DE60230838T patent/DE60230838D1/de not_active Expired - Lifetime
- 2002-07-10 EP EP02015373A patent/EP1275508B1/de not_active Expired - Lifetime
-
2005
- 2005-04-19 US US11/108,700 patent/US7526863B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1275508A3 (de) | 2003-07-16 |
| US6960424B2 (en) | 2005-11-01 |
| US20050181309A1 (en) | 2005-08-18 |
| US20030011655A1 (en) | 2003-01-16 |
| EP1275508B1 (de) | 2009-01-14 |
| EP1275508A2 (de) | 2003-01-15 |
| JP4532785B2 (ja) | 2010-08-25 |
| US7526863B2 (en) | 2009-05-05 |
| DE60230838D1 (de) | 2009-03-05 |
| JP2003025595A (ja) | 2003-01-29 |
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