ATE421097T1 - Überwachung physikalischer betriebsparameter einer integrierten schaltung - Google Patents

Überwachung physikalischer betriebsparameter einer integrierten schaltung

Info

Publication number
ATE421097T1
ATE421097T1 AT05819789T AT05819789T ATE421097T1 AT E421097 T1 ATE421097 T1 AT E421097T1 AT 05819789 T AT05819789 T AT 05819789T AT 05819789 T AT05819789 T AT 05819789T AT E421097 T1 ATE421097 T1 AT E421097T1
Authority
AT
Austria
Prior art keywords
successive approximation
integrated circuit
update circuit
sensing circuits
physical operating
Prior art date
Application number
AT05819789T
Other languages
English (en)
Inventor
Hendricus J M Veendrick
Marcel Pelgrom
Violeta Petrescu
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE421097T1 publication Critical patent/ATE421097T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/316—Testing of analog circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31723—Hardware for routing the test signal within the device under test to the circuits to be tested, e.g. multiplexer for multiple core testing, accessing internal nodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Analogue/Digital Conversion (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
  • Semiconductor Memories (AREA)
AT05819789T 2004-11-24 2005-11-07 Überwachung physikalischer betriebsparameter einer integrierten schaltung ATE421097T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0425800.0A GB0425800D0 (en) 2004-11-24 2004-11-24 Montoring physical operating parameters of an integrated circuit

Publications (1)

Publication Number Publication Date
ATE421097T1 true ATE421097T1 (de) 2009-01-15

Family

ID=33548769

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05819789T ATE421097T1 (de) 2004-11-24 2005-11-07 Überwachung physikalischer betriebsparameter einer integrierten schaltung

Country Status (10)

Country Link
US (1) US7928882B2 (de)
EP (1) EP1817594B1 (de)
JP (1) JP2008520996A (de)
KR (1) KR20070084548A (de)
CN (1) CN101065678B (de)
AT (1) ATE421097T1 (de)
DE (1) DE602005012424D1 (de)
GB (1) GB0425800D0 (de)
TW (1) TW200634326A (de)
WO (1) WO2006056898A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008538863A (ja) 2005-04-25 2008-11-06 エヌエックスピー ビー ヴィ 電源電圧の監視
US20080249727A1 (en) * 2007-04-04 2008-10-09 Satoru Takase Systems and Methods for Determining Variations in Voltages Applied to an Integrated Circuit Chip
US8281158B2 (en) * 2007-05-30 2012-10-02 Lapis Semiconductor Co., Ltd. Semiconductor integrated circuit
CN102047133A (zh) * 2008-05-29 2011-05-04 Nxp股份有限公司 用于周期抖动测量的延迟锁定环
CN103033741B (zh) * 2011-09-30 2015-05-27 重庆重邮信科通信技术有限公司 一种具有扫描链测试功能的芯片及测试方法
CN106226686A (zh) * 2016-08-18 2016-12-14 中国电子科技集团公司第五十八研究所 一种能够实时测量fpga内部温度及电压的结构
KR102660729B1 (ko) * 2016-10-28 2024-04-26 삼성전자주식회사 전원 잡음을 검출하는 불휘발성 메모리 장치 및 그것의 동작 방법
CN108508343B (zh) * 2017-02-24 2022-06-07 北京普源精电科技有限公司 一种印制电路板的检测装置及方法
JP6989404B2 (ja) * 2018-02-13 2022-01-05 ローム株式会社 半導体集積回路

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US3838396A (en) * 1972-05-18 1974-09-24 Little Inc A Data processor (including editing and revision) with buffer memory
US4490713A (en) * 1978-11-17 1984-12-25 Burr-Brown Inc. Microprocessor supervised analog-to-digital converter
GB8406846D0 (en) * 1984-03-16 1984-04-18 British Telecomm Digital filters
DE3584727D1 (de) * 1984-07-06 1992-01-02 British Aerospace Analog-digitalwandler.
EP0320100A2 (de) * 1987-12-05 1989-06-14 Stc Plc Analogdigitalwandler
JPH07159496A (ja) 1993-10-12 1995-06-23 At & T Global Inf Solutions Internatl Inc 集積回路の検査のための装置及びその方法
FR2715725B1 (fr) * 1994-02-01 1996-03-29 Schlumberger Ind Sa Procédé et dispositif de détermination d'un paramètre physique représenté par l'évolution au cours du temps d'une grandeur physique.
TW307927B (de) * 1994-08-29 1997-06-11 Matsushita Electric Industrial Co Ltd
EP0797305A1 (de) 1996-03-22 1997-09-24 STMicroelectronics S.r.l. Kombinierter ADW-DAW
US5920274A (en) * 1997-08-05 1999-07-06 International Business Machines Corporation Image sensor employing non-uniform A/D conversion
WO2000028337A2 (en) * 1998-11-06 2000-05-18 Onguard Systems, Inc. Electronic circuit with a non-continuous discharge path
WO2000028463A1 (en) * 1998-11-09 2000-05-18 Koninklijke Philips Electronics N.V. Successive approximation analog-to-digital converter with threshold detection mode, and system containing the same
US6424900B2 (en) * 2000-02-01 2002-07-23 Delphi Technologies, Inc. Multi-module control-by-wire architecture
JP4397590B2 (ja) * 2001-04-10 2010-01-13 マイクロ−エプシロン・メステヒニク・ゲーエムベーハー・ウント・コンパニー・カー・ゲー 非線形の特性曲線を線形化する方法
DE10204442C2 (de) * 2002-02-04 2003-12-24 Bosch Gmbh Robert Verfahren zur Korrektur von Nichtlinearitäten eines Ausgangssignals eines elektrischen Bauelements, insbesondere eines Messumformers
US6559788B1 (en) * 2002-02-12 2003-05-06 Charles Douglas Murphy Parallel and shared parallel analog-to-digital conversion for digital imaging
US7309998B2 (en) * 2002-12-02 2007-12-18 Burns Lawrence M Process monitor for monitoring an integrated circuit chip
US6823293B2 (en) 2002-12-31 2004-11-23 International Business Machines Corporation Hierarchical power supply noise monitoring device and system for very large scale integrated circuits
US6747588B1 (en) * 2003-01-15 2004-06-08 Faraday Technology Corp. Method for improving successive approximation analog-to-digital converter
KR20050089889A (ko) 2003-01-28 2005-09-08 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 물리적 동작 파라미터 감지용 집적 센서를 갖는 집적 회로장치와 이러한 장치를 갖는 전자 시스템의 테스트 방법 및이를 포함하는 전자 장치
US7138820B2 (en) * 2004-04-30 2006-11-21 Xilinx, Inc. System monitor in a programmable logic device

Also Published As

Publication number Publication date
EP1817594B1 (de) 2009-01-14
KR20070084548A (ko) 2007-08-24
GB0425800D0 (en) 2004-12-22
EP1817594A1 (de) 2007-08-15
TW200634326A (en) 2006-10-01
US7928882B2 (en) 2011-04-19
US20080007246A1 (en) 2008-01-10
JP2008520996A (ja) 2008-06-19
DE602005012424D1 (de) 2009-03-05
CN101065678B (zh) 2012-03-21
CN101065678A (zh) 2007-10-31
WO2006056898A1 (en) 2006-06-01

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