ATE423392T1 - Verfahren und vorrichtung zum justieren eines bauelementes auf einem substrat unter verwendung von digitaler merkmaltrennung - Google Patents

Verfahren und vorrichtung zum justieren eines bauelementes auf einem substrat unter verwendung von digitaler merkmaltrennung

Info

Publication number
ATE423392T1
ATE423392T1 AT01914108T AT01914108T ATE423392T1 AT E423392 T1 ATE423392 T1 AT E423392T1 AT 01914108 T AT01914108 T AT 01914108T AT 01914108 T AT01914108 T AT 01914108T AT E423392 T1 ATE423392 T1 AT E423392T1
Authority
AT
Austria
Prior art keywords
features
image
component
interest
saved
Prior art date
Application number
AT01914108T
Other languages
English (en)
Inventor
Edison Hudson
Original Assignee
Infotech Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infotech Ag filed Critical Infotech Ag
Application granted granted Critical
Publication of ATE423392T1 publication Critical patent/ATE423392T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0611—Sorting devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0053—Arrangements for assisting the manual mounting of components, e.g. special tables or light spots indicating the place for mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49769—Using optical instrument [excludes mere human eyeballing]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49778—Method of mechanical manufacture with testing or indicating with aligning, guiding, or instruction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Optical Communication System (AREA)
  • Holo Graphy (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT01914108T 2000-03-10 2001-03-09 Verfahren und vorrichtung zum justieren eines bauelementes auf einem substrat unter verwendung von digitaler merkmaltrennung ATE423392T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18855800P 2000-03-10 2000-03-10

Publications (1)

Publication Number Publication Date
ATE423392T1 true ATE423392T1 (de) 2009-03-15

Family

ID=22693647

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01914108T ATE423392T1 (de) 2000-03-10 2001-03-09 Verfahren und vorrichtung zum justieren eines bauelementes auf einem substrat unter verwendung von digitaler merkmaltrennung

Country Status (6)

Country Link
US (1) US6557251B2 (de)
EP (1) EP1264334B1 (de)
AT (1) ATE423392T1 (de)
AU (1) AU3948701A (de)
DE (1) DE60137681D1 (de)
WO (1) WO2001067491A2 (de)

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DE10147799C1 (de) * 2001-09-27 2003-04-03 Buender Glas Gmbh Tropfer, insbesondere Augentropfer
GB2380888A (en) * 2001-10-13 2003-04-16 Hewlett Packard Co Automatic determination of regions of interest in an image
US20050161814A1 (en) * 2002-12-27 2005-07-28 Fujitsu Limited Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
US20050018403A1 (en) * 2003-06-25 2005-01-27 Foo Chong Seng BGA ball vision enhancement
DE10349167A1 (de) * 2003-10-22 2005-05-19 Marconi Communications Gmbh Verfahren zum Kleben einer Schaltungskomponente auf einem Schaltungsträger
US20050285947A1 (en) * 2004-06-21 2005-12-29 Grindstaff Gene A Real-time stabilization
DE102011077962B4 (de) 2010-09-27 2016-01-07 Xenon Automatisierungstechnik Gmbh Vorrichtung zur 3-D-Prozessierung von Bauteilen
US8937010B2 (en) 2013-02-27 2015-01-20 International Business Machines Corporation Information encoding using wirebonds
DE102013207598A1 (de) * 2013-04-25 2014-10-30 Finetech Gmbh & Co.Kg Platziervorrichtung und Platzierverfahren
CN107926156B (zh) * 2015-09-03 2020-09-18 株式会社富士 元件安装机
DE102015220746A1 (de) * 2015-10-23 2017-04-27 Ersa Gmbh Verfahren und Vorrichtung zur Platzierung elektronischer Bauteile
CN106413280B (zh) * 2016-11-09 2019-02-22 哈尔滨工业大学 贴片机喂料器元件位置自动矫正装置及自动矫正方法

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Also Published As

Publication number Publication date
DE60137681D1 (de) 2009-04-02
EP1264334A2 (de) 2002-12-11
AU3948701A (en) 2001-09-17
WO2001067491A2 (en) 2001-09-13
EP1264334B1 (de) 2009-02-18
US20020006219A1 (en) 2002-01-17
US6557251B2 (en) 2003-05-06
WO2001067491A3 (en) 2002-04-11

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