ATE424038T1 - Flüssigkeitsbearbeitungsvorrichtung und - verfahren - Google Patents

Flüssigkeitsbearbeitungsvorrichtung und - verfahren

Info

Publication number
ATE424038T1
ATE424038T1 AT07011552T AT07011552T ATE424038T1 AT E424038 T1 ATE424038 T1 AT E424038T1 AT 07011552 T AT07011552 T AT 07011552T AT 07011552 T AT07011552 T AT 07011552T AT E424038 T1 ATE424038 T1 AT E424038T1
Authority
AT
Austria
Prior art keywords
substrate
cup
holding member
drain
substrate holding
Prior art date
Application number
AT07011552T
Other languages
English (en)
Inventor
Hiromitsu Nanba
Norihiro Ito
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of ATE424038T1 publication Critical patent/ATE424038T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Weting (AREA)
AT07011552T 2006-06-16 2007-06-13 Flüssigkeitsbearbeitungsvorrichtung und - verfahren ATE424038T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006167972 2006-06-16

Publications (1)

Publication Number Publication Date
ATE424038T1 true ATE424038T1 (de) 2009-03-15

Family

ID=38671006

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07011552T ATE424038T1 (de) 2006-06-16 2007-06-13 Flüssigkeitsbearbeitungsvorrichtung und - verfahren

Country Status (7)

Country Link
US (1) US8479753B2 (de)
EP (1) EP1879216B1 (de)
KR (1) KR101042666B1 (de)
CN (1) CN100550291C (de)
AT (1) ATE424038T1 (de)
DE (1) DE602007000584D1 (de)
TW (1) TWI353015B (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7998308B2 (en) * 2006-04-18 2011-08-16 Tokyo Electron Limited Liquid processing apparatus
US8578953B2 (en) * 2006-12-20 2013-11-12 Tokyo Electron Limited Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium
JP5355951B2 (ja) * 2008-07-24 2013-11-27 東京エレクトロン株式会社 液処理装置
JP5270263B2 (ja) * 2008-08-29 2013-08-21 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5220839B2 (ja) * 2010-12-28 2013-06-26 東京エレクトロン株式会社 液処理装置および液処理方法
JP5472169B2 (ja) * 2011-03-16 2014-04-16 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
US9242279B2 (en) * 2011-05-24 2016-01-26 Tokyo Electron Limited Liquid processing apparatus and liquid processing method
CN103295936B (zh) 2012-02-29 2016-01-13 斯克林集团公司 基板处理装置及基板处理方法
JP6051919B2 (ja) * 2012-04-11 2016-12-27 東京エレクトロン株式会社 液処理装置
JP6148475B2 (ja) * 2013-01-25 2017-06-14 株式会社東芝 半導体製造装置および半導体装置の製造方法
JP6234736B2 (ja) * 2013-08-30 2017-11-22 芝浦メカトロニクス株式会社 スピン処理装置
JP6281161B2 (ja) * 2013-09-27 2018-02-21 東京エレクトロン株式会社 液処理装置
CN104614945A (zh) * 2015-02-03 2015-05-13 合肥工业大学 一种用于旋涂粘稠光刻胶的旋涂仪卡盘系统
CN106610568A (zh) * 2015-10-27 2017-05-03 沈阳芯源微电子设备有限公司 一种涂胶显影工艺模块及该模块内环境参数的控制方法
TWI638394B (zh) 2016-07-25 2018-10-11 斯庫林集團股份有限公司 基板處理裝置
CN106707690B (zh) * 2017-01-04 2021-08-20 中国科学院光电技术研究所 光刻胶涂覆方法和装置
JP6983602B2 (ja) * 2017-09-26 2021-12-17 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
CN110534452B (zh) * 2018-11-08 2022-06-14 北京北方华创微电子装备有限公司 用于清洗工艺腔室的漏液监控装置及清洗工艺腔室
JP7232737B2 (ja) * 2019-08-07 2023-03-03 東京エレクトロン株式会社 基板処理装置
CN112201592A (zh) * 2020-09-11 2021-01-08 北京烁科精微电子装备有限公司 晶圆清洗装置
US12460299B2 (en) * 2021-08-05 2025-11-04 Applied Materials, Inc. Wet clean spray process chamber for substrates
JP7866406B2 (ja) * 2022-03-23 2026-05-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100284559B1 (ko) 1994-04-04 2001-04-02 다카시마 히로시 처리방법 및 처리장치
JP3102831B2 (ja) 1994-06-20 2000-10-23 大日本スクリーン製造株式会社 回転処理装置
US5695817A (en) * 1994-08-08 1997-12-09 Tokyo Electron Limited Method of forming a coating film
TW406216B (en) 1995-05-24 2000-09-21 Tokyo Electron Ltd Apparatus for coating resist on substrate
JPH0945750A (ja) 1995-07-26 1997-02-14 Hitachi Ltd 板状物保持部材およびそれを用いた回転処理装置
JP3250095B2 (ja) 1996-11-15 2002-01-28 東京エレクトロン株式会社 洗浄装置及び洗浄方法
TW418452B (en) 1997-10-31 2001-01-11 Tokyo Electron Ltd Coating process
JP2000182948A (ja) 1998-12-16 2000-06-30 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2000260739A (ja) * 1999-03-11 2000-09-22 Kokusai Electric Co Ltd 基板処理装置および基板処理方法
JP2002177856A (ja) 2000-12-15 2002-06-25 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2003093979A (ja) 2001-09-25 2003-04-02 Hitachi Ltd スピン処理装置

Also Published As

Publication number Publication date
EP1879216A1 (de) 2008-01-16
TWI353015B (en) 2011-11-21
EP1879216B1 (de) 2009-02-25
CN100550291C (zh) 2009-10-14
US20070289528A1 (en) 2007-12-20
CN101090064A (zh) 2007-12-19
DE602007000584D1 (de) 2009-04-09
TW200807540A (en) 2008-02-01
US8479753B2 (en) 2013-07-09
KR101042666B1 (ko) 2011-06-20
KR20070120032A (ko) 2007-12-21

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