ATE424555T1 - Sensorchip mit sich berührenden nichtmetallischen teilchen mit metallischer beschichtung - Google Patents

Sensorchip mit sich berührenden nichtmetallischen teilchen mit metallischer beschichtung

Info

Publication number
ATE424555T1
ATE424555T1 AT06724509T AT06724509T ATE424555T1 AT E424555 T1 ATE424555 T1 AT E424555T1 AT 06724509 T AT06724509 T AT 06724509T AT 06724509 T AT06724509 T AT 06724509T AT E424555 T1 ATE424555 T1 AT E424555T1
Authority
AT
Austria
Prior art keywords
metallic
transition metal
chip
particles
sensor chip
Prior art date
Application number
AT06724509T
Other languages
English (en)
Inventor
Reiner Dahint
Petra Buecker
Elka Trileva
Soeren Schilp
Michael Himmelhaus
Hatice Acunman
Original Assignee
Fujirebio Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujirebio Kk filed Critical Fujirebio Kk
Application granted granted Critical
Publication of ATE424555T1 publication Critical patent/ATE424555T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55—Specular reflectivity
    • G01N21/552—Attenuated total reflection
    • G01N21/553—Attenuated total reflection and using surface plasmons
    • G01N21/554—Attenuated total reflection and using surface plasmons detecting the surface plasmon resonance of nanostructured metals, e.g. localised surface plasmon resonance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
AT06724509T 2005-04-22 2006-04-21 Sensorchip mit sich berührenden nichtmetallischen teilchen mit metallischer beschichtung ATE424555T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05008931A EP1715326A1 (de) 2005-04-22 2005-04-22 Sensorchip mit einer Schicht aus miteinander verbundenen nicht-metallischen Partikeln mit einer metallischen Beschichtung

Publications (1)

Publication Number Publication Date
ATE424555T1 true ATE424555T1 (de) 2009-03-15

Family

ID=35520796

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06724509T ATE424555T1 (de) 2005-04-22 2006-04-21 Sensorchip mit sich berührenden nichtmetallischen teilchen mit metallischer beschichtung

Country Status (7)

Country Link
US (1) US8288166B2 (de)
EP (2) EP1715326A1 (de)
JP (1) JP5278676B2 (de)
AT (1) ATE424555T1 (de)
DE (1) DE602006005478D1 (de)
ES (1) ES2321228T3 (de)
WO (1) WO2006111414A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8355136B2 (en) 2005-12-16 2013-01-15 Indiana University Research And Technology Corporation Sub-micron surface plasmon resonance sensor systems
JP2009520188A (ja) * 2005-12-16 2009-05-21 インディアナ・ユニバーシティ・リサーチ・アンド・テクノロジー・コーポレーション サブミクロン表面プラズモン共鳴センサシステム
GB2447696A (en) 2007-03-23 2008-09-24 Univ Exeter Photonic biosensor arrays
US20080255425A1 (en) * 2007-04-13 2008-10-16 Ethicon Endo-Surgery, Inc. Nanoparticle treated medical devices
US9080942B2 (en) * 2007-04-18 2015-07-14 The Research Foundation for State University of New York Flexible multi-moduled nanoparticle-structured sensor array on polymer substrate and methods for manufacture
JP2009145189A (ja) * 2007-12-13 2009-07-02 Fujifilm Corp バイオセンサー
JP2009265062A (ja) * 2008-04-30 2009-11-12 Yasuro Niitome 分析用チップとその製造方法およびその分析方法
KR101251538B1 (ko) 2009-04-17 2013-04-08 (주)아벨리노 아벨리노 각막이상증 진단용 프라이머
KR101041606B1 (ko) * 2009-08-18 2011-06-15 (주)아벨리노 다중 스팟 금속 증착형 나노구조배열 각막이상증 진단용 핵산칩 및 이의 제조방법
JP5620154B2 (ja) * 2009-10-15 2014-11-05 公益財団法人神奈川科学技術アカデミー 中空微小体およびその作製方法
KR101125212B1 (ko) 2010-10-01 2012-03-21 (주)아벨리노 아벨리노 각막이상증 진단용 시스템
JP5709039B2 (ja) * 2010-10-21 2015-04-30 学校法人 東洋大学 表面増強分光用基板
WO2012077756A1 (ja) * 2010-12-08 2012-06-14 公立大学法人大阪府立大学 金属ナノ粒子集積構造体を利用した被検出物質の検出装置および方法
JP2013002817A (ja) * 2011-06-10 2013-01-07 Kyushu Univ 残留農薬検出方法および表面プラズモン共鳴センサ
JP5967756B2 (ja) * 2012-04-27 2016-08-10 学校法人 東洋大学 分光用基板
EP3486328B1 (de) 2013-03-15 2020-11-11 Avellino Lab USA, Inc. Verfahren zur verbesserten isolierung von genomischen dna-matrizen zum nachweis von allelen
US10889850B2 (en) 2013-03-15 2021-01-12 Avellino Lab Usa, Inc. Methods for improved isolation of genomic DNA templates for allele detection
KR20230007558A (ko) 2013-11-15 2023-01-12 아벨리노 랩 유에스에이, 인크. 안과 질환과 관련된 대립유전자의 멀티플렉스 검출 방법
US9646854B2 (en) * 2014-03-28 2017-05-09 Intel Corporation Embedded circuit patterning feature selective electroless copper plating
JP6507969B2 (ja) * 2015-09-25 2019-05-08 コニカミノルタ株式会社 ガス検知方法及びガス検知装置
JP6929865B2 (ja) 2015-11-13 2021-09-01 タラ ムーア 角膜ジストロフィーの治療方法
EP3258243B1 (de) * 2016-06-13 2019-05-08 WEISS UMWELTTECHNIK GmbH Sensoranordnung und verfahren zur bestimmung einer betauung
CN207832676U (zh) * 2017-11-27 2018-09-07 重庆科技学院 一种具有表面增强拉曼效应的传感器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05142604A (ja) * 1991-11-18 1993-06-11 Matsushita Electric Ind Co Ltd 非線形光学材料およびその製造方法
DE69836734D1 (de) * 1997-02-20 2007-02-08 Univ California Plasmon-schwingteilchen, methode und vorrichtung
US6344272B1 (en) * 1997-03-12 2002-02-05 Wm. Marsh Rice University Metal nanoshells
JPH111703A (ja) * 1997-06-06 1999-01-06 Hitachi Ltd 超微粒子の調製方法
JP3380744B2 (ja) 1998-05-19 2003-02-24 株式会社日立製作所 センサおよびこれを利用した測定装置
US6778316B2 (en) * 2001-10-24 2004-08-17 William Marsh Rice University Nanoparticle-based all-optical sensors
JP2003247936A (ja) * 2002-02-22 2003-09-05 Japan Science & Technology Corp 屈折率測定用センサ及びその製造方法
JP2005144569A (ja) * 2003-11-12 2005-06-09 Hitachi Ltd 二次元配列構造体基板および該基板から剥離した微粒子
WO2007129682A1 (en) * 2006-05-01 2007-11-15 Fujirebio Inc. Fluorescent non-metallic particles encapsulated in a metallic coating

Also Published As

Publication number Publication date
ES2321228T3 (es) 2009-06-03
EP1715326A1 (de) 2006-10-25
EP1875208A1 (de) 2008-01-09
WO2006111414A1 (en) 2006-10-26
EP1875208B1 (de) 2009-03-04
JP2008538414A (ja) 2008-10-23
JP5278676B2 (ja) 2013-09-04
US20090073447A1 (en) 2009-03-19
US8288166B2 (en) 2012-10-16
DE602006005478D1 (de) 2009-04-16

Similar Documents

Publication Publication Date Title
ATE424555T1 (de) Sensorchip mit sich berührenden nichtmetallischen teilchen mit metallischer beschichtung
MY150139A (en) Laminated body, method of manufacturing substrate, substrate and semiconductor device
EP2882267A3 (de) Verdrahtungssubstrat, lichtemittierende Vorrichtung und Verfahren zur Herstellung eines Verdrahtungssubstrats
EA201591009A1 (ru) Основа, снабженная многослойной системой с частично металлическими слоями, а также остекление и способ
WO2007050212A3 (en) Platinum electrode surface coating and method for manufacturing the same
EP1930471A3 (de) Barriereschicht, Verbundartikel damit, elektroaktive Vorrichtung und Verfahren dafür
TW200710929A (en) Semiconductor chip with coil element over passivation layer
EP1657756A3 (de) Folie zur Ummantelung optischer Halbleiterbauelemente und Verfahren zur Herstellung einer optischen Halbleitervorrichtung mit der Folie
EP2072483A3 (de) Keramik-Kupferfolienbindungsverfahren
SG131872A1 (en) Layer arrangement for the formation of a coating on a surface of a substrate,coating method,and substrate with a layer arrangement
WO2012015982A3 (en) Electronics substrate with enhanced direct bonded metal
WO2005101499A3 (en) Methods of forming solder bumps on exposed metal pads and related structures
WO2007117829A3 (en) Method for bonding a semiconductor substrate to a metal substrate
WO2010011009A9 (ko) 전자부품 모듈용 금속 기판과 이를 포함하는 전자부품 모듈 및 전자부품 모듈용 금속 기판 제조방법
WO2009009641A3 (en) Coating for decorative metals with improved mar and scratch resistance and methods of application
TW200720204A (en) Glass substrate and a manufacturing method thereof
CA2606182A1 (en) Substrate of target substance detection element to be used in apparatus for detecting target substance by utilizing surface plasmon resonance and detection element and detection apparatus using same
WO2007078686A3 (en) Method of polishing a semiconductor-on-insulator structure
TW200703726A (en) Enamel substrate for mounting light emitting element and manufacturing method thereof, light emitting element module, illumination apparatus, display apparatus, and traffic signal device
EP2495354A4 (de) Plattiertes element aus sn-rückfluss
WO2007087769A3 (de) Optoelektronisches halbleiterbauelement mit stromaufweitungsschicht
ATE500063T1 (de) Verfahren zur herstellung von gebundenen substraten und dazugehöriges substrat
WO2007058913A3 (en) Hydrogen transport membrane fabrication method
TW200640826A (en) Ceramic member and method for producing the same
TW200606036A (en) Thin metal sheet having a pattern and manufacturing method therefor

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties