ATE427032T1 - Abschirmvorrichtung fur elektromagnetische interferenz und herstellungsverfahren dafur - Google Patents

Abschirmvorrichtung fur elektromagnetische interferenz und herstellungsverfahren dafur

Info

Publication number
ATE427032T1
ATE427032T1 AT07445031T AT07445031T ATE427032T1 AT E427032 T1 ATE427032 T1 AT E427032T1 AT 07445031 T AT07445031 T AT 07445031T AT 07445031 T AT07445031 T AT 07445031T AT E427032 T1 ATE427032 T1 AT E427032T1
Authority
AT
Austria
Prior art keywords
side walls
electromagnetic interference
generally
shielding apparatus
production method
Prior art date
Application number
AT07445031T
Other languages
English (en)
Inventor
Gerald R English
Paul W Crotty Jr
Daniel C Green
Original Assignee
Laird Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laird Technologies Inc filed Critical Laird Technologies Inc
Application granted granted Critical
Publication of ATE427032T1 publication Critical patent/ATE427032T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
AT07445031T 2007-01-25 2007-08-30 Abschirmvorrichtung fur elektromagnetische interferenz und herstellungsverfahren dafur ATE427032T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/657,932 US7488902B2 (en) 2007-01-25 2007-01-25 Electromagnetic interference shielding apparatus and methods of making the same

Publications (1)

Publication Number Publication Date
ATE427032T1 true ATE427032T1 (de) 2009-04-15

Family

ID=38753491

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07445031T ATE427032T1 (de) 2007-01-25 2007-08-30 Abschirmvorrichtung fur elektromagnetische interferenz und herstellungsverfahren dafur

Country Status (9)

Country Link
US (1) US7488902B2 (de)
EP (1) EP1951021B1 (de)
KR (2) KR101023625B1 (de)
CN (1) CN101232798B (de)
AT (1) ATE427032T1 (de)
DE (1) DE602007000777D1 (de)
MY (1) MY147101A (de)
TW (1) TWI339562B (de)
WO (1) WO2008136864A1 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7684213B2 (en) * 2006-07-06 2010-03-23 Lsi Corporation CRU interlocking EMI shield
US7729130B1 (en) * 2007-01-02 2010-06-01 Fourte Design & Development LLC Transceiver module with collapsible fingers that form a sealed EMI shield
WO2008093559A1 (ja) * 2007-01-29 2008-08-07 Nec Corporation 電子機器のシールド構造、シールド部材及びこれを備える電子機器
US8031485B2 (en) * 2007-09-07 2011-10-04 Autosplice, Inc. Electronic shielding apparatus and methods
CN101730459B (zh) * 2008-10-17 2013-02-20 深圳富泰宏精密工业有限公司 屏蔽罩及其制作方法
CN201336797Y (zh) * 2008-12-12 2009-10-28 鸿富锦精密工业（深圳）有限公司 屏蔽罩
US20100157566A1 (en) * 2008-12-19 2010-06-24 Robert Bogursky Electronic shield assembly and methods
US20130033843A1 (en) * 2011-08-03 2013-02-07 Laird Technologies, Inc. Board level electromagnetic interference (emi) shields including releasably attached/detachable pickup members
US20140218851A1 (en) * 2013-02-01 2014-08-07 Microsoft Corporation Shield Can
US9462732B2 (en) 2013-03-13 2016-10-04 Laird Technologies, Inc. Electromagnetic interference shielding (EMI) apparatus including a frame with drawn latching features
US9538693B2 (en) * 2013-03-15 2017-01-03 A.K. Stamping Company, Inc. Aluminum EMI / RF shield
KR102334326B1 (ko) * 2014-02-24 2021-12-02 삼성전자주식회사 하드웨어 쉴드 장치 및 이를 포함하는 전자 장치
WO2016077683A1 (en) 2014-11-14 2016-05-19 Laird Technologies, Inc. Solderable two piece board level shields
DE102015001148B4 (de) * 2015-01-30 2019-04-11 e.solutions GmbH Anordnung und Verfahren zur elektromagnetischen Abschirmung
WO2017087136A1 (en) 2015-11-20 2017-05-26 Laird Technologies, Inc. Board level shield including an integrated heat sink
CN205430760U (zh) * 2016-02-02 2016-08-03 京东方科技集团股份有限公司 一种印刷线路板的支撑结构
US9832915B2 (en) 2016-02-05 2017-11-28 Laird Technologies, Inc. Pressure locking board level shield assemblies
US10624245B2 (en) 2016-06-23 2020-04-14 Laird Technologies, Inc. Laser weldable brackets for attachment of heat sinks to board level shields
CN206136580U (zh) * 2016-09-14 2017-04-26 深圳市信维通信股份有限公司 一种屏蔽罩框架
DE102016119545A1 (de) * 2016-10-13 2018-04-19 HELLA GmbH & Co. KGaA Radareinrichtung mit einem Abschirmmittel
US10542644B2 (en) 2016-12-14 2020-01-21 A.K. Stamping Company, Inc. Two-piece solderable shield
US10893636B2 (en) * 2017-03-10 2021-01-12 Laird Technologies Inc. Method for forming a pickup area of a board level shield
US10736246B2 (en) * 2018-09-28 2020-08-04 Apple Inc. Electromagnetic interference shielding having a magnetically attracted shield arm
USD895623S1 (en) 2018-10-05 2020-09-08 Laird Technologies, Inc. Frame for shielding assembly
US10653049B2 (en) 2018-10-05 2020-05-12 Laird Technologies, Inc. Frames for shielding assemblies and shielding assemblies including the same
US10653048B1 (en) 2018-11-21 2020-05-12 Laird Technologies, Inc. Frames for shielding assemblies and shielding assemblies including the same
US11083118B2 (en) 2019-01-09 2021-08-03 Laird Technologies, Inc. Frames for electromagnetic interference (EMI) shielding assemblies including detachable pickup members
CN111954451B (zh) * 2019-05-16 2023-09-19 莱尔德电子材料(深圳)有限公司 板级屏蔽罩
GB2601333A (en) * 2020-11-26 2022-06-01 Continental Automotive Gmbh Electromagnetic interference shield device
US11917801B1 (en) * 2023-04-28 2024-02-27 Hewlett Packard Enterprise Development Lp Electromagnetic interference shield

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3721746A (en) * 1971-10-01 1973-03-20 Motorola Inc Shielding techniques for r.f. circuitry
US5365410A (en) * 1991-10-22 1994-11-15 Nokia Mobile Phones Ltd. Electromagnetic compatibility enclosure
US5175395A (en) * 1991-11-27 1992-12-29 Rockwell International Corporation Electromagnetic shield
US5354951A (en) * 1993-03-15 1994-10-11 Leader Tech, Inc. Circuit board component shielding enclosure and assembly
EP0634581B1 (de) * 1993-07-12 1997-01-29 Agfa-Gevaert N.V. Plattenzusammenbau
US5436802A (en) * 1994-03-16 1995-07-25 Motorola Method and apparatus for shielding an electrical circuit that is disposed on a substrate
US5414597A (en) * 1994-05-04 1995-05-09 Ford Motor Company Shielded circuit module
US5495399A (en) * 1994-07-05 1996-02-27 Motorola, Inc. Shield with detachable grasp support member
GB2297868B (en) * 1995-02-07 1999-04-28 Nokia Mobile Phones Ltd A shielding device
US5895994A (en) * 1997-01-30 1999-04-20 General Electric Company Dynamoelectric machine
US6136131A (en) * 1998-06-02 2000-10-24 Instrument Specialties Company, Inc. Method of shielding and obtaining access to a component on a printed circuit board
JP3270028B2 (ja) 1999-09-10 2002-04-02 株式会社ソニー・コンピュータエンタテインメント 電磁シールド板、電磁シールド構造体及びエンタテインメント装置
TW477516U (en) * 2000-04-18 2002-02-21 Hon Hai Prec Ind Co Ltd Shielding structure of electronic device
US6552261B2 (en) * 2001-04-27 2003-04-22 Bmi, Inc. Push-fit shield
US6649827B2 (en) * 2001-09-28 2003-11-18 Siemens Information & Communication Moblie, Llc Radio frequency shield enclosure for a printed circuit board
US6949706B2 (en) * 2001-09-28 2005-09-27 Siemens Information And Communication Mobile, Llc Radio frequency shield for electronic equipment
US6711032B2 (en) * 2001-11-20 2004-03-23 Mitsubishi Wireless Communications, Inc. Shield and method for shielding an electronic device
TW545611U (en) * 2002-01-22 2003-08-01 Chi Mei Optoelectronics Corp Liquid crystal display device and housing thereof
KR20030076470A (ko) * 2003-06-19 2003-09-26 예원플라즈마 주식회사 전자제품의 보드내 플라스틱 캔을 이용한 이엠아이 및이에스디 차폐 장치 및 그 제조방법
TWI316387B (en) * 2003-12-30 2009-10-21 Asustek Comp Inc Electronic apparatus and shielding module thereof
CN100463594C (zh) 2005-06-18 2009-02-18 鸿富锦精密工业（深圳）有限公司 具有散热功能的电磁屏蔽装置

Also Published As

Publication number Publication date
KR20100046118A (ko) 2010-05-06
WO2008136864A1 (en) 2008-11-13
KR101054872B1 (ko) 2011-08-05
EP1951021A1 (de) 2008-07-30
EP1951021B1 (de) 2009-03-25
US7488902B2 (en) 2009-02-10
CN101232798B (zh) 2011-01-19
TW200833235A (en) 2008-08-01
KR101023625B1 (ko) 2011-03-22
US20080179086A1 (en) 2008-07-31
TWI339562B (en) 2011-03-21
DE602007000777D1 (de) 2009-05-07
MY147101A (en) 2012-10-31
CN101232798A (zh) 2008-07-30
KR20080070495A (ko) 2008-07-30

Similar Documents

Publication Publication Date Title
ATE427032T1 (de) Abschirmvorrichtung fur elektromagnetische interferenz und herstellungsverfahren dafur
ATE497688T1 (de) Elektromagnetische abschirmungen und zugehöriges herstellungsverfahren
ATE557576T1 (de) Leiterplatine mit elektronischem bauelement
WO2010030619A3 (en) Shield with integrated mating connector guides
EP2164311A4 (de) Leiterplatte und verfahren zu ihrer herstellung
CA128434S (en) Nightlight for an electrical device
EP2930722A4 (de) Verfahren zur herstellung eines leitfähigen films und einer leiterplatte
EP2650828A3 (de) UICC-Vorrichtung und zugehörige Verfahren
CA128433S (en) Nightlight for an electrical device
ATE518262T1 (de) Batterieeinrichtung
TW200715556A (en) Electronic device with a gate electrode having at least two portions and a process for forming the electronic device
USD672764S1 (en) Cover of an electronic device having surface ornamentation
DE602006006106D1 (de) Vorrichtung zum Schutz einer elektrische Schaltung
EP2007931A4 (de) Polyimidsubstrat und verfahren zur herstellung einer leiterplatte damit
NL2001706A1 (nl) Printed circuit board assembly and manufacturing method for the same.
EP1929519A4 (de) Gekapselte elektronische bauelemente und verfahren zu ihrer herstellung
USD704686S1 (en) Cover of an electronic device having surface ornamentation
USD602886S1 (en) Shield design
ATE524406T1 (de) Anlagengehäuse
USD743559S1 (en) Dynamic urine monitoring device
DE502005001367D1 (de) Vorrichtung zur elektrischen Verbindung von Kontaktstiften mit Anschlussstiften eines von der Vorrichtung ausgebildeten Steckverbinders
ATE520104T1 (de) Mittel zum verbinden einer frontblende eines quaderförmigen einbaugerätes mit dessen einbaugehäuseteil
ATE541348T1 (de) Montagerahmen für anwendungsmodule
USD670683S1 (en) Cover of an electronic device having surface ornamentation
DE60211364D1 (de) Verfahren zur herstellung eines elektronischen bauelements und elektronisches bauelement davon hergestellt

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties