ATE428101T1 - Eine komponentenbestuckungseinheit und ein komponentenbestuckungsgerat welches eine solche komponentenbestuckungseinheit beinhaltet - Google Patents

Eine komponentenbestuckungseinheit und ein komponentenbestuckungsgerat welches eine solche komponentenbestuckungseinheit beinhaltet

Info

Publication number
ATE428101T1
ATE428101T1 AT07075159T AT07075159T ATE428101T1 AT E428101 T1 ATE428101 T1 AT E428101T1 AT 07075159 T AT07075159 T AT 07075159T AT 07075159 T AT07075159 T AT 07075159T AT E428101 T1 ATE428101 T1 AT E428101T1
Authority
AT
Austria
Prior art keywords
component placement
component
placement unit
nozzle
sensor
Prior art date
Application number
AT07075159T
Other languages
English (en)
Inventor
Joseph Louis Horijon
Original Assignee
Assembleon Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL1031471A external-priority patent/NL1031471C2/nl
Application filed by Assembleon Bv filed Critical Assembleon Bv
Application granted granted Critical
Publication of ATE428101T1 publication Critical patent/ATE428101T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Surface Heating Bodies (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
AT07075159T 2006-03-30 2007-02-27 Eine komponentenbestuckungseinheit und ein komponentenbestuckungsgerat welches eine solche komponentenbestuckungseinheit beinhaltet ATE428101T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1031471A NL1031471C2 (nl) 2006-03-30 2006-03-30 Componentplaatsingseenheid alsmede componentplaatsingsinrichting die is voorzien van een dergelijke componentplaatsingseenheid.
NL1033000A NL1033000C2 (nl) 2006-03-30 2006-12-05 Componentplaatsingseenheid alsmede componentplaatsingsinrichting die is voorzien van een dergelijke componentplaatsingseenheid.

Publications (1)

Publication Number Publication Date
ATE428101T1 true ATE428101T1 (de) 2009-04-15

Family

ID=38055201

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07075159T ATE428101T1 (de) 2006-03-30 2007-02-27 Eine komponentenbestuckungseinheit und ein komponentenbestuckungsgerat welches eine solche komponentenbestuckungseinheit beinhaltet

Country Status (7)

Country Link
US (1) US7941913B2 (de)
EP (1) EP1840503B1 (de)
KR (1) KR101307768B1 (de)
AT (1) ATE428101T1 (de)
DE (1) DE602007000832D1 (de)
NL (1) NL1033000C2 (de)
TW (1) TW200746943A (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1033000C2 (nl) 2006-03-30 2007-08-21 Assembleon Nv Componentplaatsingseenheid alsmede componentplaatsingsinrichting die is voorzien van een dergelijke componentplaatsingseenheid.
NL1036507C2 (nl) * 2009-02-03 2010-08-04 Assembleon Bv Inrichting geschikt voor het met behulp van een sensor vervaardigen van een afbeelding, alsmede componentplaatsingseenheid voorzien van een dergelijke inrichting.
NL1036120C (nl) * 2008-10-28 2010-04-29 Assembleon Bv Verplaatsingsinrichting.
EP2343165A1 (de) * 2010-01-07 2011-07-13 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO System und Verfahren zum Aufnehmen und Platzieren von Chips
CH711570B1 (de) 2015-09-28 2019-02-15 Besi Switzerland Ag Vorrichtung für die Montage von Bauelementen auf einem Substrat.
US10517199B2 (en) 2015-12-17 2019-12-24 Assembléon B.V. Methods of positioning a component in a desired position on a board, pick and place machines, and sensors for such pick and place machines
CN105651179B (zh) * 2016-03-16 2018-07-27 苏州富强科技有限公司 一种补光可调且自动装夹的视觉成像测量系统
CN105806252B (zh) * 2016-03-16 2018-07-27 苏州富强科技有限公司 一种补光可调且可自动上下料的视觉成像测量系统
KR102236269B1 (ko) * 2018-05-09 2021-04-05 한화정밀기계 주식회사 부품 실장 장치
US11428880B2 (en) * 2020-07-31 2022-08-30 Openlight Photonics, Inc. Optical based placement of an optical compontent using a pick and place machine

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5114230A (en) * 1979-09-07 1992-05-19 Diffracto Ltd. Electro-optical inspection
JPS60103700A (ja) * 1983-11-11 1985-06-07 株式会社日立製作所 部品の位置決め装置
JPS6150002A (ja) * 1984-08-20 1986-03-12 Matsushita Electric Ind Co Ltd 相対位置検出装置
GB2183820A (en) 1985-11-09 1987-06-10 Dynapert Precima Ltd Electronic component placement
NL9300631A (nl) * 1993-04-14 1994-11-01 Hans Gerard Van Den Brink Optisch systeem voor het onderling positioneren van een sporendrager en component met aansluitpootjes.
JPH0715171A (ja) * 1993-06-28 1995-01-17 Matsushita Electric Ind Co Ltd 部品装着装置
US5559727A (en) * 1994-02-24 1996-09-24 Quad Systems Corporation Apparatus and method for determining the position of a component prior to placement
JP3842287B2 (ja) * 1994-08-11 2006-11-08 サイバーオプティックス・コーポレーション 高精度半導体部品位置合せシステム
KR100287787B1 (ko) * 1998-09-24 2001-04-16 이중구 부품위치정렬장치및이를이용한정렬방법
DE19982405T1 (de) * 1998-11-03 2001-04-26 Cyberoptics Corp Tomographische Rekonstruktion elektronischer Komponenten aus Schattenbild-Sensordaten
CN1330494C (zh) * 2002-09-30 2007-08-08 索尼株式会社 电子部件对准方法及其所使用的装置
EP1588597A1 (de) * 2003-01-14 2005-10-26 Koninklijke Philips Electronics N.V. Zum plazieren einer komponente auf einem substrat geegnetemaschine sowie verfahren dafür
NL1033000C2 (nl) 2006-03-30 2007-08-21 Assembleon Nv Componentplaatsingseenheid alsmede componentplaatsingsinrichting die is voorzien van een dergelijke componentplaatsingseenheid.

Also Published As

Publication number Publication date
US7941913B2 (en) 2011-05-17
KR101307768B1 (ko) 2013-09-12
US20070229851A1 (en) 2007-10-04
EP1840503A1 (de) 2007-10-03
NL1033000C2 (nl) 2007-08-21
NL1033000A1 (nl) 2007-03-27
KR20070098697A (ko) 2007-10-05
DE602007000832D1 (de) 2009-05-20
TW200746943A (en) 2007-12-16
EP1840503B1 (de) 2009-04-08

Similar Documents

Publication Publication Date Title
DE602007000832D1 (de) Eine Komponentenbestückungseinheit und ein Komponentenbestückungsgerät welches eine solche Komponentenbestückungseinheit beinhaltet
WO2018226164A3 (en) DECENTRALIZED AUTOMATED ADDITIVE MANUFACTURING METHOD AND DEVICE
EP1708278A3 (de) Optisches Anordnungsmodul, Linsenhalter und Verfahren zur Herstellung
EP2458844A3 (de) Abbildungsvorrichtung
WO2007097841A3 (en) Portable coordinate measurement machine with integrated line laser scanner
TW200951529A (en) Camera module comprising three members
DE602005018881D1 (de) Lichtemittierende Vorrichtung mit optischer Resonanzschicht
WO2007123249A3 (en) Alignment method, imprint method, alignment apparatus, and position measurement method
DE102005018773A8 (de) Vorrichtung zur Sicht der Umgebung eines Fahrzeugs
EP2084752A4 (de) Mit einem transparenten leitfähigen film ausgestattetes substrat für eine fotoelektrische wandlereinrichtung, verfahren zur herstellung des substrats und das substrat verwendende fotoelektrische wandlereinrichtung
ATE410354T1 (de) Einparkvorrichtung
ATE453120T1 (de) Labor-roboter-anordnung
SG126883A1 (en) Lithographic apparatus and positioning apparatus
WO2007095556A3 (en) Digital image acquisition device with built in dust and sensor mapping capability
WO2007030226A3 (en) Backside thinned image sensor with integrated lens stack
EP2100908A4 (de) Wärmehärtbare harzzusammensetzung für die lichtreflexion, verfahren zur herstellung der harzzusammensetzung und montagesubstrat für optisches halbleiterlelement und optisches halbleiterelement unter verwendung der harzzusammensetzung
WO2008102771A1 (ja) サーバ装置
FR2896871B1 (fr) Dispositif de mesure pour la mesure optique d'un objet.
FR2883154B1 (fr) Dispositif de mesure du teint
ZA200708594B (en) Photothermal test camera provided with an optical device for extending a laser beam section
EP2863190A3 (de) Optisches Sensormodul
WO2009041003A1 (ja) 検査装置及び検査方法
WO2008146644A1 (ja) 撮像装置及びその製造方法、並びに該撮像装置を搭載した携帯情報端末及び撮像機器
TW200727501A (en) Image sensor module and method for manufacturing the same
EP1869718A4 (de) Led-einrichtung und optischer detektor damit für einen geldscheinvalidierer

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties