ATE431441T1 - Verfahren zur abscheidung von elektrolytfilmen - Google Patents

Verfahren zur abscheidung von elektrolytfilmen

Info

Publication number
ATE431441T1
ATE431441T1 AT03745631T AT03745631T ATE431441T1 AT E431441 T1 ATE431441 T1 AT E431441T1 AT 03745631 T AT03745631 T AT 03745631T AT 03745631 T AT03745631 T AT 03745631T AT E431441 T1 ATE431441 T1 AT E431441T1
Authority
AT
Austria
Prior art keywords
deposit
vapor
phase
component
depositing
Prior art date
Application number
AT03745631T
Other languages
English (en)
Inventor
Yevgen Kalynushkin
Elena Shembel
Peter Novak
Chris Flury
Original Assignee
Ener1 Battery Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ener1 Battery Company filed Critical Ener1 Battery Company
Application granted granted Critical
Publication of ATE431441T1 publication Critical patent/ATE431441T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/083Oxides of refractory metals or yttrium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Secondary Cells (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Inorganic Insulating Materials (AREA)
  • Conductive Materials (AREA)
  • Glass Compositions (AREA)
  • Fuel Cell (AREA)
AT03745631T 2002-03-27 2003-03-26 Verfahren zur abscheidung von elektrolytfilmen ATE431441T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/108,140 US7208195B2 (en) 2002-03-27 2002-03-27 Methods and apparatus for deposition of thin films
PCT/US2003/009375 WO2003083166A1 (en) 2002-03-27 2003-03-26 Methods and apparatus for deposition of thin films

Publications (1)

Publication Number Publication Date
ATE431441T1 true ATE431441T1 (de) 2009-05-15

Family

ID=28452812

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03745631T ATE431441T1 (de) 2002-03-27 2003-03-26 Verfahren zur abscheidung von elektrolytfilmen

Country Status (7)

Country Link
US (2) US7208195B2 (de)
EP (1) EP1497479B1 (de)
AT (1) ATE431441T1 (de)
AU (1) AU2003226086A1 (de)
CA (1) CA2518421A1 (de)
DE (1) DE60327621D1 (de)
WO (1) WO2003083166A1 (de)

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US20070264564A1 (en) 2006-03-16 2007-11-15 Infinite Power Solutions, Inc. Thin film battery on an integrated circuit or circuit board and method thereof
US20050271893A1 (en) * 2004-06-04 2005-12-08 Applied Microstructures, Inc. Controlled vapor deposition of multilayered coatings adhered by an oxide layer
US7700155B1 (en) * 2004-04-08 2010-04-20 Novellus Systems, Inc. Method and apparatus for modulation of precursor exposure during a pulsed deposition process
JP4925569B2 (ja) * 2004-07-08 2012-04-25 ローム株式会社 有機エレクトロルミネッセント素子
US8900695B2 (en) * 2007-02-23 2014-12-02 Applied Microstructures, Inc. Durable conformal wear-resistant carbon-doped metal oxide-comprising coating
US20080248263A1 (en) * 2007-04-02 2008-10-09 Applied Microstructures, Inc. Method of creating super-hydrophobic and-or super-hydrophilic surfaces on substrates, and articles created thereby
US8236379B2 (en) * 2007-04-02 2012-08-07 Applied Microstructures, Inc. Articles with super-hydrophobic and-or super-hydrophilic surfaces and method of formation
JP2008311277A (ja) * 2007-06-12 2008-12-25 Elpida Memory Inc 成膜処理装置および成膜処理方法
CN101903560B (zh) 2007-12-21 2014-08-06 无穷动力解决方案股份有限公司 用于电解质膜的溅射靶的方法
US8518581B2 (en) 2008-01-11 2013-08-27 Inifinite Power Solutions, Inc. Thin film encapsulation for thin film batteries and other devices
JP2012500610A (ja) 2008-08-11 2012-01-05 インフィニット パワー ソリューションズ, インコーポレイテッド 電磁エネルギー獲得ための統合コレクタ表面を有するエネルギーデバイスおよびその方法
CN102576828B (zh) 2009-09-01 2016-04-20 萨普拉斯特研究有限责任公司 具有集成薄膜电池的印刷电路板
EP2577777B1 (de) 2010-06-07 2016-12-28 Sapurast Research LLC Wiederaufladbare elektrochemische vorrichtung von hoher dichte
US8888918B2 (en) 2011-03-31 2014-11-18 Seagate Technology Llc Vapor collection
WO2013028977A2 (en) * 2011-08-24 2013-02-28 Mustang Vacuum Systems, Inc. Apparatus and method for the evaporation and deposition of materials
US9692039B2 (en) 2012-07-24 2017-06-27 Quantumscape Corporation Nanostructured materials for electrochemical conversion reactions
US9353439B2 (en) 2013-04-05 2016-05-31 Lam Research Corporation Cascade design showerhead for transient uniformity
US10158115B2 (en) * 2013-06-06 2018-12-18 Quantumscape Corporation Flash evaporation of solid state battery component
WO2015130831A1 (en) 2014-02-25 2015-09-03 Quantumscape Corporation Hybrid electrodes with both intercalation and conversion materials
WO2016025866A1 (en) 2014-08-15 2016-02-18 Quantumscape Corporation Doped conversion materials for secondary battery cathodes
US10023959B2 (en) 2015-05-26 2018-07-17 Lam Research Corporation Anti-transient showerhead
EP4395800A4 (de) * 2021-08-30 2026-03-18 Prerna Goradia Antimikrobielle nanolaminate unter verwendung von dampfabgeschiedenen verfahren wie atomlagenabscheidung
CN120666294B (zh) * 2025-08-20 2025-11-28 沈阳诺思真空技术有限公司 基于高纯铯的光电阴极铯膜大面积均匀分子束蒸发沉积方法

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Also Published As

Publication number Publication date
EP1497479A1 (de) 2005-01-19
EP1497479B1 (de) 2009-05-13
US20070134427A1 (en) 2007-06-14
WO2003083166A1 (en) 2003-10-09
AU2003226086A1 (en) 2003-10-13
US7208195B2 (en) 2007-04-24
EP1497479A4 (de) 2006-10-18
DE60327621D1 (de) 2009-06-25
CA2518421A1 (en) 2003-10-09
US20030185977A1 (en) 2003-10-02

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