ATE434777T1 - Methode zur herstellung mehrschichtiger reflektierender extrem-ultraviolett-lithograaphie-masken-rohlin e - Google Patents
Methode zur herstellung mehrschichtiger reflektierender extrem-ultraviolett-lithograaphie-masken-rohlin eInfo
- Publication number
- ATE434777T1 ATE434777T1 AT04778644T AT04778644T ATE434777T1 AT E434777 T1 ATE434777 T1 AT E434777T1 AT 04778644 T AT04778644 T AT 04778644T AT 04778644 T AT04778644 T AT 04778644T AT E434777 T1 ATE434777 T1 AT E434777T1
- Authority
- AT
- Austria
- Prior art keywords
- extreme ultraviolet
- lithography mask
- ultraviolet lithography
- mask blank
- producing multi
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/067—Construction details
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/631,171 US6998202B2 (en) | 2003-07-31 | 2003-07-31 | Multilayer reflective extreme ultraviolet lithography mask blanks |
| PCT/US2004/023237 WO2005013003A2 (en) | 2003-07-31 | 2004-07-16 | Multilayer reflective extreme ultraviolet lithography mask blanks |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE434777T1 true ATE434777T1 (de) | 2009-07-15 |
Family
ID=34104031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04778644T ATE434777T1 (de) | 2003-07-31 | 2004-07-16 | Methode zur herstellung mehrschichtiger reflektierender extrem-ultraviolett-lithograaphie-masken-rohlin e |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6998202B2 (de) |
| EP (1) | EP1660941B1 (de) |
| KR (1) | KR100802014B1 (de) |
| CN (1) | CN1580957B (de) |
| AT (1) | ATE434777T1 (de) |
| DE (1) | DE602004021705D1 (de) |
| TW (1) | TWI287171B (de) |
| WO (1) | WO2005013003A2 (de) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8722569B2 (en) * | 2006-03-13 | 2014-05-13 | E I Du Pont De Nemours And Company | Peroxide decomposition catalyst particles |
| US8663866B2 (en) | 2006-03-13 | 2014-03-04 | E I Du Pont De Nemours And Company | Stable proton exchange membranes and membrane electrode assemblies |
| TWI417647B (zh) * | 2006-06-08 | 2013-12-01 | 旭硝子股份有限公司 | Euv微影術用之反射性空白遮光罩及用於彼之具有功能性薄膜的基板 |
| JP4910856B2 (ja) * | 2006-06-08 | 2012-04-04 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランク、および該マスクブランク用の機能膜付基板 |
| JP5348866B2 (ja) * | 2007-09-14 | 2013-11-20 | Hoya株式会社 | マスクの製造方法 |
| CN102687071B (zh) * | 2009-12-09 | 2013-12-11 | 旭硝子株式会社 | 带反射层的euv光刻用衬底、euv光刻用反射型掩模坯料、euv光刻用反射型掩模、和该带反射层的衬底的制造方法 |
| US8679707B2 (en) * | 2012-08-01 | 2014-03-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of fabricating a lithography mask |
| US9341941B2 (en) | 2013-08-01 | 2016-05-17 | Samsung Electronics Co., Ltd. | Reflective photomask blank, reflective photomask, and integrated circuit device manufactured by using reflective photomask |
| US9075316B2 (en) | 2013-11-15 | 2015-07-07 | Globalfoundries Inc. | EUV mask for use during EUV photolithography processes |
| US20170017146A1 (en) * | 2015-07-13 | 2017-01-19 | Applied Materials, Inc. | Process for removing contamination on ruthenium surface |
| US10468149B2 (en) | 2017-02-03 | 2019-11-05 | Globalfoundries Inc. | Extreme ultraviolet mirrors and masks with improved reflectivity |
| KR102402767B1 (ko) | 2017-12-21 | 2022-05-26 | 삼성전자주식회사 | 극자외선 마스크 블랭크, 극자외선 마스크 블랭크를 이용하여 제조된 포토마스크, 포토마스크를 이용한 리소그래피 장치 및 포토마스크를 이용한 반도체 장치 제조 방법 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI267704B (en) * | 1999-07-02 | 2006-12-01 | Asml Netherlands Bv | Capping layer for EUV optical elements |
| US20030008148A1 (en) * | 2001-07-03 | 2003-01-09 | Sasa Bajt | Optimized capping layers for EUV multilayers |
| US6641959B2 (en) * | 2001-08-09 | 2003-11-04 | Intel Corporation | Absorberless phase-shifting mask for EUV |
| US6607862B2 (en) * | 2001-08-24 | 2003-08-19 | Intel Corporation | Damascene extreme ultraviolet lithography alternative phase shift photomask and method of making |
| DE10156366B4 (de) * | 2001-11-16 | 2007-01-11 | Infineon Technologies Ag | Reflexionsmaske und Verfahren zur Herstellung der Reflexionsmaske |
| JP4158960B2 (ja) | 2002-02-25 | 2008-10-01 | Hoya株式会社 | 露光用反射型マスクブランク及び露光用反射型マスク |
| US6756163B2 (en) * | 2002-06-27 | 2004-06-29 | Intel Corporation | Re-usable extreme ultraviolet lithography multilayer mask blank |
| EP1394815B1 (de) | 2002-08-28 | 2011-06-22 | ASML Netherlands B.V. | Lithographiegerät mit einem Mo/Si Mehrfachschichtenspiegel mit einer Schutzschicht |
| JP4825598B2 (ja) * | 2006-06-23 | 2011-11-30 | 株式会社ミツトヨ | 画像測定装置の校正方法 |
-
2003
- 2003-07-31 US US10/631,171 patent/US6998202B2/en not_active Expired - Fee Related
-
2004
- 2004-07-16 DE DE602004021705T patent/DE602004021705D1/de not_active Expired - Lifetime
- 2004-07-16 EP EP04778644A patent/EP1660941B1/de not_active Expired - Lifetime
- 2004-07-16 KR KR1020067001935A patent/KR100802014B1/ko not_active Expired - Fee Related
- 2004-07-16 AT AT04778644T patent/ATE434777T1/de not_active IP Right Cessation
- 2004-07-16 WO PCT/US2004/023237 patent/WO2005013003A2/en not_active Ceased
- 2004-07-20 TW TW093121615A patent/TWI287171B/zh not_active IP Right Cessation
- 2004-07-30 CN CN2004100587680A patent/CN1580957B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE602004021705D1 (de) | 2009-08-06 |
| CN1580957A (zh) | 2005-02-16 |
| TWI287171B (en) | 2007-09-21 |
| EP1660941A2 (de) | 2006-05-31 |
| US6998202B2 (en) | 2006-02-14 |
| KR100802014B1 (ko) | 2008-02-12 |
| WO2005013003A2 (en) | 2005-02-10 |
| TW200508789A (en) | 2005-03-01 |
| EP1660941B1 (de) | 2009-06-24 |
| CN1580957B (zh) | 2010-05-26 |
| US20050026046A1 (en) | 2005-02-03 |
| WO2005013003A3 (en) | 2005-08-11 |
| KR20060032211A (ko) | 2006-04-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |