ATE435445T1 - Verfahren zur erzeugung eines jetting-programms - Google Patents

Verfahren zur erzeugung eines jetting-programms

Info

Publication number
ATE435445T1
ATE435445T1 AT04800331T AT04800331T ATE435445T1 AT E435445 T1 ATE435445 T1 AT E435445T1 AT 04800331 T AT04800331 T AT 04800331T AT 04800331 T AT04800331 T AT 04800331T AT E435445 T1 ATE435445 T1 AT E435445T1
Authority
AT
Austria
Prior art keywords
deposit
data
pattern
component
substrate
Prior art date
Application number
AT04800331T
Other languages
English (en)
Inventor
Hn Jens Byl
H Kan Sandell
William Holm
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Application granted granted Critical
Publication of ATE435445T1 publication Critical patent/ATE435445T1/de

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/4097—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by using design data to control NC machines, e.g. CAD/CAM
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/34—Director, elements to supervisory
    • G05B2219/34342—Matching closest patterns stored in database with actual components
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45235—Dispensing adhesive, solder paste, for pcb
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Record Information Processing For Printing (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Stored Programmes (AREA)
  • Cold Cathode And The Manufacture (AREA)
AT04800331T 2003-11-13 2004-11-15 Verfahren zur erzeugung eines jetting-programms ATE435445T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0302985A SE0302985D0 (sv) 2003-11-13 2003-11-13 A method for generating a jetting program
PCT/SE2004/001668 WO2005048678A2 (en) 2003-11-13 2004-11-15 A method for generating a jetting program

Publications (1)

Publication Number Publication Date
ATE435445T1 true ATE435445T1 (de) 2009-07-15

Family

ID=29707896

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04800331T ATE435445T1 (de) 2003-11-13 2004-11-15 Verfahren zur erzeugung eines jetting-programms

Country Status (7)

Country Link
US (1) US7912569B2 (de)
EP (1) EP1682957B1 (de)
JP (1) JP4564965B2 (de)
AT (1) ATE435445T1 (de)
DE (1) DE602004021841D1 (de)
SE (1) SE0302985D0 (de)
WO (1) WO2005048678A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE0202247D0 (sv) * 2002-07-18 2002-07-18 Mydata Automation Ab Jetting device and method at a jetting device
CN101356425B (zh) 2005-11-14 2011-01-26 麦德塔自动化股份有限公司 喷射装置和改善喷射装置性能的方法
TWI554857B (zh) * 2011-05-23 2016-10-21 精工愛普生股份有限公司 資料產生方法
JP6133658B2 (ja) * 2013-03-29 2017-05-24 株式会社タムラ製作所 位置設定装置、位置設定方法および位置設定プログラム
KR102692970B1 (ko) * 2020-03-11 2024-08-07 동우 화인켐 주식회사 터치 센서 모듈 및 이를 포함하는 화상 표시 장치
CN113242652B (zh) * 2021-05-20 2022-04-01 上海望友信息科技有限公司 一种喷涂图形生成方法、系统、电子设备及存储介质

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04367001A (ja) * 1991-06-14 1992-12-18 Fuji Electric Co Ltd データ設定装置
WO1993009654A1 (fr) 1991-11-07 1993-05-13 Omron Corporation Appareil de soudage automatique, son appareil d'apprentissage, procede d'apprentissage associe, appareil de controle de soudage, procede de controle associe, appareil automatique de correction du soudage et procede de correction associe
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
US5465879A (en) * 1994-01-27 1995-11-14 Asymptotic Technologies, Inc. Disposable nozzle assembly for high speed viscous material droplet dispenser
JP3397879B2 (ja) * 1994-03-30 2003-04-21 三洋電機株式会社 塗布装置
US5564007A (en) * 1994-06-03 1996-10-08 Motorola Inc. Method for configuring an automated dispense machine
US5938102A (en) * 1995-09-25 1999-08-17 Muntz; Eric Phillip High speed jet soldering system
JPH09260823A (ja) * 1996-03-27 1997-10-03 Matsushita Electric Ind Co Ltd 電子部品接着材料の塗布方法及び塗布装置
US6317513B2 (en) * 1996-12-19 2001-11-13 Cognex Corporation Method and apparatus for inspecting solder paste using geometric constraints
JP4151151B2 (ja) * 1999-04-06 2008-09-17 松下電器産業株式会社 ダイボンディング用のペースト塗布装置およびペースト塗布方法
DE19959262A1 (de) * 1999-12-09 2001-06-21 Altoflex S A Leitfähiges pastöses Material und dessen Verwendung
CN1211178C (zh) 2000-05-04 2005-07-20 德克萨斯仪器股份有限公司 减少集成电路焊接机焊接程序误差的系统与方法
JP2001320159A (ja) * 2000-05-11 2001-11-16 Yamaha Motor Co Ltd 電子部品の実装方法および表面実装機
SE0101503D0 (sv) * 2001-04-27 2001-04-27 Mydata Automation Ab Method device and use of the device
US6744046B2 (en) * 2001-05-24 2004-06-01 New Objective, Inc. Method and apparatus for feedback controlled electrospray
JP2003140178A (ja) * 2001-10-31 2003-05-14 Seiko Epson Corp 電気光学装置の製造方法、電気光学装置、電子機器、およびインクジェット式機能性液体吐出装置

Also Published As

Publication number Publication date
SE0302985D0 (sv) 2003-11-13
EP1682957B1 (de) 2009-07-01
WO2005048678A3 (en) 2006-01-05
JP4564965B2 (ja) 2010-10-20
EP1682957A2 (de) 2006-07-26
US7912569B2 (en) 2011-03-22
DE602004021841D1 (de) 2009-08-13
US20070146404A1 (en) 2007-06-28
JP2007513500A (ja) 2007-05-24
WO2005048678A2 (en) 2005-05-26

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