ATE439944T1 - Gewellte kissenaufbereitungsvorrichtung und verwendungsverfahren dafür - Google Patents

Gewellte kissenaufbereitungsvorrichtung und verwendungsverfahren dafür

Info

Publication number
ATE439944T1
ATE439944T1 AT05711980T AT05711980T ATE439944T1 AT E439944 T1 ATE439944 T1 AT E439944T1 AT 05711980 T AT05711980 T AT 05711980T AT 05711980 T AT05711980 T AT 05711980T AT E439944 T1 ATE439944 T1 AT E439944T1
Authority
AT
Austria
Prior art keywords
disk
processing device
cushion processing
undulating
abrasive
Prior art date
Application number
AT05711980T
Other languages
English (en)
Inventor
Gary M Palmgren
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE439944T1 publication Critical patent/ATE439944T1/de

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/07Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels by means of forming tools having a shape complementary to that to be produced, e.g. blocks, profile rolls
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/08Circular back-plates for carrying flexible material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Secondary Cells (AREA)
  • Branch Pipes, Bends, And The Like (AREA)
AT05711980T 2004-03-09 2005-01-25 Gewellte kissenaufbereitungsvorrichtung und verwendungsverfahren dafür ATE439944T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/797,892 US6951509B1 (en) 2004-03-09 2004-03-09 Undulated pad conditioner and method of using same
PCT/US2005/002310 WO2005095059A1 (en) 2004-03-09 2005-01-25 Undulated pad conditioner and method of using same

Publications (1)

Publication Number Publication Date
ATE439944T1 true ATE439944T1 (de) 2009-09-15

Family

ID=34920155

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05711980T ATE439944T1 (de) 2004-03-09 2005-01-25 Gewellte kissenaufbereitungsvorrichtung und verwendungsverfahren dafür

Country Status (10)

Country Link
US (1) US6951509B1 (de)
EP (1) EP1722926B1 (de)
JP (1) JP4885838B2 (de)
KR (1) KR101127256B1 (de)
CN (1) CN100563931C (de)
AT (1) ATE439944T1 (de)
DE (1) DE602005016086D1 (de)
MY (1) MY135136A (de)
TW (1) TWI358743B (de)
WO (1) WO2005095059A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7744447B2 (en) * 2005-03-16 2010-06-29 Goei, Co., Ltd. Abrasive disc
TWI290337B (en) * 2005-08-09 2007-11-21 Princo Corp Pad conditioner for conditioning a CMP pad and method of making the same
JP4791121B2 (ja) * 2005-09-22 2011-10-12 新日鉄マテリアルズ株式会社 研磨布用ドレッサー
JP5013202B2 (ja) * 2005-10-14 2012-08-29 旭硝子株式会社 研磨パッド用ツルーイング部材及び研磨パッドのツルーイング方法
WO2009158507A2 (en) * 2008-06-26 2009-12-30 Saint-Gobain Abrasives, Inc. Chemical mechanical planarization pad conditioner and method of forming
TW201016387A (en) * 2008-10-22 2010-05-01 jian-min Song CMP Pad Dressers with Hybridized abrasive surface and related methods
US8628597B2 (en) 2009-06-25 2014-01-14 3M Innovative Properties Company Method of sorting abrasive particles, abrasive particle distributions, and abrasive articles including the same
WO2017110156A1 (ja) * 2015-12-25 2017-06-29 ニューレジストン株式会社 研削装置および当該研削装置用の研削具
CN106078517A (zh) * 2016-08-03 2016-11-09 咏巨科技有限公司 一种抛光垫修整装置
US10471567B2 (en) * 2016-09-15 2019-11-12 Entegris, Inc. CMP pad conditioning assembly
CN106733792A (zh) * 2016-12-12 2017-05-31 北京中电科电子装备有限公司 一种用于半导体磨削台的清洁装置
JP7232763B2 (ja) * 2016-12-21 2023-03-03 スリーエム イノベイティブ プロパティズ カンパニー スペーサ及びウェハ平坦化システムを有するパッドコンディショナ
CN111372727B (zh) * 2017-11-21 2022-02-15 3M创新有限公司 涂覆磨盘及其制备和使用方法
US20200094375A1 (en) * 2018-09-26 2020-03-26 Cana Diamond Technology, LLC Multiple zone pad conditioning disk
US12325106B2 (en) * 2018-10-31 2025-06-10 Taiwan Semiconductor Manufacturing Company, Ltd. Device for conditioning chemical mechanical polishing
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
GB2590511B (en) * 2019-11-20 2023-10-25 Best Engineered Surface Tech Llc Hybrid CMP conditioning head
CN116749080B (zh) * 2023-08-18 2023-11-14 浙江求是半导体设备有限公司 修整方法
CN117863092A (zh) * 2024-02-01 2024-04-12 杭州萧山昌宇五金机械有限公司 一种合金齿磨轮及其制造工艺

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US907862A (en) 1905-02-18 1908-12-29 Henry D Nicholls Grinding and sharpening machine.
US2990661A (en) 1958-07-10 1961-07-04 Donald P Hackett Backing disk for abrasive sheet
US3110140A (en) 1961-01-03 1963-11-12 Helen M Jacox Backing plate for abrasive disks
FR1596322A (de) * 1968-01-05 1970-06-15
US4652275A (en) 1985-08-07 1987-03-24 Minnesota Mining And Manufacturing Company Erodable agglomerates and abrasive products containing the same
US4799939A (en) 1987-02-26 1989-01-24 Minnesota Mining And Manufacturing Company Erodable agglomerates and abrasive products containing the same
US5014468A (en) 1989-05-05 1991-05-14 Norton Company Patterned coated abrasive for fine surface finishing
US5152917B1 (en) 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
US5437754A (en) 1992-01-13 1995-08-01 Minnesota Mining And Manufacturing Company Abrasive article having precise lateral spacing between abrasive composite members
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5549962A (en) 1993-06-30 1996-08-27 Minnesota Mining And Manufacturing Company Precisely shaped particles and method of making the same
US5453312A (en) 1993-10-29 1995-09-26 Minnesota Mining And Manufacturing Company Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface
US5454844A (en) 1993-10-29 1995-10-03 Minnesota Mining And Manufacturing Company Abrasive article, a process of making same, and a method of using same to finish a workpiece surface
JP3036348B2 (ja) 1994-03-23 2000-04-24 三菱マテリアル株式会社 ウェーハ研磨パッドのツルーイング装置
US5458532A (en) 1994-01-12 1995-10-17 Cannone; Salvatore L. Undulating edged pad holder for rotary floor polishers
US5897424A (en) 1995-07-10 1999-04-27 The United States Of America As Represented By The Secretary Of Commerce Renewable polishing lap
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
JP2002515833A (ja) 1997-04-04 2002-05-28 オブシディアン,インコーポレイテッド 改良された研磨のための研磨媒体マガジン
US6194317B1 (en) 1998-04-30 2001-02-27 3M Innovative Properties Company Method of planarizing the upper surface of a semiconductor wafer
US6093280A (en) * 1997-08-18 2000-07-25 Lsi Logic Corporation Chemical-mechanical polishing pad conditioning systems
US6200199B1 (en) * 1998-03-31 2001-03-13 Applied Materials, Inc. Chemical mechanical polishing conditioner
US6123612A (en) 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
US6190243B1 (en) 1998-05-07 2001-02-20 Ebara Corporation Polishing apparatus
US6203407B1 (en) 1998-09-03 2001-03-20 Micron Technology, Inc. Method and apparatus for increasing-chemical-polishing selectivity
US6093085A (en) 1998-09-08 2000-07-25 Advanced Micro Devices, Inc. Apparatuses and methods for polishing semiconductor wafers
US6263605B1 (en) 1998-12-21 2001-07-24 Motorola, Inc. Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor
US20040072518A1 (en) 1999-04-02 2004-04-15 Applied Materials, Inc. Platen with patterned surface for chemical mechanical polishing
US20040053566A1 (en) 2001-01-12 2004-03-18 Applied Materials, Inc. CMP platen with patterned surface
US6220942B1 (en) 1999-04-02 2001-04-24 Applied Materials, Inc. CMP platen with patterned surface
US6217426B1 (en) 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
EP1052059A3 (de) 1999-05-03 2001-01-24 Applied Materials, Inc. Verfahren zum chemisch-mechanisch Planarisieren
US20020077037A1 (en) 1999-05-03 2002-06-20 Tietz James V. Fixed abrasive articles
US6491843B1 (en) 1999-12-08 2002-12-10 Eastman Kodak Company Slurry for chemical mechanical polishing silicon dioxide
US6498101B1 (en) 2000-02-28 2002-12-24 Micron Technology, Inc. Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies
KR100360469B1 (ko) 2000-05-09 2002-11-08 삼성전자 주식회사 화학기계적 연마장치의 연마패드 컨디셔닝 장치
US6520834B1 (en) 2000-08-09 2003-02-18 Micron Technology, Inc. Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
JP2002057130A (ja) * 2000-08-14 2002-02-22 Three M Innovative Properties Co Cmp用研磨パッド
US6800020B1 (en) 2000-10-02 2004-10-05 Lam Research Corporation Web-style pad conditioning system and methods for implementing the same
CN100344410C (zh) * 2000-11-07 2007-10-24 中国砂轮企业股份有限公司 化学-机械抛光软垫的修磨器及其制造方法
US20020072296A1 (en) 2000-11-29 2002-06-13 Muilenburg Michael J. Abrasive article having a window system for polishing wafers, and methods
US20020127957A1 (en) * 2000-12-20 2002-09-12 Shipley Kevin D. Chemical mechanical polish pad conditioning device
US6612917B2 (en) 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
US6632129B2 (en) 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
US20020142601A1 (en) 2001-03-30 2002-10-03 Boyd John M. Method for planarizing a surface of a semiconductor wafer with a fixed abrasive material
US6508697B1 (en) * 2001-07-16 2003-01-21 Robert Lyle Benner Polishing pad conditioning system
US6712679B2 (en) 2001-08-08 2004-03-30 Lam Research Corporation Platen assembly having a topographically altered platen surface
US6652708B2 (en) 2001-12-28 2003-11-25 Lam Research Corporation Methods and apparatus for conditioning and temperature control of a processing surface
US7160178B2 (en) 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article

Also Published As

Publication number Publication date
TW200539256A (en) 2005-12-01
US20050202760A1 (en) 2005-09-15
MY135136A (en) 2008-02-29
TWI358743B (en) 2012-02-21
US6951509B1 (en) 2005-10-04
JP2007528300A (ja) 2007-10-11
WO2005095059A1 (en) 2005-10-13
CN1929956A (zh) 2007-03-14
EP1722926A1 (de) 2006-11-22
DE602005016086D1 (de) 2009-10-01
KR101127256B1 (ko) 2012-03-29
EP1722926B1 (de) 2009-08-19
JP4885838B2 (ja) 2012-02-29
KR20060132717A (ko) 2006-12-21
CN100563931C (zh) 2009-12-02

Similar Documents

Publication Publication Date Title
ATE439944T1 (de) Gewellte kissenaufbereitungsvorrichtung und verwendungsverfahren dafür
ATE435720T1 (de) Vliesstoff-schleifkörper und verfahren
DE60127179D1 (de) Schleifartikel zur modifizierung einer halbleiterscheibe
DE602004012864D1 (de) In-situ-aktivierung eines dreidimensionalen festgelegten schleifkörpers
CY1111862T1 (el) Χρηση συστηματος για την καθημερινη συντηρηση σκληρων πετρινων επιφανειων δαπεδου ή υλικου σαν πετρα
TNSN07352A1 (en) Methods and tool for maintenance of hard surfaces, and a method for manufacturing such a tool (manufacturing of tool)
DE602006019984D1 (de) Elastischer schleifkörper
WO2007121135A3 (en) Laminated flexible resilient abrasive article
MX2008001827A (es) Articulo abrasivo flexible y metodo de elaboracion.
IL187704A0 (en) Polishing pad comprising magnetically sensitive particles and method for the use thereof
IN2014MN01903A (de)
ATE386613T1 (de) Schleifteller mit bearbeitungselement
DE602006019876D1 (de) Schleifagglomeratpolierverfahren
JP2007528300A5 (de)
SG164366A1 (en) Methods and tool for maintenance of hard surfaces, and a method for manufacturing such a tool
DE602006004241D1 (de) Trägermaterial und Polierverfahren dafür
EP1179390A3 (de) Linsenpolierkissenunterlage
ATE425683T1 (de) Klettverschlusse
DE602005006326D1 (de) Chemisch-mechanisches Polierkissen und Polierverfahren
ATE372757T1 (de) Verschlussband für einen hygieneartikel, hygieneartikel und verfahren zum herstellen eines verschlussbandes für einen hygieneartikel
CN203812202U (zh) 拯救鼠标手的腕托
TW200631143A (en) Test tool for avoiding substrate warpage
ATE454245T1 (de) Verfahren zur herstellung einer schleifscheibe
TH72757A (th) เครื่องปรับสภาพแผ่นขัดแบบพื้นผิวสูงต่ำและวิธีการใช้เครื่องปรับสภาพแผ่นขัดเช่นนี้
TWD110392S1 (zh) 研磨用之磨石

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties