ATE440158T1 - Verfahren zur elektrochemischen strukturierung eines leiter- oder halbleitermaterials und vorrichtung dafür - Google Patents

Verfahren zur elektrochemischen strukturierung eines leiter- oder halbleitermaterials und vorrichtung dafür

Info

Publication number
ATE440158T1
ATE440158T1 AT07730927T AT07730927T ATE440158T1 AT E440158 T1 ATE440158 T1 AT E440158T1 AT 07730927 T AT07730927 T AT 07730927T AT 07730927 T AT07730927 T AT 07730927T AT E440158 T1 ATE440158 T1 AT E440158T1
Authority
AT
Austria
Prior art keywords
sample
structuring
front face
electrode
semiconductor material
Prior art date
Application number
AT07730927T
Other languages
English (en)
Inventor
Denis Buttard
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE440158T1 publication Critical patent/ATE440158T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00126—Static structures not provided for in groups B81C1/00031 - B81C1/00119
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/006—Nanostructures, e.g. using aluminium anodic oxidation templates [AAO]
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6304—Formation by oxidation, e.g. oxidation of the substrate
    • H10P14/6306—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
    • H10P14/6308—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors
    • H10P14/6309—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors of silicon in uncombined form, i.e. pure silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6324—Formation by anodic treatments, e.g. anodic oxidation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/665—Porous materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/61—Electrolytic etching
    • H10P50/613—Electrolytic etching of Group IV materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0111—Bulk micromachining
    • B81C2201/0114—Electrochemical etching, anodic oxidation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Analytical Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Weting (AREA)
  • Hybrid Cells (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Photovoltaic Devices (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
AT07730927T 2006-03-03 2007-02-06 Verfahren zur elektrochemischen strukturierung eines leiter- oder halbleitermaterials und vorrichtung dafür ATE440158T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0601924A FR2898138B1 (fr) 2006-03-03 2006-03-03 Procede de structuration electrochimique d'un materiau conducteur ou semi-conducteur, et dispositif de mise en oeuvre.
PCT/FR2007/000211 WO2007099210A1 (fr) 2006-03-03 2007-02-06 Procede de structuration electrochimique d'un materiau conducteur ou semi-conducteur, et dispositif de mise en oeuvre

Publications (1)

Publication Number Publication Date
ATE440158T1 true ATE440158T1 (de) 2009-09-15

Family

ID=37057038

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07730927T ATE440158T1 (de) 2006-03-03 2007-02-06 Verfahren zur elektrochemischen strukturierung eines leiter- oder halbleitermaterials und vorrichtung dafür

Country Status (6)

Country Link
US (1) US8329017B2 (de)
EP (1) EP1999302B1 (de)
AT (1) ATE440158T1 (de)
DE (1) DE602007002065D1 (de)
FR (1) FR2898138B1 (de)
WO (1) WO2007099210A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011005743B3 (de) * 2011-03-17 2012-07-26 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Abscheidung einer Metallschicht auf einem Halbleiterbauelement
US8652929B2 (en) * 2011-12-23 2014-02-18 Peking University CMOS device for reducing charge sharing effect and fabrication method thereof
DE102013219886A1 (de) * 2013-10-01 2015-04-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur kontinuierlichen Herstellung poröser Siliciumschichten
CN104724663A (zh) * 2013-12-20 2015-06-24 中国科学院兰州化学物理研究所 一种硅基仿生微纳结构表面的制备方法
US9777386B2 (en) * 2015-03-19 2017-10-03 Lam Research Corporation Chemistry additives and process for cobalt film electrodeposition
CN105817723B (zh) * 2016-05-31 2018-02-23 南京工业职业技术学院 一种双液膜电化学刻蚀制备纳米工具电极的方法及装置
BE1025681B1 (fr) * 2018-03-23 2019-05-28 Universite Catholique De Louvain Procédé de traitement d'un substrat et dispositif de circuit intégré
CN109292731A (zh) * 2018-09-11 2019-02-01 西南交通大学 基于电化学摩擦诱导的微纳加工方法
US12398478B2 (en) * 2019-06-11 2025-08-26 Uchicago Argonne, Llc Method and system for preparation of a nanowire composite based on electroplating
US12002605B1 (en) 2021-02-16 2024-06-04 Uchicago Argonne, Llc Fabrication methods for electronic devices integrating magnetic nanostructures

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6017437A (en) * 1997-08-22 2000-01-25 Cutek Research, Inc. Process chamber and method for depositing and/or removing material on a substrate
AU2864499A (en) * 1998-03-05 1999-09-20 Etchtech Sweden Ab Method of etching
US5976331A (en) * 1998-04-30 1999-11-02 Lucent Technologies Inc. Electrodeposition apparatus for coating wafers
DE10003772A1 (de) * 2000-01-28 2001-08-09 Bosch Gmbh Robert Vorrichtung zum Abdichten eines Raums
US6793793B2 (en) * 2000-08-24 2004-09-21 Hideo Yoshida Electrochemical treating method such as electroplating and electrochemical reaction device therefor
US6750153B2 (en) * 2000-10-24 2004-06-15 Nanosciences Corporation Process for producing macroscopic cavities beneath the surface of a silicon wafer
SE523309E (sv) * 2001-06-15 2010-03-02 Replisaurus Technologies Ab Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt
US7022212B2 (en) * 2001-10-26 2006-04-04 American Air Liquide, Inc. Micro structured electrode and method for monitoring wafer electroplating baths
US20060249391A1 (en) * 2003-04-09 2006-11-09 Sungho Jin High resolution electrolytic lithography, apparatus therefor and resulting products
WO2005033798A2 (en) * 2003-10-03 2005-04-14 University Of Washington Electrochemical micromanufacturing system and method
GB0416600D0 (en) * 2004-07-24 2004-08-25 Univ Newcastle A process for manufacturing micro- and nano-devices

Also Published As

Publication number Publication date
US20090255820A1 (en) 2009-10-15
FR2898138B1 (fr) 2008-05-16
US8329017B2 (en) 2012-12-11
DE602007002065D1 (de) 2009-10-01
WO2007099210A1 (fr) 2007-09-07
EP1999302B1 (de) 2009-08-19
EP1999302A1 (de) 2008-12-10
FR2898138A1 (fr) 2007-09-07

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