ATE440380T1 - Integrierte schaltungen mit modulintegration - Google Patents

Integrierte schaltungen mit modulintegration

Info

Publication number
ATE440380T1
ATE440380T1 AT04789699T AT04789699T ATE440380T1 AT E440380 T1 ATE440380 T1 AT E440380T1 AT 04789699 T AT04789699 T AT 04789699T AT 04789699 T AT04789699 T AT 04789699T AT E440380 T1 ATE440380 T1 AT E440380T1
Authority
AT
Austria
Prior art keywords
circuit
signal conditioning
ancillary
integrated circuit
conditioning circuit
Prior art date
Application number
AT04789699T
Other languages
English (en)
Inventor
Alan Trainor
Original Assignee
Sige Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34422179&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE440380(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sige Semiconductor Inc filed Critical Sige Semiconductor Inc
Application granted granted Critical
Publication of ATE440380T1 publication Critical patent/ATE440380T1/de

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/04—Circuits
    • H04B1/0483—Transmitters with multiple parallel paths
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
AT04789699T 2003-10-08 2004-10-08 Integrierte schaltungen mit modulintegration ATE440380T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/680,208 US7754539B2 (en) 2003-10-08 2003-10-08 Module integration integrated circuits
PCT/CA2004/001789 WO2005034240A1 (en) 2003-10-08 2004-10-08 Module integration integrated circuits

Publications (1)

Publication Number Publication Date
ATE440380T1 true ATE440380T1 (de) 2009-09-15

Family

ID=34422179

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04789699T ATE440380T1 (de) 2003-10-08 2004-10-08 Integrierte schaltungen mit modulintegration

Country Status (6)

Country Link
US (1) US7754539B2 (de)
EP (1) EP1676319B1 (de)
CN (1) CN100541798C (de)
AT (1) ATE440380T1 (de)
DE (1) DE602004022690D1 (de)
WO (1) WO2005034240A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2609553A1 (en) * 2005-05-24 2006-11-30 Radiall Aep, Inc. Common integrated circuit for multiple antennas and methods
US20070259639A1 (en) * 2006-05-02 2007-11-08 Sige Semiconductor Inc. Multi-standard module integration
CN101466197B (zh) * 2007-12-21 2012-11-14 艾利森电话股份有限公司 电路板及设置于其上的功放、双通道收发单元、无线基站
CN104851366B (zh) 2015-05-29 2018-02-06 京东方科技集团股份有限公司 一种柔性显示装置
ES2933675T3 (es) * 2016-12-31 2023-02-13 Intel Corp Sistemas, métodos y aparatos para informática heterogénea
CN108417535A (zh) * 2018-04-08 2018-08-17 海安威诺电子科技有限公司 一种可调节电路集成板的生产工艺
US12400959B2 (en) 2021-06-25 2025-08-26 Taiwan Semiconductor Manufacturing Company, Ltd. Systems and methods for providing multiple GPIO supply modes

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5004317A (en) 1990-01-03 1991-04-02 International Business Machines Corp. Wire bond connection system with cancellation of mutual coupling
US5258325A (en) * 1990-12-31 1993-11-02 Kopin Corporation Method for manufacturing a semiconductor device using a circuit transfer film
US5209122A (en) 1991-11-20 1993-05-11 Delco Electronics Corporation Pressurer sensor and method for assembly of same
US5444187A (en) 1994-10-26 1995-08-22 Baier & Baier, Inc. Method of surface mounting radio frequency components and the components
US5639683A (en) * 1994-12-01 1997-06-17 Motorola, Inc. Structure and method for intergrating microwave components on a substrate
US5731945A (en) * 1995-02-22 1998-03-24 International Business Machines Corporation Multichip semiconductor structures with consolidated circuitry and programmable ESD protection for input/output nodes
US5744869A (en) * 1995-12-05 1998-04-28 Motorola, Inc. Apparatus for mounting a flip-chip semiconductor device
JP3707888B2 (ja) * 1996-02-01 2005-10-19 株式会社日立製作所 半導体回路
US5774017A (en) 1996-06-03 1998-06-30 Anadigics, Inc. Multiple-band amplifier
US6075995A (en) * 1998-01-30 2000-06-13 Conexant Systems, Inc. Amplifier module with two power amplifiers for dual band cellular phones
JP2001298123A (ja) 2000-04-17 2001-10-26 Hitachi Ltd 高周波用配線基板
JP2002353398A (ja) * 2001-05-25 2002-12-06 Nec Kyushu Ltd 半導体装置
US7035595B1 (en) 2002-01-10 2006-04-25 Berkana Wireless, Inc. Configurable wireless interface
JP2003258192A (ja) 2002-03-01 2003-09-12 Hitachi Ltd 半導体装置およびその製造方法
EP1385304B1 (de) 2002-07-22 2011-05-18 Broadcom Corporation Schnittstellenschaltung für mehrere Hochgeschwindigkeits-Bitströme
US7476813B2 (en) * 2003-05-14 2009-01-13 Rambus Inc. Multilayer flip-chip substrate interconnect layout

Also Published As

Publication number Publication date
EP1676319A1 (de) 2006-07-05
WO2005034240A1 (en) 2005-04-14
US7754539B2 (en) 2010-07-13
CN1864260A (zh) 2006-11-15
DE602004022690D1 (de) 2009-10-01
US20050079844A1 (en) 2005-04-14
CN100541798C (zh) 2009-09-16
EP1676319A4 (de) 2008-03-05
EP1676319B1 (de) 2009-08-19

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties