ATE442765T1 - Laminate für einkapselung von oled-vorrichtungen - Google Patents
Laminate für einkapselung von oled-vorrichtungenInfo
- Publication number
- ATE442765T1 ATE442765T1 AT99933460T AT99933460T ATE442765T1 AT E442765 T1 ATE442765 T1 AT E442765T1 AT 99933460 T AT99933460 T AT 99933460T AT 99933460 T AT99933460 T AT 99933460T AT E442765 T1 ATE442765 T1 AT E442765T1
- Authority
- AT
- Austria
- Prior art keywords
- laminates
- oled devices
- encapsulating oled
- encapsulating
- electrical device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/SG1999/000070 WO2001005205A1 (en) | 1999-07-09 | 1999-07-09 | Laminates for encapsulating devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE442765T1 true ATE442765T1 (de) | 2009-09-15 |
Family
ID=20430225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT99933460T ATE442765T1 (de) | 1999-07-09 | 1999-07-09 | Laminate für einkapselung von oled-vorrichtungen |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US6949825B1 (de) |
| EP (1) | EP1112674B1 (de) |
| JP (1) | JP4950400B2 (de) |
| KR (1) | KR20010106472A (de) |
| CN (1) | CN1227731C (de) |
| AT (1) | ATE442765T1 (de) |
| AU (1) | AU4951099A (de) |
| CA (1) | CA2342363A1 (de) |
| DE (1) | DE69941399D1 (de) |
| TW (1) | TWI231739B (de) |
| WO (1) | WO2001005205A1 (de) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7091605B2 (en) * | 2001-09-21 | 2006-08-15 | Eastman Kodak Company | Highly moisture-sensitive electronic device element and method for fabrication |
| ATE442765T1 (de) * | 1999-07-09 | 2009-09-15 | Inst Materials Research & Eng | Laminate für einkapselung von oled-vorrichtungen |
| CA2342946A1 (en) | 1999-07-09 | 2001-01-18 | Osram Opto Semiconductors Gmbh & Co. Ohg | Encapsulation of a device |
| US6814642B2 (en) * | 2001-04-04 | 2004-11-09 | Eastman Kodak Company | Touch screen display and method of manufacture |
| US6590157B2 (en) * | 2001-09-21 | 2003-07-08 | Eastman Kodak Company | Sealing structure for highly moisture-sensitive electronic device element and method for fabrication |
| US7026758B2 (en) | 2001-09-28 | 2006-04-11 | Osram Opto Semiconductors Gmbh | Reinforcement of glass substrates in flexible devices |
| US6737753B2 (en) * | 2001-09-28 | 2004-05-18 | Osram Opto Semiconductor Gmbh | Barrier stack |
| GB2382915A (en) * | 2001-11-08 | 2003-06-11 | Cambridge Display Tech Ltd | Display unit |
| US7050835B2 (en) * | 2001-12-12 | 2006-05-23 | Universal Display Corporation | Intelligent multi-media display communication system |
| DE10222958B4 (de) * | 2002-04-15 | 2007-08-16 | Schott Ag | Verfahren zur Herstellung eines organischen elektro-optischen Elements und organisches elektro-optisches Element |
| DE10236855B4 (de) * | 2002-08-07 | 2006-03-16 | Samsung SDI Co., Ltd., Suwon | Gehäuseeinheit zur Verkapselung von Bauelementen und Verfahren zu deren Herstellung |
| TW575931B (en) * | 2002-10-07 | 2004-02-11 | Advanced Semiconductor Eng | Bridge connection type of chip package and process thereof |
| AU2003299989A1 (en) | 2002-12-27 | 2004-07-29 | Add-Vision, Inc. | Method for encapsulation of light emitting polyme devices and apparatus made by same |
| DE10309607B9 (de) * | 2003-03-05 | 2006-12-14 | Osram Opto Semiconductors Gmbh | Verfahren zur Verkapselung von funktionellen Komponenten eines optoelektronischen Bauelements |
| US6998776B2 (en) | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
| US7344901B2 (en) | 2003-04-16 | 2008-03-18 | Corning Incorporated | Hermetically sealed package and method of fabricating of a hermetically sealed package |
| US7342356B2 (en) | 2004-09-23 | 2008-03-11 | 3M Innovative Properties Company | Organic electroluminescent device having protective structure with boron oxide layer and inorganic barrier layer |
| US20060063015A1 (en) | 2004-09-23 | 2006-03-23 | 3M Innovative Properties Company | Protected polymeric film |
| US7868903B2 (en) * | 2004-10-14 | 2011-01-11 | Daktronics, Inc. | Flexible pixel element fabrication and sealing method |
| US8344410B2 (en) | 2004-10-14 | 2013-01-01 | Daktronics, Inc. | Flexible pixel element and signal distribution means |
| US7893948B1 (en) | 2004-10-14 | 2011-02-22 | Daktronics, Inc. | Flexible pixel hardware and method |
| KR100740309B1 (ko) * | 2005-01-10 | 2007-07-18 | (주)케이디티 | 휘어질 수 있는 풀 칼라 유기 발광 디스플레이 및 그제조방법 |
| US7541671B2 (en) * | 2005-03-31 | 2009-06-02 | General Electric Company | Organic electronic devices having external barrier layer |
| US20070040501A1 (en) | 2005-08-18 | 2007-02-22 | Aitken Bruce G | Method for inhibiting oxygen and moisture degradation of a device and the resulting device |
| US20080048178A1 (en) | 2006-08-24 | 2008-02-28 | Bruce Gardiner Aitken | Tin phosphate barrier film, method, and apparatus |
| US8287991B2 (en) * | 2006-10-04 | 2012-10-16 | Eastman Chemical Company | Using branched polymers to control the dimensional stability of articles in the lamination process |
| US20080085390A1 (en) * | 2006-10-04 | 2008-04-10 | Ryan Thomas Neill | Encapsulation of electrically energized articles |
| US8115326B2 (en) * | 2006-11-30 | 2012-02-14 | Corning Incorporated | Flexible substrates having a thin-film barrier |
| DE102007039416B4 (de) * | 2007-08-21 | 2018-03-29 | Diehl Aircabin Gmbh | Verbundbauteil mit Leuchtdioden |
| MX2010002651A (es) | 2007-09-07 | 2010-03-25 | Avery Dennison Corp | Etiqueta de ocultamiento, hoja de etiquetas y metodo relacionado. |
| DE102007046730A1 (de) * | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Organisches elektronisches Bauelement, Herstellungsverfahren dazu sowie Verwendung |
| US20110008525A1 (en) * | 2009-07-10 | 2011-01-13 | General Electric Company | Condensation and curing of materials within a coating system |
| TWI470704B (zh) | 2010-07-14 | 2015-01-21 | 財團法人工業技術研究院 | 環境敏感電子元件的封裝方法 |
| ITAN20100199A1 (it) * | 2010-11-12 | 2012-05-13 | Powerplast S R L | Procedimento per la realizzazione di un telo incorporante piccole sorgenti luminose. |
| US9150006B2 (en) | 2011-06-23 | 2015-10-06 | Eastman Chemical Company | Lamination process optimization utilizing neopentyl glycol-modified polyesters |
| CN103258955B (zh) * | 2012-02-20 | 2016-02-03 | 中国科学院微电子研究所 | 有机电子器件的封装方法 |
| JP6098984B2 (ja) | 2012-08-30 | 2017-03-22 | コーニング インコーポレイテッド | アンチモンフリーガラス、アンチモンフリーフリット、およびそのフリットで気密封止されるガラスパッケージ |
| CN103904232A (zh) * | 2012-12-25 | 2014-07-02 | 海洋王照明科技股份有限公司 | 一种有机电致发光器件及其制备方法 |
| CN104167507A (zh) * | 2013-05-20 | 2014-11-26 | 海洋王照明科技股份有限公司 | 一种有机电致发光器件及其制备方法 |
| CN104576970A (zh) * | 2013-10-12 | 2015-04-29 | 昆山工研院新型平板显示技术中心有限公司 | 一种柔性显示装置的制备方法及其制备的柔性显示装置 |
| US9156678B2 (en) | 2013-12-12 | 2015-10-13 | Qualcomm Mems Technologies, Inc. | MEMS encapsulation by multilayer film lamination |
| US9831054B2 (en) * | 2014-03-27 | 2017-11-28 | Littelfuse, Inc. | Insulated thermal cut-off device |
| CN103996796B (zh) * | 2014-04-29 | 2015-07-15 | 京东方科技集团股份有限公司 | 一种柔性基板和oled器件 |
| CN104167426B (zh) * | 2014-06-03 | 2017-08-01 | 上海天马有机发光显示技术有限公司 | 一种有机发光二极管显示面板及其制作方法和显示装置 |
| CN104143609A (zh) * | 2014-08-07 | 2014-11-12 | 张家港康得新光电材料有限公司 | 阻隔膜及其制作方法 |
| CN112895660A (zh) * | 2021-03-25 | 2021-06-04 | 江苏日久光电股份有限公司 | 一种高阻隔膜及其制备方法 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2028719A (en) * | 1978-08-28 | 1980-03-12 | Eastman Kodak Co | Identity document |
| US4287285A (en) | 1978-10-18 | 1981-09-01 | Eastman Kodak Company | Method and apparatus for fabricating personal identification documents |
| US4501637A (en) | 1981-06-12 | 1985-02-26 | Motorola, Inc. | LED having self-aligned lens |
| JPS5839075A (ja) | 1981-08-31 | 1983-03-07 | Matsushita Electric Ind Co Ltd | 電子回路装置 |
| DE3248385A1 (de) | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit integriertem schaltkreis |
| FR2585510A1 (fr) | 1985-07-23 | 1987-01-30 | Cit Alcatel | Dispositif de couplage de plusieurs voies electriques d'entree de signaux a une meme voie electrique de sortie avec isolement des masses |
| JPS63105493A (ja) * | 1986-10-22 | 1988-05-10 | アルプス電気株式会社 | 薄膜elパネル |
| US4720432A (en) * | 1987-02-11 | 1988-01-19 | Eastman Kodak Company | Electroluminescent device with organic luminescent medium |
| JPH0321983A (ja) * | 1989-06-19 | 1991-01-30 | Kyoto Semiconductor Kk | 発光ダイオード表示装置 |
| US5022554A (en) * | 1990-02-05 | 1991-06-11 | Chesapeake Consumer Products Company | Paper tableware with metallized layer |
| US5408109A (en) | 1991-02-27 | 1995-04-18 | The Regents Of The University Of California | Visible light emitting diodes fabricated from soluble semiconducting polymers |
| JP2974835B2 (ja) | 1991-09-12 | 1999-11-10 | パイオニア株式会社 | 有機エレクトロルミネッセンス素子 |
| JPH06283265A (ja) * | 1993-03-25 | 1994-10-07 | Nec Kansai Ltd | 電界発光灯及びその製造方法及びその製造装置 |
| JPH07172085A (ja) * | 1993-09-28 | 1995-07-11 | Ibiden Co Ltd | Icカード |
| JP3261945B2 (ja) * | 1994-10-14 | 2002-03-04 | 東洋インキ製造株式会社 | エレクトロルミネッセンス素子封止用積層体およびエレクトロルミネッセンス素子封止構造体 |
| US5804917A (en) * | 1995-01-31 | 1998-09-08 | Futaba Denshi Kogyo K.K. | Organic electroluminescent display device and method for manufacturing same |
| JP3401356B2 (ja) | 1995-02-21 | 2003-04-28 | パイオニア株式会社 | 有機エレクトロルミネッセンスディスプレイパネルとその製造方法 |
| JPH08302340A (ja) * | 1995-05-15 | 1996-11-19 | Sumitomo Chem Co Ltd | 有機エレクトロルミネッセンス素子とその製造方法 |
| EP0803113B1 (de) * | 1995-11-02 | 1999-07-21 | Koninklijke Philips Electronics N.V. | Elektrolumineszenzanzeigevorrichtung |
| JP3247388B2 (ja) * | 1996-02-26 | 2002-01-15 | 出光興産株式会社 | 有機エレクトロルミネッセンス素子及びその製造方法 |
| US6600175B1 (en) | 1996-03-26 | 2003-07-29 | Advanced Technology Materials, Inc. | Solid state white light emitter and display using same |
| US5693956A (en) | 1996-07-29 | 1997-12-02 | Motorola | Inverted oleds on hard plastic substrate |
| US5844363A (en) | 1997-01-23 | 1998-12-01 | The Trustees Of Princeton Univ. | Vacuum deposited, non-polymeric flexible organic light emitting devices |
| JPH1076595A (ja) * | 1996-09-03 | 1998-03-24 | Toyobo Co Ltd | 積層フィルムおよびその製造方法 |
| JP3290375B2 (ja) * | 1997-05-12 | 2002-06-10 | 松下電器産業株式会社 | 有機電界発光素子 |
| US6069443A (en) | 1997-06-23 | 2000-05-30 | Fed Corporation | Passive matrix OLED display |
| US5920080A (en) | 1997-06-23 | 1999-07-06 | Fed Corporation | Emissive display using organic light emitting diodes |
| US6278237B1 (en) | 1997-09-22 | 2001-08-21 | Emagin Corporation | Laterally structured high resolution multicolor organic electroluminescence display device |
| JPH11121167A (ja) * | 1997-10-16 | 1999-04-30 | Tdk Corp | 有機el素子 |
| CA2304576C (en) * | 1997-10-24 | 2007-07-31 | Agfa-Gevaert Naamloze Vennootschap | A laminate comprising a thin borosilicate glass substrate as a constituting layer |
| GB2335884A (en) * | 1998-04-02 | 1999-10-06 | Cambridge Display Tech Ltd | Flexible substrates for electronic or optoelectronic devices |
| US6268695B1 (en) * | 1998-12-16 | 2001-07-31 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
| ATE442765T1 (de) | 1999-07-09 | 2009-09-15 | Inst Materials Research & Eng | Laminate für einkapselung von oled-vorrichtungen |
| US6797211B1 (en) | 1999-07-09 | 2004-09-28 | Osram Opto Semiconductors Gmbh & Co. Ohg | Mechanical patterning of a device layer |
| CA2342946A1 (en) | 1999-07-09 | 2001-01-18 | Osram Opto Semiconductors Gmbh & Co. Ohg | Encapsulation of a device |
| TW449938B (en) | 2000-06-16 | 2001-08-11 | Visual Photonics Epitaxy Co Lt | Light emitting diode with a substrate electroplated with metal reflector and the manufacturing method hereof |
-
1999
- 1999-07-09 AT AT99933460T patent/ATE442765T1/de not_active IP Right Cessation
- 1999-07-09 WO PCT/SG1999/000070 patent/WO2001005205A1/en not_active Ceased
- 1999-07-09 DE DE69941399T patent/DE69941399D1/de not_active Expired - Lifetime
- 1999-07-09 AU AU49510/99A patent/AU4951099A/en not_active Abandoned
- 1999-07-09 CA CA002342363A patent/CA2342363A1/en not_active Abandoned
- 1999-07-09 US US09/786,833 patent/US6949825B1/en not_active Expired - Lifetime
- 1999-07-09 KR KR1020017003074A patent/KR20010106472A/ko not_active Withdrawn
- 1999-07-09 CN CNB998107387A patent/CN1227731C/zh not_active Expired - Lifetime
- 1999-07-09 JP JP2001510285A patent/JP4950400B2/ja not_active Expired - Lifetime
- 1999-07-09 EP EP99933460A patent/EP1112674B1/de not_active Expired - Lifetime
-
2000
- 2000-07-07 TW TW089113563A patent/TWI231739B/zh not_active IP Right Cessation
-
2005
- 2005-06-29 US US11/171,826 patent/US7262441B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE69941399D1 (de) | 2009-10-22 |
| EP1112674B1 (de) | 2009-09-09 |
| CN1317225A (zh) | 2001-10-10 |
| EP1112674A1 (de) | 2001-07-04 |
| AU4951099A (en) | 2001-01-30 |
| US6949825B1 (en) | 2005-09-27 |
| WO2001005205A1 (en) | 2001-01-18 |
| US7262441B2 (en) | 2007-08-28 |
| CA2342363A1 (en) | 2001-01-18 |
| US20050236640A1 (en) | 2005-10-27 |
| JP4950400B2 (ja) | 2012-06-13 |
| KR20010106472A (ko) | 2001-11-29 |
| CN1227731C (zh) | 2005-11-16 |
| TWI231739B (en) | 2005-04-21 |
| JP2003504894A (ja) | 2003-02-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |