ATE444342T1 - Poliersystem mit hochverzweigtem polymer - Google Patents

Poliersystem mit hochverzweigtem polymer

Info

Publication number
ATE444342T1
ATE444342T1 AT05705006T AT05705006T ATE444342T1 AT E444342 T1 ATE444342 T1 AT E444342T1 AT 05705006 T AT05705006 T AT 05705006T AT 05705006 T AT05705006 T AT 05705006T AT E444342 T1 ATE444342 T1 AT E444342T1
Authority
AT
Austria
Prior art keywords
polishing system
branched polymer
highly branched
polishing
polymer
Prior art date
Application number
AT05705006T
Other languages
English (en)
Inventor
Kevin Moeggenborg
Fred Sun
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of ATE444342T1 publication Critical patent/ATE444342T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AT05705006T 2004-01-09 2005-01-05 Poliersystem mit hochverzweigtem polymer ATE444342T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/755,154 US7255810B2 (en) 2004-01-09 2004-01-09 Polishing system comprising a highly branched polymer
PCT/US2005/000187 WO2005071031A1 (en) 2004-01-09 2005-01-05 Polishing system comprising a highly branched polymer

Publications (1)

Publication Number Publication Date
ATE444342T1 true ATE444342T1 (de) 2009-10-15

Family

ID=34739520

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05705006T ATE444342T1 (de) 2004-01-09 2005-01-05 Poliersystem mit hochverzweigtem polymer

Country Status (11)

Country Link
US (1) US7255810B2 (de)
EP (1) EP1702015B1 (de)
JP (1) JP5006048B2 (de)
KR (1) KR101049981B1 (de)
CN (1) CN1906260A (de)
AT (1) ATE444342T1 (de)
DE (1) DE602005016887D1 (de)
IL (1) IL176312A (de)
MY (1) MY142089A (de)
TW (1) TWI268199B (de)
WO (1) WO2005071031A1 (de)

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US7563383B2 (en) 2004-10-12 2009-07-21 Cabot Mircroelectronics Corporation CMP composition with a polymer additive for polishing noble metals
US20060090692A1 (en) * 2004-10-29 2006-05-04 Dominguez Juan E Generating nano-particles for chemical mechanical planarization
US20070077865A1 (en) * 2005-10-04 2007-04-05 Cabot Microelectronics Corporation Method for controlling polysilicon removal
JP5240478B2 (ja) * 2008-02-18 2013-07-17 Ｊｓｒ株式会社 化学機械研磨用水系分散体および化学機械研磨方法
JP5576409B2 (ja) 2009-03-13 2014-08-20 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド ナノダイヤモンドを用いた化学機械平坦化
JP5563269B2 (ja) * 2009-10-09 2014-07-30 四日市合成株式会社 ガラスポリッシング加工用組成物
JP6101421B2 (ja) * 2010-08-16 2017-03-22 インテグリス・インコーポレーテッド 銅または銅合金用エッチング液
EP2518120A1 (de) 2011-04-28 2012-10-31 Basf Se Chemisch-mechanische Polierzusammensetzung mit Polymerpolyamin
US10407594B2 (en) 2011-03-22 2019-09-10 Basf Se Chemical mechanical polishing (CMP) composition comprising a polymeric polyamine
JP5710353B2 (ja) * 2011-04-15 2015-04-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
KR20140034231A (ko) * 2011-05-24 2014-03-19 가부시키가이샤 구라레 화학 기계 연마용 부식 방지제, 화학 기계 연마용 슬러리, 및 화학 기계 연마 방법
SG11201509209VA (en) * 2013-05-15 2015-12-30 Basf Se Chemical-mechanical polishing compositions comprising polyethylene imine
EP2826827B1 (de) * 2013-07-18 2019-06-12 Basf Se CMP-Zusammensetzung mit ceriahaltigen Schleifteilchen
US20150104940A1 (en) * 2013-10-11 2015-04-16 Air Products And Chemicals Inc. Barrier chemical mechanical planarization composition and method thereof
JP6435689B2 (ja) * 2014-07-25 2018-12-12 Ａｇｃ株式会社 研磨剤と研磨方法、および研磨用添加液
JP6947827B2 (ja) 2016-09-23 2021-10-13 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティドＳａｉｎｔ−Ｇｏｂａｉｎ Ｃｅｒａｍｉｃｓ Ａｎｄ Ｐｌａｓｔｉｃｓ， Ｉｎｃ． 化学的機械的平坦化スラリーおよびその形成方法
JP2018074048A (ja) * 2016-10-31 2018-05-10 花王株式会社 シリコンウェーハ用研磨液組成物
AU2019297408B2 (en) 2018-07-04 2024-12-19 Basf Se Iron chelators as activators in alkaline flotation circuits
KR20210142582A (ko) * 2019-03-22 2021-11-25 주식회사 다이셀 반도체 배선 연마용 조성물
KR102745114B1 (ko) * 2021-03-18 2024-12-19 삼성에스디아이 주식회사 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법
KR20220130544A (ko) * 2021-03-18 2022-09-27 삼성에스디아이 주식회사 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법
KR102782549B1 (ko) * 2021-08-23 2025-03-14 삼성에스디아이 주식회사 텅스텐 패턴 웨이퍼 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법

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KR100738774B1 (ko) 2000-08-28 2007-07-12 제이에스알 가부시끼가이샤 화학 기계 연마 스토퍼막, 그의 제조 방법 및 화학 기계연마 방법
EP1197587B1 (de) 2000-10-13 2006-09-20 Shipley Co. L.L.C. Keimschichtreparatur und Elektroplattierungsbad
CN1255854C (zh) * 2001-01-16 2006-05-10 卡伯特微电子公司 含有草酸铵的抛光系统及方法
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Also Published As

Publication number Publication date
CN1906260A (zh) 2007-01-31
JP5006048B2 (ja) 2012-08-22
TW200531787A (en) 2005-10-01
EP1702015A1 (de) 2006-09-20
KR101049981B1 (ko) 2011-07-19
DE602005016887D1 (de) 2009-11-12
IL176312A0 (en) 2006-10-05
US20050150598A1 (en) 2005-07-14
WO2005071031A1 (en) 2005-08-04
IL176312A (en) 2010-11-30
EP1702015B1 (de) 2009-09-30
US7255810B2 (en) 2007-08-14
TWI268199B (en) 2006-12-11
KR20060121292A (ko) 2006-11-28
MY142089A (en) 2010-09-15
JP2007519783A (ja) 2007-07-19

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