ATE444351T1 - Reinigungsmittelformulierungen - Google Patents

Reinigungsmittelformulierungen

Info

Publication number
ATE444351T1
ATE444351T1 AT07250386T AT07250386T ATE444351T1 AT E444351 T1 ATE444351 T1 AT E444351T1 AT 07250386 T AT07250386 T AT 07250386T AT 07250386 T AT07250386 T AT 07250386T AT E444351 T1 ATE444351 T1 AT E444351T1
Authority
AT
Austria
Prior art keywords
cleaning agent
agent formulations
substrates
urea
contaminants
Prior art date
Application number
AT07250386T
Other languages
English (en)
Inventor
Madhukar Bhaskara Rao
John Anthony Marsella
Thomas Michael Wieder
Mark Leo Listemann
Original Assignee
Air Prod & Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Prod & Chem filed Critical Air Prod & Chem
Application granted granted Critical
Publication of ATE444351T1 publication Critical patent/ATE444351T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/08—Acids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/10—Salts
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/28—Organic compounds containing halogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3272—Urea, guanidine or derivatives thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H10P70/234—Cleaning during device manufacture during, before or after processing of insulating materials the processing being the formation of vias or contact holes
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Drying Of Semiconductors (AREA)
  • Epoxy Compounds (AREA)
AT07250386T 2006-01-30 2007-01-30 Reinigungsmittelformulierungen ATE444351T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/342,414 US20070179072A1 (en) 2006-01-30 2006-01-30 Cleaning formulations

Publications (1)

Publication Number Publication Date
ATE444351T1 true ATE444351T1 (de) 2009-10-15

Family

ID=38001890

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07250386T ATE444351T1 (de) 2006-01-30 2007-01-30 Reinigungsmittelformulierungen

Country Status (10)

Country Link
US (1) US20070179072A1 (de)
EP (1) EP1813667B1 (de)
JP (1) JP2007243162A (de)
KR (1) KR100857865B1 (de)
CN (1) CN101013273A (de)
AT (1) ATE444351T1 (de)
DE (1) DE602007002572D1 (de)
IL (1) IL180944A0 (de)
SG (1) SG134279A1 (de)
TW (1) TW200728456A (de)

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US9058975B2 (en) * 2006-06-09 2015-06-16 Lam Research Corporation Cleaning solution formulations for substrates
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US20090229629A1 (en) * 2008-03-14 2009-09-17 Air Products And Chemicals, Inc. Stripper For Copper/Low k BEOL Clean
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US20110189049A1 (en) * 2008-05-09 2011-08-04 Martin Beaulieu Method for treating odors
JP5206177B2 (ja) * 2008-07-09 2013-06-12 三菱瓦斯化学株式会社 レジスト剥離液組成物およびそれを用いた半導体素子の製造方法
US8361237B2 (en) * 2008-12-17 2013-01-29 Air Products And Chemicals, Inc. Wet clean compositions for CoWP and porous dielectrics
US8518865B2 (en) * 2009-08-31 2013-08-27 Air Products And Chemicals, Inc. Water-rich stripping and cleaning formulation and method for using same
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JP5513196B2 (ja) * 2010-03-25 2014-06-04 富士フイルム株式会社 洗浄組成物及び半導体装置の製造方法
CN101838111B (zh) * 2010-05-20 2012-06-27 合肥茂丰电子科技有限公司 玻璃基板蚀刻液及其制备方法
US8889609B2 (en) * 2011-03-16 2014-11-18 Air Products And Chemicals, Inc. Cleaning formulations and method of using the cleaning formulations
US9536730B2 (en) * 2012-10-23 2017-01-03 Air Products And Chemicals, Inc. Cleaning formulations
DE102015106026B3 (de) 2015-04-20 2016-08-25 Interroll Holding Ag Verfahren zum Austausch einer Steuerungseinheit in einer Fördervorrichtung
US10934484B2 (en) * 2018-03-09 2021-03-02 Versum Materials Us, Llc Etching solution for selectively removing silicon-germanium alloy from a silicon-germanium/ germanium stack during manufacture of a semiconductor device
KR101906122B1 (ko) 2018-07-09 2018-12-07 와이엠티 주식회사 Ａｕ 범프 표면 세정 조성물 및 세정 방법
CN109234048A (zh) * 2018-09-05 2019-01-18 合肥久新不锈钢厨具有限公司 一种不锈钢清洁剂组合物及其应用
CN109112557A (zh) * 2018-09-05 2019-01-01 合肥久新不锈钢厨具有限公司 一种新型抗菌不锈钢清洁剂的制备方法
CN109055954A (zh) * 2018-09-05 2018-12-21 合肥久新不锈钢厨具有限公司 一种复合环保不锈钢清洗剂及其使用方法
CN113574159A (zh) * 2019-03-14 2021-10-29 日产化学株式会社 清洗剂组合物以及清洗方法
WO2020195343A1 (ja) * 2019-03-26 2020-10-01 富士フイルムエレクトロニクスマテリアルズ株式会社 洗浄液
US20220251480A1 (en) * 2019-07-15 2022-08-11 Versum Materials Us, Llc Compositions for removing etch residues, methods of using and use thereof
KR20220083186A (ko) * 2020-12-11 2022-06-20 동우 화인켐 주식회사 고분자 처리용 공정액
KR102925424B1 (ko) 2021-03-16 2026-02-11 동우 화인켐 주식회사 고분자 처리용 공정액 조성물

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Also Published As

Publication number Publication date
EP1813667A1 (de) 2007-08-01
TW200728456A (en) 2007-08-01
DE602007002572D1 (de) 2009-11-12
IL180944A0 (en) 2007-07-04
KR100857865B1 (ko) 2008-09-10
SG134279A1 (en) 2007-08-29
CN101013273A (zh) 2007-08-08
KR20070078817A (ko) 2007-08-02
US20070179072A1 (en) 2007-08-02
EP1813667B1 (de) 2009-09-30
JP2007243162A (ja) 2007-09-20

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties