ATE444565T1 - Quinolinole als fliessmittel und beschleuniger für unterfüll-zusammensetzungen. - Google Patents

Quinolinole als fliessmittel und beschleuniger für unterfüll-zusammensetzungen.

Info

Publication number
ATE444565T1
ATE444565T1 AT06017528T AT06017528T ATE444565T1 AT E444565 T1 ATE444565 T1 AT E444565T1 AT 06017528 T AT06017528 T AT 06017528T AT 06017528 T AT06017528 T AT 06017528T AT E444565 T1 ATE444565 T1 AT E444565T1
Authority
AT
Austria
Prior art keywords
compositions
quinolinoles
accelerators
quinolinol
flowing agents
Prior art date
Application number
AT06017528T
Other languages
English (en)
Inventor
Osama M Musa
Zhen Liu
Original Assignee
Henkel Ag & Co Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co Kgaa filed Critical Henkel Ag & Co Kgaa
Application granted granted Critical
Publication of ATE444565T1 publication Critical patent/ATE444565T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01271—Cleaning, e.g. oxide removal or de-smearing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Plural Heterocyclic Compounds (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
AT06017528T 2005-08-25 2006-08-23 Quinolinole als fliessmittel und beschleuniger für unterfüll-zusammensetzungen. ATE444565T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/211,406 US7378523B2 (en) 2005-08-25 2005-08-25 Quinolinols as fluxing and accelerating agents for underfill compositions

Publications (1)

Publication Number Publication Date
ATE444565T1 true ATE444565T1 (de) 2009-10-15

Family

ID=37487469

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06017528T ATE444565T1 (de) 2005-08-25 2006-08-23 Quinolinole als fliessmittel und beschleuniger für unterfüll-zusammensetzungen.

Country Status (9)

Country Link
US (1) US7378523B2 (de)
EP (1) EP1758163B1 (de)
JP (1) JP4648881B2 (de)
KR (1) KR20070024402A (de)
CN (1) CN1919525B (de)
AT (1) ATE444565T1 (de)
DE (1) DE602006009448D1 (de)
SG (1) SG130161A1 (de)
TW (1) TWI398474B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100457375C (zh) * 2007-08-11 2009-02-04 厦门大学 一种可抑制焊点界面化合物生长的免清洗水基型助焊剂
JP6800140B2 (ja) * 2015-03-19 2020-12-16 ナミックス株式会社 フリップチップ実装体の製造方法、フリップチップ実装体、および先供給型アンダーフィル用樹脂組成物
WO2017065957A1 (en) * 2015-10-16 2017-04-20 Basf Se Energy curable high reactivity multi vinylether or acrylate functional resins
KR102705650B1 (ko) 2015-11-17 2024-09-12 헨켈 아게 운트 코. 카게아아 삼차원 관통 실리카 비아 (tsv) 패키지용 언더필 필름을 위한 수지 조성물 및 그의 제조에 유용한 조성물
JP6660771B2 (ja) * 2016-03-03 2020-03-11 ナミックス株式会社 フィルム状樹脂組成物
US20240395610A1 (en) * 2023-05-25 2024-11-28 Taiwan Semiconductor Manufacturing Company Limited Structures for reducing gap fill defects in a vertically stacked semiconductor device and methods for forming the same
WO2025162109A1 (en) * 2024-01-29 2025-08-07 Basf Se A stabilized isocyanate composition and two-component system for preparing polyurethane

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5344592A (en) * 1993-02-16 1994-09-06 E. I. Du Pont De Nemours And Company Organic vehicle for electronic composition
JPH07316399A (ja) * 1994-05-26 1995-12-05 Sumitomo Chem Co Ltd 熱硬化性樹脂組成物および電子部品
US5482809A (en) * 1994-06-16 1996-01-09 Minnesota Mining And Manufacturing Company Liquid toners from soluble polymeric dispersants with reactive groups
US5521271A (en) * 1994-09-29 1996-05-28 Minnesota Mining And Manufacturing Company Liquid toners with hydrocarbon solvents
US5744533A (en) * 1997-06-04 1998-04-28 Johnson Matthey, Inc. Adhesive composition for bonding a semiconductor device
JPH11140276A (ja) * 1997-11-11 1999-05-25 Sumitomo Chem Co Ltd 多官能シアン酸エステル樹脂組成物および樹脂封止型半導体装置
JP2000273317A (ja) * 1999-02-12 2000-10-03 Natl Starch & Chem Investment Holding Corp エレクトロニクスデバイス用の電気的安定性をもつ導電性および抵抗性材料
DE60013181T2 (de) 1999-12-20 2005-08-11 3M Innovative Properties Co., Saint Paul Bei umgebungstemperatur stabiler und einkomponentiger härtbarer epoxidharzklebstoff
US6498260B2 (en) * 2000-03-29 2002-12-24 Georgia Tech Research Corp. Thermally degradable epoxy underfills for flip-chip applications
US6849940B1 (en) * 2000-11-20 2005-02-01 Ati Technologies, Inc. Integrated circuit package for the transfer of heat generated by the inte circuit and method of fabricating same
NL1016779C2 (nl) * 2000-12-02 2002-06-04 Cornelis Johannes Maria V Rijn Matrijs, werkwijze voor het vervaardigen van precisieproducten met behulp van een matrijs, alsmede precisieproducten, in het bijzonder microzeven en membraanfilters, vervaardigd met een dergelijke matrijs.
US20020111420A1 (en) * 2001-02-12 2002-08-15 International Business Machines Corporation Underfill compositions
US6583201B2 (en) * 2001-04-25 2003-06-24 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability for use in electronics devices
US20030111519A1 (en) * 2001-09-04 2003-06-19 3M Innovative Properties Company Fluxing compositions
US20040113127A1 (en) * 2002-12-17 2004-06-17 Min Gary Yonggang Resistor compositions having a substantially neutral temperature coefficient of resistance and methods and compositions relating thereto
US7001938B2 (en) * 2003-01-27 2006-02-21 Resolution Performance Products Llc Epoxy resin curing compositions and resin compositions including same
WO2004073030A2 (en) 2003-02-06 2004-08-26 Georgia Tech Research Corporation Metal 8-hydroxyquinoline -functionalized polymers and related materials and methods of making and using the same
US7108806B2 (en) * 2003-02-28 2006-09-19 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability and good impact resistance for use in electronics devices
US7491427B2 (en) * 2004-02-20 2009-02-17 Ube Industries, Ltd. Polyimidesiloxane solution composition
US20050247916A1 (en) * 2004-05-06 2005-11-10 Mccormick Demetrius Compositions for use in electronics devices

Also Published As

Publication number Publication date
CN1919525A (zh) 2007-02-28
KR20070024402A (ko) 2007-03-02
JP4648881B2 (ja) 2011-03-09
SG130161A1 (en) 2007-03-20
JP2007056266A (ja) 2007-03-08
TWI398474B (zh) 2013-06-11
CN1919525B (zh) 2010-06-09
TW200728375A (en) 2007-08-01
DE602006009448D1 (de) 2009-11-12
EP1758163A1 (de) 2007-02-28
US20070049722A1 (en) 2007-03-01
US7378523B2 (en) 2008-05-27
EP1758163B1 (de) 2009-09-30

Similar Documents

Publication Publication Date Title
ATE522140T1 (de) Mikrobizide zusammensetzung
CY1109916T1 (el) Βενζιμιδαζολο-θειοφαινικες ενωσεις ως plk αναστολεις
TW200800950A (en) Salts of 4-methyl-N-[3-(4-Methyl-Imidazol-1-YL)-5-trifluoromethyl-phenyl]-3-(4-pyridin-3-YL-pyrimidin-2-ylamino)-benzamide
DE602007000908D1 (de) Härtbare wässrige Zusammensetzungen
BRPI0716094A2 (pt) composiÇço de resina.
EA201070689A1 (ru) Композиция для личного ухода
ATE527879T1 (de) Mikrobizide zusammensetzung
ATE523544T1 (de) Alkylierte aminopropylierte ethyendiamine und verwendungen davon
CR9934A (es) Composiciones de asilamiento libres de plomo mejoradas que contienen polimeros de metaloceno
SV2009003221A (es) Composiciones de fenilalquilamino carbamato ref. prd2743svpct
ATE444565T1 (de) Quinolinole als fliessmittel und beschleuniger für unterfüll-zusammensetzungen.
ATE523543T1 (de) Alkylierte aminoproyliertes methylen-di- (cyclohexylamin) und verwendungen davon
DE602006012694D1 (de) Benzimidazolthiophenverbindungen als plk-modulatoren
DE502005003908D1 (de) Härtbare zusammensetzungen auf basis von epoxidharzen und 3(4)-(aminomethyl)-cyclohexan-propanamin und 1,4(5)-cyclooctandimethanamin
DE602004029510D1 (de) Dentalzusammensetzung mit einer epoxy-funktionalen carbosilan-verbindung
ATE409712T1 (de) Epoxidharz zusammensetzung
DK2064185T3 (da) 1H-quinolin-4-on-forbindelser med affinitet til GABA-receptoren, fremgangsmåder, anvendelser og sammensætninger
MX2010001013A (es) Polisacaridos injertados por poliaminas para preparar composiciones radiofarmaceuticas.
TNSN07241A1 (en) Substituted pyrroles, compositions containing same, method for making same and use thereof
PL2064185T3 (pl) Związki 1H-chinolin-4-onowe z powinowactwem do receptora GABA, sposoby wytwarzania, zastosowanie i kompozycje
TW200621843A (en) Solvent composition
TW200634095A (en) Polyoxyalkyleneamine modified polyamidepolyimide resin and composition thereof
TW200716130A (en) Purified form of tanaproget
DE112005000119A5 (de) Fügeverband, sowie Montagegruppe und Trägerlelement für den Fügeverband
DK1970460T3 (da) Stöbejern til fremstilling af komponenter til friktionenter til friktionsbremsende indretninger og fremgangsmåde til fremstilling af stöbejern

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties