ATE444582T1 - Laserkühlsystem und laserkühlverfahren - Google Patents

Laserkühlsystem und laserkühlverfahren

Info

Publication number
ATE444582T1
ATE444582T1 AT05705507T AT05705507T ATE444582T1 AT E444582 T1 ATE444582 T1 AT E444582T1 AT 05705507 T AT05705507 T AT 05705507T AT 05705507 T AT05705507 T AT 05705507T AT E444582 T1 ATE444582 T1 AT E444582T1
Authority
AT
Austria
Prior art keywords
laser cooling
folded sheet
laser
cooling system
cooling method
Prior art date
Application number
AT05705507T
Other languages
English (en)
Inventor
Nathan Monty
Kevin Armbruster
Kenneth Lind
Original Assignee
Litelaser L L C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Litelaser L L C filed Critical Litelaser L L C
Application granted granted Critical
Publication of ATE444582T1 publication Critical patent/ATE444582T1/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0404—Air- or gas cooling, e.g. by dry nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0407—Liquid cooling, e.g. by water

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laser Surgery Devices (AREA)
AT05705507T 2004-01-12 2005-01-12 Laserkühlsystem und laserkühlverfahren ATE444582T1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US53554904P 2004-01-12 2004-01-12
US60515704P 2004-08-30 2004-08-30
US62205404P 2004-10-27 2004-10-27
PCT/US2005/000881 WO2005070159A2 (en) 2004-01-12 2005-01-12 Laser cooling system and method

Publications (1)

Publication Number Publication Date
ATE444582T1 true ATE444582T1 (de) 2009-10-15

Family

ID=34812073

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05705507T ATE444582T1 (de) 2004-01-12 2005-01-12 Laserkühlsystem und laserkühlverfahren

Country Status (5)

Country Link
US (1) US20050257912A1 (de)
EP (1) EP1723486B1 (de)
AT (1) ATE444582T1 (de)
DE (1) DE602005016897D1 (de)
WO (1) WO2005070159A2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070189353A1 (en) * 2006-02-03 2007-08-16 Videojet Technologies Waveguide laser having reduced cross-sectional size and/or reduced optical axis distortion
CN101512852A (zh) * 2006-06-26 2009-08-19 录象射流技术公司 用于波导激光器的光学安装方案及包含其的波导激光器
GB2497947B (en) * 2011-12-22 2017-09-06 The Science And Tech Facilities Council Mounting vane for optical element of a laser
US20160209330A1 (en) * 2015-01-21 2016-07-21 Protrustech Co., Ltd Integrated raman spectrometer and modularized laser module
FR3041080B1 (fr) * 2015-09-14 2020-05-29 Valeo Vision Dispositif de dissipation thermique pour un module lumineux de vehicule automobile
US20200333077A1 (en) * 2019-04-18 2020-10-22 The Babcock & Wilcox Company Perturbing air cooled condenser fin
TWI695467B (zh) 2019-07-10 2020-06-01 國立交通大學 積體電路散熱結構
JP7373745B2 (ja) * 2020-01-28 2023-11-06 パナソニックＩｐマネジメント株式会社 レーザ加工システム用光学ユニット及びレーザ加工システム
CN114024192B (zh) * 2021-10-18 2025-02-07 安徽蓝讯通信技术有限公司 一种适用于固体激光器的Sub-6G-LTCC片式耦合器
CN115102014B (zh) * 2022-07-11 2024-11-19 中国工程物理研究院激光聚变研究中心 光纤激光器

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US131469A (en) * 1872-09-17 Improvement in pumps
US58913A (en) * 1866-10-16 Improvement in hydrometers
US3226830A (en) * 1964-05-01 1966-01-04 Spectra Physics Mechanism for precise angular positioning of optical devices
US3638140A (en) * 1969-07-28 1972-01-25 Hughes Aircraft Co Laser-cooling system
US3763442A (en) * 1972-07-07 1973-10-02 American Laser Corp Ion laser plasma tube cooling device and method
US4005374A (en) * 1975-03-31 1977-01-25 Xonics, Inc. Pulsed gas laser with low-inductance flow-through electrodes
JPS55500012A (de) * 1977-12-23 1980-01-17
US4345643A (en) * 1980-11-24 1982-08-24 The United States Of America As Represented By The Secretary Of The Army Heat exchanger base for a portable laser system
US4507786A (en) * 1983-08-22 1985-03-26 The United States Of America As Represented By The Secretary Of The Army Push-pull pulsed gas laser
FR2593649B1 (fr) * 1986-01-27 1988-05-20 Asulab Sa Laser a gaz scelle.
GB2215906B (en) * 1988-02-10 1992-09-16 Mitsubishi Electric Corp Laser device
US4926935A (en) * 1989-03-06 1990-05-22 Robinson Fin Machines, Inc. Compressed fin heat sink
US5386759A (en) * 1990-06-28 1995-02-07 Mitsubishi Jukogyo Kabushiki Kaisha Flying object acceleration method by means of a rail-gun type two-stage accelerating apparatus
US5140606A (en) * 1990-10-12 1992-08-18 Coherent, Inc. RF excited CO2 slab waveguide laser
EP0552538B1 (de) * 1991-12-16 1996-03-13 AT&T Corp. Wärmeabfuhr durch engkanälige Kühlrippen um elektronisches Hochleistungskomponenten zu kühlen
JPH06268285A (ja) * 1993-03-15 1994-09-22 Toshiba Corp ガスレ−ザ管装置
JPH0792577A (ja) * 1993-09-21 1995-04-07 Mita Ind Co Ltd 光学系用導電体
US5481556A (en) * 1993-10-01 1996-01-02 S.L.T. Japan Co., Ltd. Laser oscillation apparatus with cooling fan and cooling fins
JPH07307506A (ja) * 1994-05-16 1995-11-21 Mitsubishi Electric Corp レーザ発振器
JPH088493A (ja) * 1994-06-20 1996-01-12 Nippon Steel Corp 半導体レーザ装置における放熱構造
JP3158983B2 (ja) * 1994-10-03 2001-04-23 住友精密工業株式会社 Ｌｓｉパッケージ冷却用コルゲート型放熱フィン
US5513071A (en) * 1994-11-28 1996-04-30 Philips Electronics North America Corporation Electronics housing with improved heat rejection
US6208513B1 (en) * 1995-01-17 2001-03-27 Compaq Computer Corporation Independently mounted cooling fins for a low-stress semiconductor package
US5661746A (en) * 1995-10-17 1997-08-26 Universal Laser Syatems, Inc. Free-space gas slab laser
US5864956A (en) * 1996-11-22 1999-02-02 Dong; Dawei Level line and limb line combination
GB2323434B (en) * 1997-03-22 2000-09-20 Imi Marston Ltd Heat sink
US5901167A (en) * 1997-04-30 1999-05-04 Universal Laser Systems, Inc. Air cooled gas laser
US5953360A (en) * 1997-10-24 1999-09-14 Synrad, Inc. All metal electrode sealed gas laser
TW444158B (en) * 1998-07-08 2001-07-01 Hon Hai Prec Ind Co Ltd Heat sink device and its manufacture method
US6163969A (en) * 1998-08-04 2000-12-26 Quarton Inc. 3D laser leveler
US6351478B1 (en) * 1998-09-11 2002-02-26 Cutting Edge Optronics, Inc. Passively cooled solid-state laser
US6414979B2 (en) * 2000-06-09 2002-07-02 Cymer, Inc. Gas discharge laser with blade-dielectric electrode
US6195379B1 (en) * 1999-12-27 2001-02-27 Synrad, Inc. Laser assembly system and method
JP3389197B2 (ja) * 2000-04-19 2003-03-24 三菱重工業株式会社 レーザ波長変換装置
US6625025B1 (en) * 2000-07-10 2003-09-23 Nortel Networks Limited Component cooling in electronic devices
US6427348B1 (en) * 2000-07-17 2002-08-06 James Webb Slope block
JP2002134825A (ja) * 2000-10-20 2002-05-10 Furukawa Electric Co Ltd:The レーザダイオードモジュールおよび実装基板
JP4646166B2 (ja) * 2000-11-08 2011-03-09 古河電気工業株式会社 レーザダイオードモジュールからなる光源
JP2002329928A (ja) * 2001-02-27 2002-11-15 Ricoh Co Ltd 光通信システム
JP2002280659A (ja) * 2001-03-16 2002-09-27 Furukawa Electric Co Ltd:The レーザダイオードモジュールからなる光源
US6730993B1 (en) * 2001-07-26 2004-05-04 Ciena Corporation Laser diode and heatsink quick connect/disconnect assembly
US6538889B1 (en) * 2001-09-20 2003-03-25 Hewlett-Packard Company Heat dissipation device retention assembly
EP2009676B8 (de) * 2002-05-08 2012-11-21 Phoseon Technology, Inc. Halbleitermaterial-Prüfsystem
TW535489B (en) * 2002-05-31 2003-06-01 Peng Jian Composite working method of heat conduction device and the product thereof
US6983001B2 (en) * 2002-12-16 2006-01-03 Universal Laser Systems, Inc. Laser with heat transfer system

Also Published As

Publication number Publication date
US20050257912A1 (en) 2005-11-24
WO2005070159A3 (en) 2006-11-30
EP1723486A4 (de) 2008-06-25
EP1723486B1 (de) 2009-09-30
DE602005016897D1 (de) 2009-11-12
WO2005070159A2 (en) 2005-08-04
EP1723486A2 (de) 2006-11-22

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties