ATE445030T1 - Metallisierung - Google Patents
MetallisierungInfo
- Publication number
- ATE445030T1 ATE445030T1 AT03732723T AT03732723T ATE445030T1 AT E445030 T1 ATE445030 T1 AT E445030T1 AT 03732723 T AT03732723 T AT 03732723T AT 03732723 T AT03732723 T AT 03732723T AT E445030 T1 ATE445030 T1 AT E445030T1
- Authority
- AT
- Austria
- Prior art keywords
- sub
- organometallic compounds
- relates
- platinum
- photosensitive organometallic
- Prior art date
Links
- 238000001465 metallisation Methods 0.000 title 1
- 150000002902 organometallic compounds Chemical class 0.000 abstract 2
- AVLPUEGYYZFYNW-UHFFFAOYSA-N 1,2-bis(1,1,2,2,3,3,3-heptafluoropropyl)cycloocta-1,5-diene platinum(2+) Chemical compound [Pt+2].FC(C(C(F)(F)F)(F)F)(F)C1=C(CCC=CCC1)C(C(C(F)(F)F)(F)F)(F)F AVLPUEGYYZFYNW-UHFFFAOYSA-N 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 238000011946 reduction process Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
- C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/123—Spraying molten metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Toxicology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Apparatus For Disinfection Or Sterilisation (AREA)
- Chemical Vapour Deposition (AREA)
- Chemically Coating (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Photoreceptors In Electrophotography (AREA)
- Manufacturing Of Electric Cables (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0213925.1A GB0213925D0 (en) | 2002-06-18 | 2002-06-18 | Metallisation |
| PCT/GB2003/002613 WO2003106734A2 (en) | 2002-06-18 | 2003-06-18 | Metallisation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE445030T1 true ATE445030T1 (de) | 2009-10-15 |
Family
ID=9938751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03732723T ATE445030T1 (de) | 2002-06-18 | 2003-06-18 | Metallisierung |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7410900B2 (de) |
| EP (1) | EP1520060B1 (de) |
| JP (1) | JP2005530043A (de) |
| CN (1) | CN1675407A (de) |
| AT (1) | ATE445030T1 (de) |
| AU (1) | AU2003240108A1 (de) |
| DE (1) | DE60329598D1 (de) |
| GB (1) | GB0213925D0 (de) |
| IL (1) | IL165827A0 (de) |
| WO (1) | WO2003106734A2 (de) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2900765B1 (fr) * | 2006-05-04 | 2008-10-10 | Commissariat Energie Atomique | Procede de realisation d'une grille de transistor comprenant une decomposition d'un materiau precurseur en au moins un materiau metallique, a l'aide d'au moins un faisceau d'electrons |
| US7482289B2 (en) * | 2006-08-25 | 2009-01-27 | Battelle Memorial Institute | Methods and apparatus for depositing tantalum metal films to surfaces and substrates |
| EP2326744B1 (de) * | 2008-08-07 | 2022-06-01 | Pryog, LLC | Metallzusammensetzungen und verfahren zu ihrer herstellung |
| US10941163B2 (en) | 2015-09-29 | 2021-03-09 | Pryog, Llc | Metal compositions and methods of making same |
| KR102627456B1 (ko) | 2015-12-21 | 2024-01-19 | 삼성전자주식회사 | 탄탈럼 화합물과 이를 이용한 박막 형성 방법 및 집적회로 소자의 제조 방법 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4530879A (en) * | 1983-03-04 | 1985-07-23 | Minnesota Mining And Manufacturing Company | Radiation activated addition reaction |
| FR2643775B1 (fr) * | 1989-02-24 | 1991-06-14 | Ramy Jean Pierre | Procede de realisation de lignes electriquement conductrices sur substrat isolant et circuit hyperfrequence en comportant application |
| JP2538043B2 (ja) * | 1989-04-05 | 1996-09-25 | 松下電器産業株式会社 | パタ―ン形成用材料とそれを用いたパタ―ン形成基板の作製方法 |
| DE4042220C2 (de) * | 1990-12-29 | 1995-02-02 | Heraeus Noblelight Gmbh | Verfahren zur Herstellung von ganzflächigen oder partiellen Goldschichten |
| US6133050A (en) * | 1992-10-23 | 2000-10-17 | Symetrix Corporation | UV radiation process for making electronic devices having low-leakage-current and low-polarization fatigue |
| US5534312A (en) * | 1994-11-14 | 1996-07-09 | Simon Fraser University | Method for directly depositing metal containing patterned films |
| IE980461A1 (en) * | 1998-06-15 | 2000-05-03 | Univ Cork | Method for selective activation and metallisation of materials |
| US6348239B1 (en) * | 2000-04-28 | 2002-02-19 | Simon Fraser University | Method for depositing metal and metal oxide films and patterned films |
| US6248658B1 (en) * | 1999-01-13 | 2001-06-19 | Advanced Micro Devices, Inc. | Method of forming submicron-dimensioned metal patterns |
-
2002
- 2002-06-18 GB GBGB0213925.1A patent/GB0213925D0/en not_active Ceased
-
2003
- 2003-06-18 AT AT03732723T patent/ATE445030T1/de not_active IP Right Cessation
- 2003-06-18 JP JP2004513537A patent/JP2005530043A/ja active Pending
- 2003-06-18 DE DE60329598T patent/DE60329598D1/de not_active Expired - Lifetime
- 2003-06-18 WO PCT/GB2003/002613 patent/WO2003106734A2/en not_active Ceased
- 2003-06-18 US US10/518,952 patent/US7410900B2/en not_active Expired - Fee Related
- 2003-06-18 AU AU2003240108A patent/AU2003240108A1/en not_active Abandoned
- 2003-06-18 EP EP03732723A patent/EP1520060B1/de not_active Expired - Lifetime
- 2003-06-18 CN CNA038195739A patent/CN1675407A/zh active Pending
-
2004
- 2004-12-16 IL IL16582704A patent/IL165827A0/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003106734A2 (en) | 2003-12-24 |
| EP1520060B1 (de) | 2009-10-07 |
| EP1520060A2 (de) | 2005-04-06 |
| US7410900B2 (en) | 2008-08-12 |
| US20050227181A1 (en) | 2005-10-13 |
| AU2003240108A8 (en) | 2003-12-31 |
| WO2003106734A3 (en) | 2004-04-08 |
| DE60329598D1 (de) | 2009-11-19 |
| CN1675407A (zh) | 2005-09-28 |
| GB0213925D0 (en) | 2002-07-31 |
| AU2003240108A1 (en) | 2003-12-31 |
| JP2005530043A (ja) | 2005-10-06 |
| IL165827A0 (en) | 2006-01-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |