ATE445232T1 - Elektronische vorrichtung mit integrierter schaltung - Google Patents

Elektronische vorrichtung mit integrierter schaltung

Info

Publication number
ATE445232T1
ATE445232T1 AT05766928T AT05766928T ATE445232T1 AT E445232 T1 ATE445232 T1 AT E445232T1 AT 05766928 T AT05766928 T AT 05766928T AT 05766928 T AT05766928 T AT 05766928T AT E445232 T1 ATE445232 T1 AT E445232T1
Authority
AT
Austria
Prior art keywords
electronic device
integrated circuit
signal ground
die pad
protrusion
Prior art date
Application number
AT05766928T
Other languages
English (en)
Inventor
Jean-Claude Six
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE445232T1 publication Critical patent/ATE445232T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/942—Dispositions of bond pads relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/728—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Credit Cards Or The Like (AREA)
AT05766928T 2004-07-13 2005-07-06 Elektronische vorrichtung mit integrierter schaltung ATE445232T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04300442 2004-07-13
PCT/IB2005/052241 WO2006008679A2 (en) 2004-07-13 2005-07-06 Electronic device comprising an integrated circuit

Publications (1)

Publication Number Publication Date
ATE445232T1 true ATE445232T1 (de) 2009-10-15

Family

ID=35124714

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05766928T ATE445232T1 (de) 2004-07-13 2005-07-06 Elektronische vorrichtung mit integrierter schaltung

Country Status (7)

Country Link
US (1) US7545026B2 (de)
EP (1) EP1769533B1 (de)
JP (1) JP2008507123A (de)
CN (1) CN1985371B (de)
AT (1) ATE445232T1 (de)
DE (1) DE602005017041D1 (de)
WO (1) WO2006008679A2 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
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US20070178766A1 (en) * 2006-01-31 2007-08-02 Intel Corporation Passive impedance equalization of high speed serial links
US20090014868A1 (en) * 2007-07-10 2009-01-15 International Business Machines Corporation Manufacturing ic chip in portions for later combining, and related structure
US20090194829A1 (en) * 2008-01-31 2009-08-06 Shine Chung MEMS Packaging Including Integrated Circuit Dies
US8138024B2 (en) * 2008-02-26 2012-03-20 Stats Chippac Ltd. Package system for shielding semiconductor dies from electromagnetic interference
US8492883B2 (en) 2008-03-14 2013-07-23 Advanced Semiconductor Engineering, Inc. Semiconductor package having a cavity structure
US20100044850A1 (en) 2008-08-21 2010-02-25 Advanced Semiconductor Engineering, Inc. Advanced quad flat non-leaded package structure and manufacturing method thereof
US8124447B2 (en) * 2009-04-10 2012-02-28 Advanced Semiconductor Engineering, Inc. Manufacturing method of advanced quad flat non-leaded package
US8563360B2 (en) * 2009-06-08 2013-10-22 Alpha And Omega Semiconductor, Inc. Power semiconductor device package and fabrication method
US7994615B2 (en) * 2009-08-28 2011-08-09 International Rectifier Corporation Direct contact leadless package for high current devices
US20110163430A1 (en) * 2010-01-06 2011-07-07 Advanced Semiconductor Engineering, Inc. Leadframe Structure, Advanced Quad Flat No Lead Package Structure Using the Same, and Manufacturing Methods Thereof
US8368216B2 (en) * 2010-08-31 2013-02-05 Advanced Semiconductor Engineering, Inc. Semiconductor package
US10840005B2 (en) 2013-01-25 2020-11-17 Vishay Dale Electronics, Llc Low profile high current composite transformer
US9450547B2 (en) * 2013-12-12 2016-09-20 Freescale Semiconductor, Inc. Semiconductor package having an isolation wall to reduce electromagnetic coupling
US9673164B2 (en) 2014-04-25 2017-06-06 Nxp Usa, Inc. Semiconductor package and system with an isolation structure to reduce electromagnetic coupling
US9986646B2 (en) 2014-11-21 2018-05-29 Nxp Usa, Inc. Packaged electronic devices with top terminations, and methods of manufacture thereof
KR101905240B1 (ko) 2015-01-29 2018-10-05 앰코테크놀로지코리아(주) 반도체 패키지 및 이의 제조 방법
US10998124B2 (en) 2016-05-06 2021-05-04 Vishay Dale Electronics, Llc Nested flat wound coils forming windings for transformers and inductors
WO2018045007A1 (en) 2016-08-31 2018-03-08 Vishay Dale Electronics, Llc Inductor having high current coil with low direct current resistance
EP3432354B1 (de) 2017-07-19 2022-01-19 Ampleon Netherlands B.V. Elektrisches bauelement, vorrichtung und verpackung
US10763194B2 (en) * 2017-09-22 2020-09-01 Stmicroelectronics, Inc. Package with lead frame with improved lead design for discrete electrical components and manufacturing the same
US20190287881A1 (en) 2018-03-19 2019-09-19 Stmicroelectronics S.R.L. Semiconductor package with die stacked on surface mounted devices
US10593612B2 (en) 2018-03-19 2020-03-17 Stmicroelectronics S.R.L. SMDs integration on QFN by 3D stacked solution
US10573583B2 (en) * 2018-06-20 2020-02-25 Texas Instruments Incorporated Semiconductor device package with grooved substrate
US12567533B2 (en) 2020-03-03 2026-03-03 Vishay Dale Electronics, Llc Inductor with preformed termination and method and assembly for making the same
USD1034462S1 (en) 2021-03-01 2024-07-09 Vishay Dale Electronics, Llc Inductor package
US11948724B2 (en) 2021-06-18 2024-04-02 Vishay Dale Electronics, Llc Method for making a multi-thickness electro-magnetic device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59104152A (ja) * 1982-12-06 1984-06-15 Seiko Epson Corp フイルムキヤリア回路基板の半導体集積回路の実装方法
US4685998A (en) * 1984-03-22 1987-08-11 Thomson Components - Mostek Corp. Process of forming integrated circuits with contact pads in a standard array
US6140708A (en) * 1996-05-17 2000-10-31 National Semiconductor Corporation Chip scale package and method for manufacture thereof
JP2000173367A (ja) 1998-12-09 2000-06-23 Harness Syst Tech Res Ltd 電線の圧接における線癖矯正装置
JP4497683B2 (ja) * 2000-09-11 2010-07-07 ローム株式会社 集積回路装置
JP3854054B2 (ja) * 2000-10-10 2006-12-06 株式会社東芝 半導体装置
US6737750B1 (en) * 2001-12-07 2004-05-18 Amkor Technology, Inc. Structures for improving heat dissipation in stacked semiconductor packages
JP2003318311A (ja) 2002-04-22 2003-11-07 Nec Compound Semiconductor Devices Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JP2008507123A (ja) 2008-03-06
US20080191361A1 (en) 2008-08-14
CN1985371A (zh) 2007-06-20
DE602005017041D1 (de) 2009-11-19
US7545026B2 (en) 2009-06-09
EP1769533A2 (de) 2007-04-04
WO2006008679A3 (en) 2006-08-24
EP1769533B1 (de) 2009-10-07
CN1985371B (zh) 2011-12-28
WO2006008679A2 (en) 2006-01-26

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Legal Events

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