ATE447596T1 - Wärmeleitfähige zweikomponentige klebstoffzusammensetzung - Google Patents
Wärmeleitfähige zweikomponentige klebstoffzusammensetzungInfo
- Publication number
- ATE447596T1 ATE447596T1 AT05725221T AT05725221T ATE447596T1 AT E447596 T1 ATE447596 T1 AT E447596T1 AT 05725221 T AT05725221 T AT 05725221T AT 05725221 T AT05725221 T AT 05725221T AT E447596 T1 ATE447596 T1 AT E447596T1
- Authority
- AT
- Austria
- Prior art keywords
- component
- thermally conductive
- adhesive composition
- filler
- conductive filler
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 4
- 239000000853 adhesive Substances 0.000 title abstract 2
- 230000001070 adhesive effect Effects 0.000 title abstract 2
- 239000011231 conductive filler Substances 0.000 abstract 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract 2
- 238000001723 curing Methods 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 2
- 239000000178 monomer Substances 0.000 abstract 2
- 230000003019 stabilising effect Effects 0.000 abstract 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 abstract 1
- 230000003197 catalytic effect Effects 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 150000002978 peroxides Chemical class 0.000 abstract 1
- 150000003141 primary amines Chemical class 0.000 abstract 1
- 150000003335 secondary amines Chemical class 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 150000003512 tertiary amines Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F23/00—Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/006—Heat conductive materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US55157704P | 2004-03-09 | 2004-03-09 | |
| PCT/US2005/007915 WO2005087850A1 (en) | 2004-03-09 | 2005-03-08 | Thermally conductive two-part adhesive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE447596T1 true ATE447596T1 (de) | 2009-11-15 |
Family
ID=34975549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05725221T ATE447596T1 (de) | 2004-03-09 | 2005-03-08 | Wärmeleitfähige zweikomponentige klebstoffzusammensetzung |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20070023165A1 (de) |
| EP (1) | EP1723197B1 (de) |
| JP (1) | JP2007528437A (de) |
| KR (1) | KR20060126838A (de) |
| CN (1) | CN1946784A (de) |
| AT (1) | ATE447596T1 (de) |
| DE (1) | DE602005017472D1 (de) |
| WO (1) | WO2005087850A1 (de) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006111790A (ja) * | 2004-10-18 | 2006-04-27 | Seiko Epson Corp | 導電性粘着剤 |
| CN101191041B (zh) * | 2006-11-29 | 2010-04-14 | 上海康达化工有限公司 | 丙烯酸酯胶粘剂 |
| DE102007026256A1 (de) * | 2007-06-04 | 2008-12-11 | Akemi Chemisch Technische Spezialfabrik Gmbh | Mehrfarbkomponenten-Klebersystem |
| WO2008153883A1 (en) * | 2007-06-08 | 2008-12-18 | Henkel Corporation | Room temperature curing adhesive composition having high temperature properties |
| GB2482531B (en) * | 2010-08-05 | 2013-11-13 | Loctite R & D Ltd | Adhesive composition with enhanced cure through volume |
| US8966758B1 (en) * | 2010-09-17 | 2015-03-03 | Jeffrey Skaggs McReynolds | System and method of producing scalable heat-sink assembly |
| KR101192042B1 (ko) | 2010-11-01 | 2012-10-17 | 삼성에스디아이 주식회사 | 배터리 팩 |
| KR101819272B1 (ko) * | 2011-08-03 | 2018-01-16 | 헨켈 아이피 앤드 홀딩 게엠베하 | 전기 전도성 구조 접착제 |
| DK2664349T3 (en) | 2012-05-16 | 2016-05-02 | Heraeus Medical Gmbh | BONE LETTER IN PASTAFORM |
| JP2016519397A (ja) * | 2013-04-29 | 2016-06-30 | エルジー・ケム・リミテッド | 高分子電解質膜、高分子電解質膜を含む膜電極接合体および膜電極接合体を含む燃料電池 |
| US9826662B2 (en) * | 2013-12-12 | 2017-11-21 | General Electric Company | Reusable phase-change thermal interface structures |
| CN103725206B (zh) * | 2014-01-06 | 2015-06-24 | 江苏东禾电声配件有限公司 | 一种扬声器组装用双组份耐高温胶黏剂及其制备方法 |
| CN118955823A (zh) | 2017-03-03 | 2024-11-15 | 日本优必佳株式会社 | 电气电子零件用结晶性自由基聚合性组合物、使用该组合物的电气电子零件成型体、及该电气电子零件成型体的制造方法 |
| JP6653305B2 (ja) * | 2017-11-10 | 2020-02-26 | 日本ユピカ株式会社 | 電気電子部品用結晶性ラジカル重合性組成物、当該組成物を使用した電気電子部品成形体、及び当該電気電子部品成形体の製造方法 |
| JP6630695B2 (ja) * | 2017-03-03 | 2020-01-15 | 日本ユピカ株式会社 | 電気電子部品封止用結晶性ラジカル重合性組成物、当該組成物を使用した電気電子部品用封止体、及び当該封止体の製造方法 |
| JP6782739B2 (ja) * | 2018-07-09 | 2020-11-11 | 日本ユピカ株式会社 | 車載用エレクトロニックコントロールユニット基板封止用熱硬化性樹脂組成物、当該組成物を使用した車載用エレクトロニックコントロールユニット基板封止体、及び当該封止体の製造方法 |
| JP6782741B2 (ja) * | 2018-07-18 | 2020-11-11 | 日本ユピカ株式会社 | 車載用イグニッションコイル封止用結晶性ラジカル重合性組成物、当該組成物を使用した車載用イグニッションコイル封止体、及び当該封止体の製造方法 |
| JP6782742B2 (ja) * | 2018-07-25 | 2020-11-11 | 日本ユピカ株式会社 | 車載用パワー半導体素子封止用結晶性ラジカル重合性組成物、当該組成物を使用した車載用パワー半導体素子封止体、及び当該封止体の製造方法 |
| KR102825222B1 (ko) | 2019-08-13 | 2025-06-25 | 에스케이온 주식회사 | 이차전지 및 이를 포함하는 배터리 모듈 |
| CN113913147B (zh) * | 2020-07-08 | 2023-12-05 | 3M创新有限公司 | 双组分导热粘合剂组合物和双组分导热填缝胶 |
| KR102887384B1 (ko) * | 2020-07-23 | 2025-11-17 | 주식회사 엘지에너지솔루션 | 경화성 조성물 |
| US20240052077A1 (en) * | 2020-12-01 | 2024-02-15 | Cosmo Oil Lubricants Co., Ltd. | Two-Component Curable Composition and Cured Product Thereof |
| JP2022133915A (ja) * | 2021-03-02 | 2022-09-14 | 株式会社日本触媒 | 二液型硬化性組成物 |
| KR102338814B1 (ko) * | 2021-09-09 | 2021-12-14 | 정상문 | 아크릴 방열 점착제 |
| US20240384071A1 (en) | 2021-10-04 | 2024-11-21 | Tokyo Printing Ink Mfg. Co., Ltd. | Resin composition for heat-dissipating gap filler, heat-dissipating gap filler, and article |
| US20250163305A1 (en) * | 2022-04-07 | 2025-05-22 | Sika Technology Ag | (meth)acrylate-based adhesive for corner angle bonding |
| US20250179333A1 (en) | 2023-11-30 | 2025-06-05 | Illinois Tool Works Inc. | Flame resistant and thermally conductive structural acrylic adhesive |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3901858A (en) * | 1970-12-04 | 1975-08-26 | Matsumoto Seiyaku Kogyo Kk | Two-component composition |
| US3994764A (en) * | 1975-06-13 | 1976-11-30 | Pratt & Lambert, Inc. | Adhesive compositions |
| US4147669A (en) * | 1977-03-28 | 1979-04-03 | Rockwell International Corporation | Conductive adhesive for providing electrical and thermal conductivity |
| JPS594667A (ja) * | 1982-06-09 | 1984-01-11 | ロクタイト・コ−ポレ−シヨン | 二液性無溶剤接着剤組成物ならびにこの組成物で表面を接着する方法 |
| US4722960A (en) * | 1983-01-18 | 1988-02-02 | Loctite Corporation | Aluminum filled compositions |
| US4574879A (en) * | 1984-02-29 | 1986-03-11 | The Bergquist Company | Mounting pad for solid-state devices |
| US4588768A (en) * | 1984-10-29 | 1986-05-13 | Sws Silicones Corporation | Thermally conductive heat curable organopolysiloxane compositions |
| US4584336A (en) * | 1984-10-29 | 1986-04-22 | Sws Silicones Corporation | Thermally conductive room temperature vulcanizable compositions |
| US4544696A (en) * | 1984-10-29 | 1985-10-01 | Sws Silicones Corporation | Silicone elastomers having thermally conductive properties |
| JPS61296077A (ja) * | 1985-06-25 | 1986-12-26 | Three Bond Co Ltd | 二液接触硬化型導電性接着剤 |
| US4604424A (en) | 1986-01-29 | 1986-08-05 | Dow Corning Corporation | Thermally conductive polyorganosiloxane elastomer composition |
| US4848353A (en) | 1986-09-05 | 1989-07-18 | Minnesota Mining And Manufacturing Company | Electrically-conductive, pressure-sensitive adhesive and biomedical electrodes |
| US5011870A (en) * | 1989-02-08 | 1991-04-30 | Dow Corning Corporation | Thermally conductive organosiloxane compositions |
| JPH0791468B2 (ja) * | 1991-04-26 | 1995-10-04 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物 |
| US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
| US5445308A (en) | 1993-03-29 | 1995-08-29 | Nelson; Richard D. | Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal |
| US5510174A (en) * | 1993-07-14 | 1996-04-23 | Chomerics, Inc. | Thermally conductive materials containing titanium diboride filler |
| JP3127093B2 (ja) | 1994-03-03 | 2001-01-22 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物 |
| US5430085A (en) * | 1994-11-30 | 1995-07-04 | Northrop Grumman Corporation | Thermally and electrically conductive caulk |
| CA2273890C (en) * | 1996-12-04 | 2006-03-14 | Nitto Denko Corporation | Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same |
| JP2001139637A (ja) * | 1999-11-10 | 2001-05-22 | Denki Kagaku Kogyo Kk | 硬化性樹脂組成物 |
| US6462126B1 (en) * | 2000-05-10 | 2002-10-08 | Illinois Tool Works Inc. | Structural adhesive |
| US6572971B2 (en) * | 2001-02-26 | 2003-06-03 | Ashland Chemical | Structural modified epoxy adhesive compositions |
| JP5059261B2 (ja) * | 2001-04-09 | 2012-10-24 | 電気化学工業株式会社 | ２剤型アクリル系接着剤組成物 |
| JP4832658B2 (ja) * | 2001-04-11 | 2011-12-07 | 電気化学工業株式会社 | 粘着性の柔軟なアクリル系樹脂 |
| US6433091B1 (en) * | 2001-05-10 | 2002-08-13 | Henkel Loctite Corporation | Adhesive composition |
| DE10212945A1 (de) * | 2002-03-22 | 2003-10-02 | Tesa Ag | Polyacrylat-Haftklebemasse, Herstellung und Verwendung |
| JP4231952B2 (ja) * | 2002-05-23 | 2009-03-04 | 株式会社トクヤマ | 接着キット |
| DE10259549A1 (de) * | 2002-12-19 | 2004-07-08 | Tesa Ag | Haftklebeartikel mit wenigstens einer Schicht aus einer elektrisch leitfähigen Haftklebemasse und Verfahren zu seiner Herstellung |
-
2005
- 2005-03-08 AT AT05725221T patent/ATE447596T1/de not_active IP Right Cessation
- 2005-03-08 WO PCT/US2005/007915 patent/WO2005087850A1/en not_active Ceased
- 2005-03-08 JP JP2007502994A patent/JP2007528437A/ja active Pending
- 2005-03-08 CN CNA2005800129613A patent/CN1946784A/zh active Pending
- 2005-03-08 EP EP05725221A patent/EP1723197B1/de not_active Not-in-force
- 2005-03-08 KR KR1020067020837A patent/KR20060126838A/ko not_active Ceased
- 2005-03-08 DE DE602005017472T patent/DE602005017472D1/de not_active Expired - Lifetime
-
2006
- 2006-09-05 US US11/470,085 patent/US20070023165A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007528437A (ja) | 2007-10-11 |
| KR20060126838A (ko) | 2006-12-08 |
| EP1723197B1 (de) | 2009-11-04 |
| EP1723197A1 (de) | 2006-11-22 |
| US20070023165A1 (en) | 2007-02-01 |
| WO2005087850A1 (en) | 2005-09-22 |
| DE602005017472D1 (de) | 2009-12-17 |
| EP1723197A4 (de) | 2008-06-04 |
| CN1946784A (zh) | 2007-04-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |