ATE447760T1 - Speicher mit wahlfreiem zugriff mit programmierbarem leiter und dazugehöriges programmierverfahren - Google Patents

Speicher mit wahlfreiem zugriff mit programmierbarem leiter und dazugehöriges programmierverfahren

Info

Publication number
ATE447760T1
ATE447760T1 AT02799242T AT02799242T ATE447760T1 AT E447760 T1 ATE447760 T1 AT E447760T1 AT 02799242 T AT02799242 T AT 02799242T AT 02799242 T AT02799242 T AT 02799242T AT E447760 T1 ATE447760 T1 AT E447760T1
Authority
AT
Austria
Prior art keywords
random access
access memory
programming method
associated programming
programmable wire
Prior art date
Application number
AT02799242T
Other languages
English (en)
Inventor
Glen Hush
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Application granted granted Critical
Publication of ATE447760T1 publication Critical patent/ATE447760T1/de

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0009RRAM elements whose operation depends upon chemical change
    • G11C13/0011RRAM elements whose operation depends upon chemical change comprising conductive bridging RAM [CBRAM] or programming metallization cells [PMCs]
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0023Address circuits or decoders
    • G11C13/0026Bit-line or column circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/12Bit line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, equalising circuits, for bit lines
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/009Write using potential difference applied between cell electrodes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/79Array wherein the access device being a transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Memories (AREA)
  • Read Only Memory (AREA)
  • Programmable Controllers (AREA)
  • Dram (AREA)
AT02799242T 2001-12-20 2002-12-16 Speicher mit wahlfreiem zugriff mit programmierbarem leiter und dazugehöriges programmierverfahren ATE447760T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/022,722 US6873538B2 (en) 2001-12-20 2001-12-20 Programmable conductor random access memory and a method for writing thereto
PCT/US2002/040078 WO2003054887A1 (en) 2001-12-20 2002-12-16 A programmable conductor random access memory and a method for writing thereto

Publications (1)

Publication Number Publication Date
ATE447760T1 true ATE447760T1 (de) 2009-11-15

Family

ID=21811095

Family Applications (2)

Application Number Title Priority Date Filing Date
AT09010432T ATE551699T1 (de) 2001-12-20 2002-12-16 Ram-speicher mit programmierbaren leiterelementen und verfahren zur programmierung
AT02799242T ATE447760T1 (de) 2001-12-20 2002-12-16 Speicher mit wahlfreiem zugriff mit programmierbarem leiter und dazugehöriges programmierverfahren

Family Applications Before (1)

Application Number Title Priority Date Filing Date
AT09010432T ATE551699T1 (de) 2001-12-20 2002-12-16 Ram-speicher mit programmierbaren leiterelementen und verfahren zur programmierung

Country Status (10)

Country Link
US (1) US6873538B2 (de)
EP (2) EP2112664B1 (de)
JP (1) JP4081011B2 (de)
KR (1) KR100626505B1 (de)
CN (2) CN100538878C (de)
AT (2) ATE551699T1 (de)
AU (1) AU2002364167A1 (de)
DE (1) DE60234273D1 (de)
TW (1) TWI223278B (de)
WO (1) WO2003054887A1 (de)

Families Citing this family (108)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6734455B2 (en) 2001-03-15 2004-05-11 Micron Technology, Inc. Agglomeration elimination for metal sputter deposition of chalcogenides
US7102150B2 (en) 2001-05-11 2006-09-05 Harshfield Steven T PCRAM memory cell and method of making same
US6951805B2 (en) * 2001-08-01 2005-10-04 Micron Technology, Inc. Method of forming integrated circuitry, method of forming memory circuitry, and method of forming random access memory circuitry
US6955940B2 (en) 2001-08-29 2005-10-18 Micron Technology, Inc. Method of forming chalcogenide comprising devices
US6784018B2 (en) 2001-08-29 2004-08-31 Micron Technology, Inc. Method of forming chalcogenide comprising devices and method of forming a programmable memory cell of memory circuitry
US6881623B2 (en) 2001-08-29 2005-04-19 Micron Technology, Inc. Method of forming chalcogenide comprising devices, method of forming a programmable memory cell of memory circuitry, and a chalcogenide comprising device
US6646902B2 (en) 2001-08-30 2003-11-11 Micron Technology, Inc. Method of retaining memory state in a programmable conductor RAM
US6560155B1 (en) * 2001-10-24 2003-05-06 Micron Technology, Inc. System and method for power saving memory refresh for dynamic random access memory devices after an extended interval
US6815818B2 (en) 2001-11-19 2004-11-09 Micron Technology, Inc. Electrode structure for use in an integrated circuit
US6791859B2 (en) 2001-11-20 2004-09-14 Micron Technology, Inc. Complementary bit PCRAM sense amplifier and method of operation
US6909656B2 (en) 2002-01-04 2005-06-21 Micron Technology, Inc. PCRAM rewrite prevention
US6867064B2 (en) 2002-02-15 2005-03-15 Micron Technology, Inc. Method to alter chalcogenide glass for improved switching characteristics
US6791885B2 (en) 2002-02-19 2004-09-14 Micron Technology, Inc. Programmable conductor random access memory and method for sensing same
US6847535B2 (en) 2002-02-20 2005-01-25 Micron Technology, Inc. Removable programmable conductor memory card and associated read/write device and method of operation
US7087919B2 (en) 2002-02-20 2006-08-08 Micron Technology, Inc. Layered resistance variable memory device and method of fabrication
US6891749B2 (en) * 2002-02-20 2005-05-10 Micron Technology, Inc. Resistance variable ‘on ’ memory
US7151273B2 (en) 2002-02-20 2006-12-19 Micron Technology, Inc. Silver-selenide/chalcogenide glass stack for resistance variable memory
US6809362B2 (en) 2002-02-20 2004-10-26 Micron Technology, Inc. Multiple data state memory cell
US6937528B2 (en) 2002-03-05 2005-08-30 Micron Technology, Inc. Variable resistance memory and method for sensing same
US6849868B2 (en) 2002-03-14 2005-02-01 Micron Technology, Inc. Methods and apparatus for resistance variable material cells
US6864500B2 (en) 2002-04-10 2005-03-08 Micron Technology, Inc. Programmable conductor memory cell structure
US6855975B2 (en) 2002-04-10 2005-02-15 Micron Technology, Inc. Thin film diode integrated with chalcogenide memory cell
US6858482B2 (en) * 2002-04-10 2005-02-22 Micron Technology, Inc. Method of manufacture of programmable switching circuits and memory cells employing a glass layer
US6731528B2 (en) * 2002-05-03 2004-05-04 Micron Technology, Inc. Dual write cycle programmable conductor memory system and method of operation
US6825135B2 (en) 2002-06-06 2004-11-30 Micron Technology, Inc. Elimination of dendrite formation during metal/chalcogenide glass deposition
US6890790B2 (en) 2002-06-06 2005-05-10 Micron Technology, Inc. Co-sputter deposition of metal-doped chalcogenides
US7209378B2 (en) 2002-08-08 2007-04-24 Micron Technology, Inc. Columnar 1T-N memory cell structure
US7018863B2 (en) 2002-08-22 2006-03-28 Micron Technology, Inc. Method of manufacture of a resistance variable memory cell
US6864521B2 (en) 2002-08-29 2005-03-08 Micron Technology, Inc. Method to control silver concentration in a resistance variable memory element
US6831019B1 (en) 2002-08-29 2004-12-14 Micron Technology, Inc. Plasma etching methods and methods of forming memory devices comprising a chalcogenide comprising layer received operably proximate conductive electrodes
US7163837B2 (en) 2002-08-29 2007-01-16 Micron Technology, Inc. Method of forming a resistance variable memory element
US7294527B2 (en) 2002-08-29 2007-11-13 Micron Technology Inc. Method of forming a memory cell
US7364644B2 (en) 2002-08-29 2008-04-29 Micron Technology, Inc. Silver selenide film stoichiometry and morphology control in sputter deposition
US7010644B2 (en) * 2002-08-29 2006-03-07 Micron Technology, Inc. Software refreshed memory device and method
US6867114B2 (en) 2002-08-29 2005-03-15 Micron Technology Inc. Methods to form a memory cell with metal-rich metal chalcogenide
US7022579B2 (en) 2003-03-14 2006-04-04 Micron Technology, Inc. Method for filling via with metal
US6888771B2 (en) * 2003-05-09 2005-05-03 Micron Technology, Inc. Skewed sense AMP for variable resistance memory sensing
JP4322048B2 (ja) * 2003-05-21 2009-08-26 株式会社ルネサステクノロジ 半導体記憶装置
US6930909B2 (en) 2003-06-25 2005-08-16 Micron Technology, Inc. Memory device and methods of controlling resistance variation and resistance profile drift
JP2005026576A (ja) * 2003-07-04 2005-01-27 Sony Corp 記憶装置
US6961277B2 (en) 2003-07-08 2005-11-01 Micron Technology, Inc. Method of refreshing a PCRAM memory device
JP4290494B2 (ja) * 2003-07-08 2009-07-08 株式会社ルネサステクノロジ 半導体記憶装置
US7061004B2 (en) 2003-07-21 2006-06-13 Micron Technology, Inc. Resistance variable memory elements and methods of formation
DE60310915D1 (de) * 2003-08-05 2007-02-15 St Microelectronics Srl Verfahren zur Herstellung einer Anordnung von Phasenwechselspeichern in Kupfer-Damaszenertechnologie sowie entsprechend hergestellte Anordnungen von Phasenwechselspeichern
US6903361B2 (en) 2003-09-17 2005-06-07 Micron Technology, Inc. Non-volatile memory structure
US20050149969A1 (en) * 2004-01-06 2005-07-07 Vishnu Kumar TV graphical menu interface that provides browseable listing of connected removable media content
US7138687B2 (en) * 2004-01-26 2006-11-21 Macronix International Co., Ltd. Thin film phase-change memory
US7098068B2 (en) 2004-03-10 2006-08-29 Micron Technology, Inc. Method of forming a chalcogenide material containing device
US7583551B2 (en) 2004-03-10 2009-09-01 Micron Technology, Inc. Power management control and controlling memory refresh operations
JP4553620B2 (ja) * 2004-04-06 2010-09-29 ルネサスエレクトロニクス株式会社 薄膜磁性体記憶装置
US7326950B2 (en) 2004-07-19 2008-02-05 Micron Technology, Inc. Memory device with switching glass layer
US7354793B2 (en) 2004-08-12 2008-04-08 Micron Technology, Inc. Method of forming a PCRAM device incorporating a resistance-variable chalocogenide element
US7190048B2 (en) 2004-07-19 2007-03-13 Micron Technology, Inc. Resistance variable memory device and method of fabrication
US7365411B2 (en) 2004-08-12 2008-04-29 Micron Technology, Inc. Resistance variable memory with temperature tolerant materials
US7151688B2 (en) 2004-09-01 2006-12-19 Micron Technology, Inc. Sensing of resistance variable memory devices
JP2006114087A (ja) 2004-10-13 2006-04-27 Sony Corp 記憶装置及び半導体装置
JP2006134398A (ja) 2004-11-04 2006-05-25 Sony Corp 記憶装置及び半導体装置
DE102004056911B4 (de) * 2004-11-25 2010-06-02 Qimonda Ag Speicherschaltung sowie Verfahren zum Auslesen eines Speicherdatums aus einer solchen Speicherschaltung
DE102004061548A1 (de) * 2004-12-21 2006-06-29 Infineon Technologies Ag Integration von 1T1R-CBRAM-Speicherzellen
US7374174B2 (en) 2004-12-22 2008-05-20 Micron Technology, Inc. Small electrode for resistance variable devices
US20060131555A1 (en) * 2004-12-22 2006-06-22 Micron Technology, Inc. Resistance variable devices with controllable channels
US7317200B2 (en) 2005-02-23 2008-01-08 Micron Technology, Inc. SnSe-based limited reprogrammable cell
US7709289B2 (en) 2005-04-22 2010-05-04 Micron Technology, Inc. Memory elements having patterned electrodes and method of forming the same
US7427770B2 (en) 2005-04-22 2008-09-23 Micron Technology, Inc. Memory array for increased bit density
US7269044B2 (en) 2005-04-22 2007-09-11 Micron Technology, Inc. Method and apparatus for accessing a memory array
US7269079B2 (en) 2005-05-16 2007-09-11 Micron Technology, Inc. Power circuits for reducing a number of power supply voltage taps required for sensing a resistive memory
JP2007018615A (ja) * 2005-07-08 2007-01-25 Sony Corp 記憶装置及び半導体装置
US7233520B2 (en) 2005-07-08 2007-06-19 Micron Technology, Inc. Process for erasing chalcogenide variable resistance memory bits
US7274034B2 (en) 2005-08-01 2007-09-25 Micron Technology, Inc. Resistance variable memory device with sputtered metal-chalcogenide region and method of fabrication
US7317567B2 (en) 2005-08-02 2008-01-08 Micron Technology, Inc. Method and apparatus for providing color changing thin film material
US7332735B2 (en) 2005-08-02 2008-02-19 Micron Technology, Inc. Phase change memory cell and method of formation
US7579615B2 (en) 2005-08-09 2009-08-25 Micron Technology, Inc. Access transistor for memory device
US7304368B2 (en) 2005-08-11 2007-12-04 Micron Technology, Inc. Chalcogenide-based electrokinetic memory element and method of forming the same
US7251154B2 (en) 2005-08-15 2007-07-31 Micron Technology, Inc. Method and apparatus providing a cross-point memory array using a variable resistance memory cell and capacitance
US20070047291A1 (en) * 2005-08-26 2007-03-01 Heinz Hoenigschmid Integrated memory circuit comprising a resistive memory element and a method for manufacturing such a memory circuit
US7277313B2 (en) 2005-08-31 2007-10-02 Micron Technology, Inc. Resistance variable memory element with threshold device and method of forming the same
US7257013B2 (en) * 2005-09-08 2007-08-14 Infineon Technologies Ag Method for writing data into a memory cell of a conductive bridging random access memory, memory circuit and CBRAM memory circuit
US7369424B2 (en) * 2005-11-09 2008-05-06 Industrial Technology Research Institute Programmable memory cell and operation method
DE102005061996B4 (de) * 2005-12-23 2016-02-18 Polaris Innovations Ltd. CBRAM-Speichereinrichtung und Verfahren zum Beschreiben einer Widerstandsspeicherzelle in einer CBRAM-Speichereinrichtung
US7518902B2 (en) 2005-12-23 2009-04-14 Infineon Technologies Ag Resistive memory device and method for writing to a resistive memory cell in a resistive memory device
US20070195580A1 (en) * 2006-02-23 2007-08-23 Heinz Hoenigschmid Memory circuit having a resistive memory cell and method for operating such a memory circuit
EP1835509A1 (de) * 2006-03-14 2007-09-19 Qimonda AG Speicherzelle, Speicher mit einer Speicherzelle und Verfahren zum Einschreiben von Daten in eine Speicherzelle
US7560723B2 (en) 2006-08-29 2009-07-14 Micron Technology, Inc. Enhanced memory density resistance variable memory cells, arrays, devices and systems including the same, and methods of fabrication
US7619917B2 (en) * 2006-11-28 2009-11-17 Qimonda North America Corp. Memory cell with trigger element
US8077495B2 (en) * 2006-12-05 2011-12-13 Spansion Llc Method of programming, erasing and repairing a memory device
US20080247218A1 (en) * 2007-04-04 2008-10-09 International Business Machines Corporation Design structure for implementing improved write performance for pcram devices
JP5503102B2 (ja) * 2007-07-04 2014-05-28 ピーエスフォー ルクスコ エスエイアールエル 相変化メモリ装置
KR101416878B1 (ko) * 2007-11-13 2014-07-09 삼성전자주식회사 파워 공급 회로 및 이를 구비하는 상 변화 메모리 장치
US7729163B2 (en) * 2008-03-26 2010-06-01 Micron Technology, Inc. Phase change memory
US7978507B2 (en) * 2008-06-27 2011-07-12 Sandisk 3D, Llc Pulse reset for non-volatile storage
US8059447B2 (en) * 2008-06-27 2011-11-15 Sandisk 3D Llc Capacitive discharge method for writing to non-volatile memory
US8467236B2 (en) 2008-08-01 2013-06-18 Boise State University Continuously variable resistor
US7825479B2 (en) 2008-08-06 2010-11-02 International Business Machines Corporation Electrical antifuse having a multi-thickness dielectric layer
US8130528B2 (en) 2008-08-25 2012-03-06 Sandisk 3D Llc Memory system with sectional data lines
US8027209B2 (en) 2008-10-06 2011-09-27 Sandisk 3D, Llc Continuous programming of non-volatile memory
KR101537316B1 (ko) * 2008-11-14 2015-07-16 삼성전자주식회사 상 변화 메모리 장치
US8279650B2 (en) 2009-04-20 2012-10-02 Sandisk 3D Llc Memory system with data line switching scheme
JP4796640B2 (ja) * 2009-05-19 2011-10-19 シャープ株式会社 半導体記憶装置、及び、電子機器
EP2522355B1 (de) * 2010-01-06 2018-02-21 Kabushiki Kaisha Yakult Honsha Promoter für die reparatur von dna-schäden zur oralen anwendung und elastaseaktivitätshemmer zur oralen anwendung
US8929125B2 (en) 2013-02-20 2015-01-06 Micron Technology, Inc. Apparatus and methods for forming a memory cell using charge monitoring
US9178143B2 (en) * 2013-07-29 2015-11-03 Industrial Technology Research Institute Resistive memory structure
DE102014113030A1 (de) 2014-09-10 2016-03-10 Infineon Technologies Ag Speicherschaltungen und ein Verfahren zum Bilden einer Speicherschaltung
US9978810B2 (en) 2015-11-04 2018-05-22 Micron Technology, Inc. Three-dimensional memory apparatuses and methods of use
US10134470B2 (en) * 2015-11-04 2018-11-20 Micron Technology, Inc. Apparatuses and methods including memory and operation of same
US9659646B1 (en) 2016-01-11 2017-05-23 Crossbar, Inc. Programmable logic applications for an array of high on/off ratio and high speed non-volatile memory cells
US10446226B2 (en) 2016-08-08 2019-10-15 Micron Technology, Inc. Apparatuses including multi-level memory cells and methods of operation of same
US9990992B2 (en) * 2016-10-25 2018-06-05 Arm Ltd. Method, system and device for non-volatile memory device operation
US10157670B2 (en) 2016-10-28 2018-12-18 Micron Technology, Inc. Apparatuses including memory cells and methods of operation of same

Family Cites Families (164)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271591A (en) 1963-09-20 1966-09-06 Energy Conversion Devices Inc Symmetrical current controlling device
US3622319A (en) 1966-10-20 1971-11-23 Western Electric Co Nonreflecting photomasks and methods of making same
US3868651A (en) 1970-08-13 1975-02-25 Energy Conversion Devices Inc Method and apparatus for storing and reading data in a memory having catalytic material to initiate amorphous to crystalline change in memory structure
US3743847A (en) 1971-06-01 1973-07-03 Motorola Inc Amorphous silicon film as a uv filter
US4267261A (en) 1971-07-15 1981-05-12 Energy Conversion Devices, Inc. Method for full format imaging
US3961314A (en) 1974-03-05 1976-06-01 Energy Conversion Devices, Inc. Structure and method for producing an image
US3966317A (en) 1974-04-08 1976-06-29 Energy Conversion Devices, Inc. Dry process production of archival microform records from hard copy
US4177474A (en) 1977-05-18 1979-12-04 Energy Conversion Devices, Inc. High temperature amorphous semiconductor member and method of making the same
JPS5565365A (en) 1978-11-07 1980-05-16 Nippon Telegr & Teleph Corp <Ntt> Pattern forming method
DE2901303C2 (de) 1979-01-15 1984-04-19 Max Planck Gesellschaft Zur Foerderung Der Wissenschaften E.V., 3400 Goettingen Festes Ionenleitermaterial, seine Verwendung und Verfahren zu dessen Herstellung
US4312938A (en) 1979-07-06 1982-01-26 Drexler Technology Corporation Method for making a broadband reflective laser recording and data storage medium with absorptive underlayer
US4269935A (en) 1979-07-13 1981-05-26 Ionomet Company, Inc. Process of doping silver image in chalcogenide layer
US4316946A (en) 1979-12-03 1982-02-23 Ionomet Company, Inc. Surface sensitized chalcogenide product and process for making and using the same
JPS56126916U (de) 1980-02-29 1981-09-26
US4499557A (en) 1980-10-28 1985-02-12 Energy Conversion Devices, Inc. Programmable cell for use in programmable electronic arrays
US4405710A (en) 1981-06-22 1983-09-20 Cornell Research Foundation, Inc. Ion beam exposure of (g-Gex -Se1-x) inorganic resists
US4737379A (en) 1982-09-24 1988-04-12 Energy Conversion Devices, Inc. Plasma deposited coatings, and low temperature plasma method of making same
US4545111A (en) 1983-01-18 1985-10-08 Energy Conversion Devices, Inc. Method for making, parallel preprogramming or field programming of electronic matrix arrays
US4608296A (en) 1983-12-06 1986-08-26 Energy Conversion Devices, Inc. Superconducting films and devices exhibiting AC to DC conversion
US4795657A (en) 1984-04-13 1989-01-03 Energy Conversion Devices, Inc. Method of fabricating a programmable array
US4769338A (en) 1984-05-14 1988-09-06 Energy Conversion Devices, Inc. Thin film field effect transistor and method of making same
US4673957A (en) 1984-05-14 1987-06-16 Energy Conversion Devices, Inc. Integrated circuit compatible thin film field effect transistor and method of making same
US4670763A (en) 1984-05-14 1987-06-02 Energy Conversion Devices, Inc. Thin film field effect transistor
US4668968A (en) 1984-05-14 1987-05-26 Energy Conversion Devices, Inc. Integrated circuit compatible thin film field effect transistor and method of making same
US4843443A (en) 1984-05-14 1989-06-27 Energy Conversion Devices, Inc. Thin film field effect transistor and method of making same
US4678679A (en) 1984-06-25 1987-07-07 Energy Conversion Devices, Inc. Continuous deposition of activated process gases
US4646266A (en) 1984-09-28 1987-02-24 Energy Conversion Devices, Inc. Programmable semiconductor structures and methods for using the same
US4664939A (en) 1985-04-01 1987-05-12 Energy Conversion Devices, Inc. Vertical semiconductor processor
US4637895A (en) 1985-04-01 1987-01-20 Energy Conversion Devices, Inc. Gas mixtures for the vapor deposition of semiconductor material
US4710899A (en) 1985-06-10 1987-12-01 Energy Conversion Devices, Inc. Data storage medium incorporating a transition metal for increased switching speed
US4671618A (en) 1986-05-22 1987-06-09 Wu Bao Gang Liquid crystalline-plastic material having submillisecond switch times and extended memory
US4766471A (en) 1986-01-23 1988-08-23 Energy Conversion Devices, Inc. Thin film electro-optical devices
US4818717A (en) 1986-06-27 1989-04-04 Energy Conversion Devices, Inc. Method for making electronic matrix arrays
US4728406A (en) 1986-08-18 1988-03-01 Energy Conversion Devices, Inc. Method for plasma - coating a semiconductor body
US4809044A (en) 1986-08-22 1989-02-28 Energy Conversion Devices, Inc. Thin film overvoltage protection devices
US4845533A (en) 1986-08-22 1989-07-04 Energy Conversion Devices, Inc. Thin film electrical devices with amorphous carbon electrodes and method of making same
US4853785A (en) 1986-10-15 1989-08-01 Energy Conversion Devices, Inc. Electronic camera including electronic signal storage cartridge
US4788594A (en) 1986-10-15 1988-11-29 Energy Conversion Devices, Inc. Solid state electronic camera including thin film matrix of photosensors
GB8627488D0 (en) 1986-11-18 1986-12-17 British Petroleum Co Plc Memory matrix
US4847674A (en) 1987-03-10 1989-07-11 Advanced Micro Devices, Inc. High speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanism
US4800526A (en) 1987-05-08 1989-01-24 Gaf Corporation Memory element for information storage and retrieval system and associated process
US4891330A (en) 1987-07-27 1990-01-02 Energy Conversion Devices, Inc. Method of fabricating n-type and p-type microcrystalline semiconductor alloy material including band gap widening elements
US4775425A (en) 1987-07-27 1988-10-04 Energy Conversion Devices, Inc. P and n-type microcrystalline semiconductor alloy material including band gap widening elements, devices utilizing same
US5272359A (en) 1988-04-07 1993-12-21 California Institute Of Technology Reversible non-volatile switch based on a TCNQ charge transfer complex
GB8910854D0 (en) 1989-05-11 1989-06-28 British Petroleum Co Plc Semiconductor device
US5159661A (en) 1990-10-05 1992-10-27 Energy Conversion Devices, Inc. Vertically interconnected parallel distributed processor
US5314772A (en) 1990-10-09 1994-05-24 Arizona Board Of Regents High resolution, multi-layer resist for microlithography and method therefor
JPH0770731B2 (ja) 1990-11-22 1995-07-31 松下電器産業株式会社 電気可塑性素子
US5534712A (en) 1991-01-18 1996-07-09 Energy Conversion Devices, Inc. Electrically erasable memory elements characterized by reduced current and improved thermal stability
US5296716A (en) 1991-01-18 1994-03-22 Energy Conversion Devices, Inc. Electrically erasable, directly overwritable, multibit single cell memory elements and arrays fabricated therefrom
US5166758A (en) 1991-01-18 1992-11-24 Energy Conversion Devices, Inc. Electrically erasable phase change memory
US5335219A (en) 1991-01-18 1994-08-02 Ovshinsky Stanford R Homogeneous composition of microcrystalline semiconductor material, semiconductor devices and directly overwritable memory elements fabricated therefrom, and arrays fabricated from the memory elements
US5596522A (en) 1991-01-18 1997-01-21 Energy Conversion Devices, Inc. Homogeneous compositions of microcrystalline semiconductor material, semiconductor devices and directly overwritable memory elements fabricated therefrom, and arrays fabricated from the memory elements
US5406509A (en) 1991-01-18 1995-04-11 Energy Conversion Devices, Inc. Electrically erasable, directly overwritable, multibit single cell memory elements and arrays fabricated therefrom
US5536947A (en) 1991-01-18 1996-07-16 Energy Conversion Devices, Inc. Electrically erasable, directly overwritable, multibit single cell memory element and arrays fabricated therefrom
US5414271A (en) 1991-01-18 1995-05-09 Energy Conversion Devices, Inc. Electrically erasable memory elements having improved set resistance stability
US5534711A (en) 1991-01-18 1996-07-09 Energy Conversion Devices, Inc. Electrically erasable, directly overwritable, multibit single cell memory elements and arrays fabricated therefrom
US5341328A (en) 1991-01-18 1994-08-23 Energy Conversion Devices, Inc. Electrically erasable memory elements having reduced switching current requirements and increased write/erase cycle life
US5128099A (en) 1991-02-15 1992-07-07 Energy Conversion Devices, Inc. Congruent state changeable optical memory material and device
US5219788A (en) 1991-02-25 1993-06-15 Ibm Corporation Bilayer metallization cap for photolithography
US5177567A (en) 1991-07-19 1993-01-05 Energy Conversion Devices, Inc. Thin-film structure for chalcogenide electrical switching devices and process therefor
US5359205A (en) 1991-11-07 1994-10-25 Energy Conversion Devices, Inc. Electrically erasable memory elements characterized by reduced current and improved thermal stability
US5238862A (en) 1992-03-18 1993-08-24 Micron Technology, Inc. Method of forming a stacked capacitor with striated electrode
US5512328A (en) 1992-08-07 1996-04-30 Hitachi, Ltd. Method for forming a pattern and forming a thin film used in pattern formation
US5350484A (en) 1992-09-08 1994-09-27 Intel Corporation Method for the anisotropic etching of metal films in the fabrication of interconnects
BE1007902A3 (nl) 1993-12-23 1995-11-14 Philips Electronics Nv Schakelelement met geheugen voorzien van schottky tunnelbarriere.
US5500532A (en) 1994-08-18 1996-03-19 Arizona Board Of Regents Personal electronic dosimeter
JP2643870B2 (ja) 1994-11-29 1997-08-20 日本電気株式会社 半導体記憶装置の製造方法
US5543737A (en) 1995-02-10 1996-08-06 Energy Conversion Devices, Inc. Logical operation circuit employing two-terminal chalcogenide switches
US5751012A (en) 1995-06-07 1998-05-12 Micron Technology, Inc. Polysilicon pillar diode for use in a non-volatile memory cell
US5869843A (en) 1995-06-07 1999-02-09 Micron Technology, Inc. Memory array having a multi-state element and method for forming such array or cells thereof
US5879955A (en) 1995-06-07 1999-03-09 Micron Technology, Inc. Method for fabricating an array of ultra-small pores for chalcogenide memory cells
US6420725B1 (en) 1995-06-07 2002-07-16 Micron Technology, Inc. Method and apparatus for forming an integrated circuit electrode having a reduced contact area
US5789758A (en) 1995-06-07 1998-08-04 Micron Technology, Inc. Chalcogenide memory cell with a plurality of chalcogenide electrodes
WO1996041381A1 (en) 1995-06-07 1996-12-19 Micron Technology, Inc. A stack/trench diode for use with a multi-state material in a non-volatile memory cell
US5714768A (en) 1995-10-24 1998-02-03 Energy Conversion Devices, Inc. Second-layer phase change memory array on top of a logic device
US5694054A (en) 1995-11-28 1997-12-02 Energy Conversion Devices, Inc. Integrated drivers for flat panel displays employing chalcogenide logic elements
US5591501A (en) 1995-12-20 1997-01-07 Energy Conversion Devices, Inc. Optical recording medium having a plurality of discrete phase change data recording points
US6653733B1 (en) 1996-02-23 2003-11-25 Micron Technology, Inc. Conductors in semiconductor devices
US5687112A (en) 1996-04-19 1997-11-11 Energy Conversion Devices, Inc. Multibit single cell memory element having tapered contact
US5852870A (en) 1996-04-24 1998-12-29 Amkor Technology, Inc. Method of making grid array assembly
US5761115A (en) 1996-05-30 1998-06-02 Axon Technologies Corporation Programmable metallization cell structure and method of making same
US5789277A (en) 1996-07-22 1998-08-04 Micron Technology, Inc. Method of making chalogenide memory device
US5998244A (en) 1996-08-22 1999-12-07 Micron Technology, Inc. Memory cell incorporating a chalcogenide element and method of making same
US5883827A (en) * 1996-08-26 1999-03-16 Micron Technology, Inc. Method and apparatus for reading/writing data in a memory system including programmable resistors
US5761112A (en) 1996-09-20 1998-06-02 Mosel Vitelic Corporation Charge storage for sensing operations in a DRAM
US5825046A (en) 1996-10-28 1998-10-20 Energy Conversion Devices, Inc. Composite memory material comprising a mixture of phase-change memory material and dielectric material
US6087674A (en) 1996-10-28 2000-07-11 Energy Conversion Devices, Inc. Memory element with memory material comprising phase-change material and dielectric material
US5781469A (en) * 1997-01-24 1998-07-14 Atmel Corporation Bitline load and precharge structure for an SRAM memory
US5846889A (en) 1997-03-14 1998-12-08 The United States Of America As Represented By The Secretary Of The Navy Infrared transparent selenide glasses
US5998066A (en) 1997-05-16 1999-12-07 Aerial Imaging Corporation Gray scale mask and depth pattern transfer technique using inorganic chalcogenide glass
US5933365A (en) 1997-06-19 1999-08-03 Energy Conversion Devices, Inc. Memory element with energy control mechanism
US6051511A (en) 1997-07-31 2000-04-18 Micron Technology, Inc. Method and apparatus for reducing isolation stress in integrated circuits
US6418049B1 (en) 1997-12-04 2002-07-09 Arizona Board Of Regents Programmable sub-surface aggregating metallization structure and method of making same
US6011757A (en) 1998-01-27 2000-01-04 Ovshinsky; Stanford R. Optical recording media having increased erasability
US6297170B1 (en) 1998-06-23 2001-10-02 Vlsi Technology, Inc. Sacrificial multilayer anti-reflective coating for mos gate formation
US6141241A (en) 1998-06-23 2000-10-31 Energy Conversion Devices, Inc. Universal memory element with systems employing same and apparatus and method for reading, writing and programming same
US5912839A (en) 1998-06-23 1999-06-15 Energy Conversion Devices, Inc. Universal memory element and method of programming same
US6469364B1 (en) 1998-08-31 2002-10-22 Arizona Board Of Regents Programmable interconnection system for electrical circuits
US6388324B2 (en) 1998-08-31 2002-05-14 Arizona Board Of Regents Self-repairing interconnections for electrical circuits
US6825489B2 (en) 2001-04-06 2004-11-30 Axon Technologies Corporation Microelectronic device, structure, and system, including a memory structure having a variable programmable property and method of forming the same
US6635914B2 (en) 2000-09-08 2003-10-21 Axon Technologies Corp. Microelectronic programmable device and methods of forming and programming the same
US6487106B1 (en) 1999-01-12 2002-11-26 Arizona Board Of Regents Programmable microelectronic devices and method of forming and programming same
US6177338B1 (en) 1999-02-08 2001-01-23 Taiwan Semiconductor Manufacturing Company Two step barrier process
AU763809B2 (en) 1999-02-11 2003-07-31 Arizona Board Of Regents On Behalf Of The University Of Arizona, The Programmable microelectronic devices and methods of forming and programming same
US6180456B1 (en) * 1999-02-17 2001-01-30 International Business Machines Corporation Triple polysilicon embedded NVRAM cell and method thereof
US6072716A (en) 1999-04-14 2000-06-06 Massachusetts Institute Of Technology Memory structures and methods of making same
US6143604A (en) 1999-06-04 2000-11-07 Taiwan Semiconductor Manufacturing Company Method for fabricating small-size two-step contacts for word-line strapping on dynamic random access memory (DRAM)
US6350679B1 (en) 1999-08-03 2002-02-26 Micron Technology, Inc. Methods of providing an interlevel dielectric layer intermediate different elevation conductive metal layers in the fabrication of integrated circuitry
US6423628B1 (en) 1999-10-22 2002-07-23 Lsi Logic Corporation Method of forming integrated circuit structure having low dielectric constant material and having silicon oxynitride caps over closely spaced apart metal lines
US6188615B1 (en) * 1999-10-29 2001-02-13 Hewlett-Packard Company MRAM device including digital sense amplifiers
US6314014B1 (en) 1999-12-16 2001-11-06 Ovonyx, Inc. Programmable resistance memory arrays with reference cells
JP2002050181A (ja) 2000-02-07 2002-02-15 Toshiba Corp 半導体記憶装置
US6501111B1 (en) 2000-06-30 2002-12-31 Intel Corporation Three-dimensional (3D) programmable device
AU2001288971A1 (en) 2000-09-08 2002-03-22 Axon Technologies Corporation Microelectronic programmable device and methods of forming and programming the same
US6563164B2 (en) 2000-09-29 2003-05-13 Ovonyx, Inc. Compositionally modified resistive electrode
US6567293B1 (en) 2000-09-29 2003-05-20 Ovonyx, Inc. Single level metal memory cell using chalcogenide cladding
US6555860B2 (en) 2000-09-29 2003-04-29 Intel Corporation Compositionally modified resistive electrode
US6404665B1 (en) 2000-09-29 2002-06-11 Intel Corporation Compositionally modified resistive electrode
US6429064B1 (en) 2000-09-29 2002-08-06 Intel Corporation Reduced contact area of sidewall conductor
US6339544B1 (en) 2000-09-29 2002-01-15 Intel Corporation Method to enhance performance of thermal resistor device
US6653193B2 (en) 2000-12-08 2003-11-25 Micron Technology, Inc. Resistance variable device
US6649928B2 (en) 2000-12-13 2003-11-18 Intel Corporation Method to selectively remove one side of a conductive bottom electrode of a phase-change memory cell and structure obtained thereby
US6696355B2 (en) 2000-12-14 2004-02-24 Ovonyx, Inc. Method to selectively increase the top resistance of the lower programming electrode in a phase-change memory
US6437383B1 (en) 2000-12-21 2002-08-20 Intel Corporation Dual trench isolation for a phase-change memory cell and method of making same
US6569705B2 (en) 2000-12-21 2003-05-27 Intel Corporation Metal structure for a phase-change memory device
US6646297B2 (en) 2000-12-26 2003-11-11 Ovonyx, Inc. Lower electrode isolation in a double-wide trench
US6534781B2 (en) 2000-12-26 2003-03-18 Ovonyx, Inc. Phase-change memory bipolar array utilizing a single shallow trench isolation for creating an individual active area region for two memory array elements and one bipolar base contact
US6531373B2 (en) 2000-12-27 2003-03-11 Ovonyx, Inc. Method of forming a phase-change memory cell using silicon on insulator low electrode in charcogenide elements
US6687427B2 (en) 2000-12-29 2004-02-03 Intel Corporation Optic switch
US6638820B2 (en) 2001-02-08 2003-10-28 Micron Technology, Inc. Method of forming chalcogenide comprising devices, method of precluding diffusion of a metal into adjacent chalcogenide material, and chalcogenide comprising devices
US6727192B2 (en) 2001-03-01 2004-04-27 Micron Technology, Inc. Methods of metal doping a chalcogenide material
US6348365B1 (en) 2001-03-02 2002-02-19 Micron Technology, Inc. PCRAM cell manufacturing
US6818481B2 (en) 2001-03-07 2004-11-16 Micron Technology, Inc. Method to manufacture a buried electrode PCRAM cell
US6473332B1 (en) 2001-04-04 2002-10-29 The University Of Houston System Electrically variable multi-state resistance computing
WO2002091384A1 (en) 2001-05-07 2002-11-14 Advanced Micro Devices, Inc. A memory device with a self-assembled polymer film and method of making the same
US6480438B1 (en) 2001-06-12 2002-11-12 Ovonyx, Inc. Providing equal cell programming conditions across a large and high density array of phase-change memory cells
US6613604B2 (en) 2001-08-02 2003-09-02 Ovonyx, Inc. Method for making small pore for use in programmable resistance memory element
US6589714B2 (en) 2001-06-26 2003-07-08 Ovonyx, Inc. Method for making programmable resistance memory element using silylated photoresist
US6570784B2 (en) 2001-06-29 2003-05-27 Ovonyx, Inc. Programming a phase-change material memory
US6487113B1 (en) 2001-06-29 2002-11-26 Ovonyx, Inc. Programming a phase-change memory with slow quench time
US6462984B1 (en) 2001-06-29 2002-10-08 Intel Corporation Biasing scheme of floating unselected wordlines and bitlines of a diode-based memory array
US6673700B2 (en) 2001-06-30 2004-01-06 Ovonyx, Inc. Reduced area intersection between electrode and programming element
US6511862B2 (en) 2001-06-30 2003-01-28 Ovonyx, Inc. Modified contact for programmable devices
US6605527B2 (en) 2001-06-30 2003-08-12 Intel Corporation Reduced area intersection between electrode and programming element
US6514805B2 (en) 2001-06-30 2003-02-04 Intel Corporation Trench sidewall profile for device isolation
US6642102B2 (en) 2001-06-30 2003-11-04 Intel Corporation Barrier material encapsulation of programmable material
US6511867B2 (en) 2001-06-30 2003-01-28 Ovonyx, Inc. Utilizing atomic layer deposition for programmable device
US6951805B2 (en) 2001-08-01 2005-10-04 Micron Technology, Inc. Method of forming integrated circuitry, method of forming memory circuitry, and method of forming random access memory circuitry
US6590807B2 (en) 2001-08-02 2003-07-08 Intel Corporation Method for reading a structural phase-change memory
US20030047765A1 (en) 2001-08-30 2003-03-13 Campbell Kristy A. Stoichiometry for chalcogenide glasses useful for memory devices and method of formation
US6507061B1 (en) 2001-08-31 2003-01-14 Intel Corporation Multiple layer phase-change memory
EP2112659A1 (de) 2001-09-01 2009-10-28 Energy Convertion Devices, Inc. Verbesserte Datenspeicherung in optischen Datenspeicher- und -abrufsystemen mit blauen Lasern und/oder Plasmonlinsen
US6545287B2 (en) 2001-09-07 2003-04-08 Intel Corporation Using selective deposition to form phase-change memory cells
US6586761B2 (en) 2001-09-07 2003-07-01 Intel Corporation Phase change material memory device
US6690026B2 (en) 2001-09-28 2004-02-10 Intel Corporation Method of fabricating a three-dimensional array of active media
US6566700B2 (en) 2001-10-11 2003-05-20 Ovonyx, Inc. Carbon-containing interfacial layer for phase-change memory
US6545907B1 (en) 2001-10-30 2003-04-08 Ovonyx, Inc. Technique and apparatus for performing write operations to a phase change material memory device
US6576921B2 (en) 2001-11-08 2003-06-10 Intel Corporation Isolating phase change material memory cells
US6667900B2 (en) 2001-12-28 2003-12-23 Ovonyx, Inc. Method and apparatus to operate a memory cell
US6625054B2 (en) 2001-12-28 2003-09-23 Intel Corporation Method and apparatus to program a phase change memory
US6512241B1 (en) 2001-12-31 2003-01-28 Intel Corporation Phase change material memory device
US6671710B2 (en) 2002-05-10 2003-12-30 Energy Conversion Devices, Inc. Methods of computing with digital multistate phase change materials
US6918382B2 (en) 2002-08-26 2005-07-19 Energy Conversion Devices, Inc. Hydrogen powered scooter

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AU2002364167A1 (en) 2003-07-09
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US20030117831A1 (en) 2003-06-26
KR100626505B1 (ko) 2006-09-20
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