ATE448566T1 - Verbesserungen von verfahren zum plasmaätzen - Google Patents

Verbesserungen von verfahren zum plasmaätzen

Info

Publication number
ATE448566T1
ATE448566T1 AT00940508T AT00940508T ATE448566T1 AT E448566 T1 ATE448566 T1 AT E448566T1 AT 00940508 T AT00940508 T AT 00940508T AT 00940508 T AT00940508 T AT 00940508T AT E448566 T1 ATE448566 T1 AT E448566T1
Authority
AT
Austria
Prior art keywords
methyl
plasma
substrate
etching
radicals
Prior art date
Application number
AT00940508T
Other languages
English (en)
Inventor
Srinivasan Anand
Carl-Fredrik Carlstrom
Gunnar Landgren
Original Assignee
Surface Technology Systems Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SE9902344A external-priority patent/SE9902344D0/xx
Application filed by Surface Technology Systems Plc filed Critical Surface Technology Systems Plc
Application granted granted Critical
Publication of ATE448566T1 publication Critical patent/ATE448566T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/246—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group III-V materials

Landscapes

  • Drying Of Semiconductors (AREA)
AT00940508T 1999-06-21 2000-06-21 Verbesserungen von verfahren zum plasmaätzen ATE448566T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9902344A SE9902344D0 (sv) 1999-06-21 1999-06-21 Dry etching process of III-V-semiconductor
SE9903213A SE9903213D0 (sv) 1999-06-21 1999-09-10 Dry etching process of compound semiconductor materials
PCT/GB2000/002255 WO2000079578A1 (en) 1999-06-21 2000-06-21 Improvements relating to plasma etching

Publications (1)

Publication Number Publication Date
ATE448566T1 true ATE448566T1 (de) 2009-11-15

Family

ID=26663600

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00940508T ATE448566T1 (de) 1999-06-21 2000-06-21 Verbesserungen von verfahren zum plasmaätzen

Country Status (8)

Country Link
US (1) US6933242B1 (de)
EP (1) EP1188180B1 (de)
JP (1) JP4979167B2 (de)
KR (1) KR100731849B1 (de)
AT (1) ATE448566T1 (de)
DE (1) DE60043300D1 (de)
SE (1) SE9903213D0 (de)
WO (1) WO2000079578A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6820570B2 (en) 2001-08-15 2004-11-23 Nobel Biocare Services Ag Atomic layer deposition reactor
KR100759808B1 (ko) * 2005-12-08 2007-09-20 한국전자통신연구원 Ｉｉｉ－ｖ 족 반도체 다층구조의 식각 방법 및 이를이용한 수직공진형 표면방출 레이저 제조 방법
WO2008121158A1 (en) * 2007-04-02 2008-10-09 Inphase Technologies, Inc. Non-ft plane angular filters
WO2011056783A2 (en) * 2009-11-09 2011-05-12 3M Innovative Properties Company Etching process for semiconductors
EP3127141B1 (de) * 2014-04-01 2021-03-24 EV Group E. Thallner GmbH Verfahren zur oberflächenreinigung von substraten
SG10201604524PA (en) * 2015-06-05 2017-01-27 Lam Res Corp ATOMIC LAYER ETCHING OF GaN AND OTHER III-V MATERIALS
US10096487B2 (en) 2015-08-19 2018-10-09 Lam Research Corporation Atomic layer etching of tungsten and other metals
US9991128B2 (en) 2016-02-05 2018-06-05 Lam Research Corporation Atomic layer etching in continuous plasma
US10566212B2 (en) 2016-12-19 2020-02-18 Lam Research Corporation Designer atomic layer etching
KR102733594B1 (ko) * 2019-12-18 2024-11-25 주식회사 원익아이피에스 기판 처리 방법
US12280091B2 (en) 2021-02-03 2025-04-22 Lam Research Corporation Etch selectivity control in atomic layer etching

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07201820A (ja) * 1993-12-28 1995-08-04 Fujitsu Ltd 水銀カドミウムテルル基板のエッチング方法
US5527425A (en) * 1995-07-21 1996-06-18 At&T Corp. Method of making in-containing III/V semiconductor devices
JPH10303181A (ja) * 1997-04-28 1998-11-13 Mitsui Chem Inc 乾式プロセスガス
JPH1116896A (ja) * 1997-06-27 1999-01-22 Fujitsu Ltd 化合物半導体装置の製造方法

Also Published As

Publication number Publication date
DE60043300D1 (de) 2009-12-24
US6933242B1 (en) 2005-08-23
EP1188180A1 (de) 2002-03-20
SE9903213D0 (sv) 1999-09-10
WO2000079578A1 (en) 2000-12-28
EP1188180B1 (de) 2009-11-11
JP4979167B2 (ja) 2012-07-18
JP2003502860A (ja) 2003-01-21
KR20020041333A (ko) 2002-06-01
KR100731849B1 (ko) 2007-06-25

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Legal Events

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