ATE454713T1 - Flip-chip-verbindung über chip-durchgangswege - Google Patents

Flip-chip-verbindung über chip-durchgangswege

Info

Publication number
ATE454713T1
ATE454713T1 AT07826430T AT07826430T ATE454713T1 AT E454713 T1 ATE454713 T1 AT E454713T1 AT 07826430 T AT07826430 T AT 07826430T AT 07826430 T AT07826430 T AT 07826430T AT E454713 T1 ATE454713 T1 AT E454713T1
Authority
AT
Austria
Prior art keywords
integrated circuit
circuit package
chip
pathways
connection via
Prior art date
Application number
AT07826430T
Other languages
English (en)
Inventor
Andrew L Robinson
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE454713T1 publication Critical patent/ATE454713T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/521—Constructional features
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
    • G01S15/88—Sonar systems specially adapted for specific applications
    • G01S15/89—Sonar systems specially adapted for specific applications for mapping or imaging
    • G01S15/8906—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques
    • G01S15/8909—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration
    • G01S15/8915—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration using a transducer array
    • G01S15/8925—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration using a transducer array the array being a two-dimensional transducer configuration, i.e. matrix or orthogonal linear arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/942—Dispositions of bond pads relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Wire Bonding (AREA)
  • Micromachines (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
AT07826430T 2006-09-25 2007-09-18 Flip-chip-verbindung über chip-durchgangswege ATE454713T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82681506P 2006-09-25 2006-09-25
PCT/IB2007/053771 WO2008038183A1 (en) 2006-09-25 2007-09-18 Flip-chip interconnection through chip vias

Publications (1)

Publication Number Publication Date
ATE454713T1 true ATE454713T1 (de) 2010-01-15

Family

ID=39060260

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07826430T ATE454713T1 (de) 2006-09-25 2007-09-18 Flip-chip-verbindung über chip-durchgangswege

Country Status (9)

Country Link
US (1) US8242665B2 (de)
EP (1) EP2070114B1 (de)
JP (1) JP5175853B2 (de)
CN (1) CN101517737B (de)
AT (1) ATE454713T1 (de)
DE (1) DE602007004242D1 (de)
RU (1) RU2449418C2 (de)
TW (1) TW200826209A (de)
WO (1) WO2008038183A1 (de)

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US10080544B2 (en) 2008-09-15 2018-09-25 Teratech Corporation Ultrasound 3D imaging system
US20120179044A1 (en) 2009-09-30 2012-07-12 Alice Chiang Ultrasound 3d imaging system
US12102479B2 (en) 2008-09-15 2024-10-01 Teratech Corporation Ultrasound 3D imaging system
US8207652B2 (en) * 2009-06-16 2012-06-26 General Electric Company Ultrasound transducer with improved acoustic performance
US8575558B2 (en) 2010-11-30 2013-11-05 General Electric Company Detector array with a through-via interposer
US8659148B2 (en) 2010-11-30 2014-02-25 General Electric Company Tileable sensor array
WO2012112540A2 (en) * 2011-02-15 2012-08-23 Fujifilm Dimatix, Inc. Piezoelectric transducers using micro-dome arrays
US20130331705A1 (en) * 2011-03-22 2013-12-12 Koninklijke Philips Electronics N.V. Ultrasonic cmut with suppressed acoustic coupling to the substrate
IN2014CN02550A (de) 2011-10-17 2015-08-07 Koninkl Philips Nv
US8659212B2 (en) * 2012-02-16 2014-02-25 General Electric Company Ultrasound transducer and method for manufacturing an ultrasound transducer
US8742646B2 (en) * 2012-03-29 2014-06-03 General Electric Company Ultrasound acoustic assemblies and methods of manufacture
CN109954646B (zh) 2013-03-15 2021-04-27 蝴蝶网络有限公司 超声装置
US9667889B2 (en) 2013-04-03 2017-05-30 Butterfly Network, Inc. Portable electronic devices with integrated imaging capabilities
AU2014293274B2 (en) 2013-07-23 2018-11-01 Butterfly Network, Inc. Interconnectable ultrasound transducer probes and related methods and apparatus
CA2946120C (en) 2014-04-18 2022-10-25 Butterfly Network, Inc. Architecture of single substrate ultrasonic imaging devices, related apparatuses, and methods
EP3132281B1 (de) 2014-04-18 2019-10-30 Butterfly Network Inc. Ultraschallbildkompressionsverfahren und vorrichtung
EP3028772B1 (de) * 2014-12-02 2022-12-28 Samsung Medison Co., Ltd. Ultraschallsonde und verfahren zur herstellung davon
KR102373132B1 (ko) * 2014-12-26 2022-03-11 삼성메디슨 주식회사 초음파 프로브 장치 및 초음파 촬영 장치
JP5923205B1 (ja) * 2015-07-07 2016-05-24 日立アロカメディカル株式会社 超音波探触子
CN105097747B (zh) * 2015-09-01 2018-07-06 上海伊诺尔信息技术有限公司 智能卡芯片封装结构及封装方法
US11471911B2 (en) * 2016-05-16 2022-10-18 Baker Hughes, A Ge Company, Llc Phased array ultrasonic transducer and method of manufacture
JP6681784B2 (ja) * 2016-05-20 2020-04-15 新光電気工業株式会社 バッキング部材及びその製造方法と超音波探触子
KR102227329B1 (ko) * 2016-07-26 2021-03-12 지멘스 메디컬 솔루션즈 유에스에이, 인크. 초음파 트랜스듀서 및 그 제조 방법
JP6825290B2 (ja) * 2016-09-29 2021-02-03 Tdk株式会社 圧電素子
CN106558649B (zh) * 2016-11-08 2019-11-26 广东奥迪威传感科技股份有限公司 超声波传感器及其制造方法
US11498096B2 (en) * 2018-11-06 2022-11-15 Siemens Medical Solutions Usa, Inc. Chip-on-array with interposer for a multidimensional transducer array
US10499509B1 (en) * 2018-12-31 2019-12-03 General Electric Company Methods and systems for a flexible circuit
US11679975B2 (en) * 2019-07-24 2023-06-20 Vermon Sa Panel transducer scale package and method of manufacturing the same
CN111359861A (zh) * 2020-01-15 2020-07-03 中国科学院微电子研究所 一种超声换能器阵列
US11656355B2 (en) * 2020-07-15 2023-05-23 Siemens Medical Solutions Usa, Inc. Direct chip-on-array for a multidimensional transducer array

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JP2008509774A (ja) 2004-08-18 2008-04-03 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ２次元超音波トランスデューサアレイ
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Also Published As

Publication number Publication date
CN101517737A (zh) 2009-08-26
CN101517737B (zh) 2012-10-31
JP2010504639A (ja) 2010-02-12
JP5175853B2 (ja) 2013-04-03
EP2070114A1 (de) 2009-06-17
EP2070114B1 (de) 2010-01-06
WO2008038183A1 (en) 2008-04-03
US20100025785A1 (en) 2010-02-04
RU2449418C2 (ru) 2012-04-27
US8242665B2 (en) 2012-08-14
RU2009115685A (ru) 2010-11-10
TW200826209A (en) 2008-06-16
DE602007004242D1 (de) 2010-02-25

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Legal Events

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