ATE457121T1 - Elektronisches gerät mit einer äusseren oberfläche mit zwei funktionen - Google Patents
Elektronisches gerät mit einer äusseren oberfläche mit zwei funktionenInfo
- Publication number
- ATE457121T1 ATE457121T1 AT07735565T AT07735565T ATE457121T1 AT E457121 T1 ATE457121 T1 AT E457121T1 AT 07735565 T AT07735565 T AT 07735565T AT 07735565 T AT07735565 T AT 07735565T AT E457121 T1 ATE457121 T1 AT E457121T1
- Authority
- AT
- Austria
- Prior art keywords
- electronic device
- areas
- uneven
- external surface
- dual functions
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0209—Thermal insulation, e.g. for fire protection or for fire containment or for high temperature environments
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Telephone Set Structure (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
- Steering Controls (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/550,915 US20080149320A1 (en) | 2006-10-19 | 2006-10-19 | Electronic device with dual function outer surface |
| PCT/IB2007/051431 WO2008047254A2 (en) | 2006-10-19 | 2007-04-19 | Electronic device with dual function outer surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE457121T1 true ATE457121T1 (de) | 2010-02-15 |
Family
ID=39314422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07735565T ATE457121T1 (de) | 2006-10-19 | 2007-04-19 | Elektronisches gerät mit einer äusseren oberfläche mit zwei funktionen |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20080149320A1 (de) |
| EP (1) | EP2074874B1 (de) |
| JP (1) | JP2010507243A (de) |
| KR (1) | KR101323975B1 (de) |
| CN (1) | CN101563965A (de) |
| AT (1) | ATE457121T1 (de) |
| DE (1) | DE602007004679D1 (de) |
| WO (1) | WO2008047254A2 (de) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9165854B2 (en) * | 2012-04-12 | 2015-10-20 | Qualcomm Incorporated | Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation features |
| TWI472833B (zh) * | 2013-06-06 | 2015-02-11 | Innolux Corp | 顯示裝置 |
| TWI553258B (zh) * | 2013-07-15 | 2016-10-11 | 緯創資通股份有限公司 | 具有升降功能之腳墊機構及其電子裝置 |
| WO2016175779A1 (en) * | 2015-04-29 | 2016-11-03 | Hewlett-Packard Development Company, L.P. | Cover for devices |
| JP6495485B2 (ja) | 2016-02-05 | 2019-04-03 | クワントン オーピーピーオー モバイル テレコミュニケーションズ コーポレイション リミテッド | アダプター及び充電制御方法 |
| ES2829256T3 (es) * | 2016-02-05 | 2021-05-31 | Guangdong Oppo Mobile Telecommunications Corp Ltd | Método de carga y adaptador |
| KR102912292B1 (ko) | 2019-12-06 | 2026-01-13 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전자장치를 위한 2-상 침지 냉각 시스템의 열 관리를 위한 패턴화된 설계 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4182412A (en) * | 1978-01-09 | 1980-01-08 | Uop Inc. | Finned heat transfer tube with porous boiling surface and method for producing same |
| US4359086A (en) * | 1981-05-18 | 1982-11-16 | The Trane Company | Heat exchange surface with porous coating and subsurface cavities |
| US4819719A (en) * | 1987-01-20 | 1989-04-11 | Mcdonnell Douglas Corporation | Enhanced evaporator surface |
| US4838347A (en) * | 1987-07-02 | 1989-06-13 | American Telephone And Telegraph Company At&T Bell Laboratories | Thermal conductor assembly |
| US5263773A (en) * | 1991-11-14 | 1993-11-23 | White Consolidated Industries, Inc. | Cabinet structure and method of producing same |
| US5550326A (en) * | 1994-07-13 | 1996-08-27 | Parker-Hannifin Corporation | Heat dissipator for electronic components |
| JP3106120B2 (ja) * | 1997-05-16 | 2000-11-06 | 三菱電機株式会社 | 携帯型電子機器 |
| JPH11204949A (ja) * | 1998-01-13 | 1999-07-30 | Fujitsu Ltd | 電子機器筐体構造 |
| JP2000148306A (ja) * | 1998-11-06 | 2000-05-26 | Matsushita Electric Ind Co Ltd | 電子機器筐体構造 |
| TW553822B (en) * | 2000-11-22 | 2003-09-21 | Matsushita Electric Industrial Co Ltd | Magnesium alloy moldings and method for manufacturing thereof |
| US6519157B1 (en) * | 2001-10-23 | 2003-02-11 | Nlight Photonics Corporation | System and method for mounting a stack-up structure |
| TWI257543B (en) * | 2003-07-02 | 2006-07-01 | Delta Electronics Inc | Equalizing temperature device |
| PT2498572T (pt) * | 2004-02-05 | 2019-06-14 | Worldbest Corp | Aparelho radiador |
| JP2007042863A (ja) * | 2005-08-03 | 2007-02-15 | Matsushita Electric Ind Co Ltd | 電子機器 |
-
2006
- 2006-10-19 US US11/550,915 patent/US20080149320A1/en not_active Abandoned
-
2007
- 2007-04-19 DE DE602007004679T patent/DE602007004679D1/de active Active
- 2007-04-19 KR KR1020097010169A patent/KR101323975B1/ko not_active Expired - Fee Related
- 2007-04-19 EP EP07735565A patent/EP2074874B1/de not_active Ceased
- 2007-04-19 AT AT07735565T patent/ATE457121T1/de not_active IP Right Cessation
- 2007-04-19 JP JP2009532918A patent/JP2010507243A/ja active Pending
- 2007-04-19 CN CNA2007800474241A patent/CN101563965A/zh active Pending
- 2007-04-19 WO PCT/IB2007/051431 patent/WO2008047254A2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008047254A3 (en) | 2008-10-30 |
| DE602007004679D1 (de) | 2010-03-25 |
| JP2010507243A (ja) | 2010-03-04 |
| KR20090071647A (ko) | 2009-07-01 |
| KR101323975B1 (ko) | 2013-10-31 |
| US20080149320A1 (en) | 2008-06-26 |
| WO2008047254A2 (en) | 2008-04-24 |
| EP2074874A2 (de) | 2009-07-01 |
| EP2074874B1 (de) | 2010-02-03 |
| CN101563965A (zh) | 2009-10-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE457121T1 (de) | Elektronisches gerät mit einer äusseren oberfläche mit zwei funktionen | |
| EP2882267A3 (de) | Verdrahtungssubstrat, lichtemittierende Vorrichtung und Verfahren zur Herstellung eines Verdrahtungssubstrats | |
| WO2008078788A1 (ja) | 放熱基板およびこれを用いた電子装置 | |
| WO2011031417A3 (en) | Electronic device submounts with thermally conductive vias and light emitting devices including the same | |
| JP2013247369A5 (de) | ||
| MX2012011434A (es) | Disipadores de calor ligeros y lamparas de led que los emplean. | |
| DE502006008605D1 (de) | Bauteil mit filmkühlloch | |
| WO2011119007A3 (ko) | 방열 테이프 및 그 제조 방법 | |
| JP2012060132A5 (de) | ||
| RU2007128677A (ru) | Электромагнитный экран с большим поверхностным импедансом | |
| WO2011000360A3 (de) | Elektronische vorrichtung | |
| JP2017135368A5 (de) | ||
| TW200725870A (en) | Semiconductor device | |
| TW200701375A (en) | Metal-ceramic composite substrate and manufacturing method thereof | |
| WO2009014376A3 (en) | Light emitting device package and method of manufacturing the same | |
| TW200735425A (en) | Light-emitting diode package and manufacturing method thereof | |
| TW200608588A (en) | Structures and methods for heat dissipation of semiconductor integrated circuits | |
| ATE384413T1 (de) | Dünnschichtheizelement | |
| TW200618304A (en) | Thin film semiconductor device and method of manufacturing the same, electro-optical device, and electronic apparatus | |
| TWI402949B (de) | ||
| DE602005025573D1 (de) | Elektronisches Bauelement mit einer sauerstoff-undurchlässigen Aussenschicht | |
| TW200833212A (en) | Circuit structure and process thereof | |
| TW200717843A (en) | Light-emitting element with high-light-extracting-efficiency | |
| TW200943588A (en) | Optoelectronic component | |
| WO2005104231A3 (en) | Multi-substrate circuit assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |