ATE458275T1 - Dünnfilm-getter-schutz - Google Patents

Dünnfilm-getter-schutz

Info

Publication number
ATE458275T1
ATE458275T1 AT06726230T AT06726230T ATE458275T1 AT E458275 T1 ATE458275 T1 AT E458275T1 AT 06726230 T AT06726230 T AT 06726230T AT 06726230 T AT06726230 T AT 06726230T AT E458275 T1 ATE458275 T1 AT E458275T1
Authority
AT
Austria
Prior art keywords
thin film
reaction
film getter
protective material
protective
Prior art date
Application number
AT06726230T
Other languages
English (en)
Inventor
Jean-Charles Souriau
Elisabeth Delevoye
Francois Baleras
David Henry
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE458275T1 publication Critical patent/ATE458275T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/041—Mountings in enclosures or in a particular environment
    • G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/48—Fillings including materials for absorbing or reacting with moisture or other undesired substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Micromachines (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Gas Separation By Absorption (AREA)
  • Physical Vapour Deposition (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Materials For Medical Uses (AREA)
  • Electroluminescent Light Sources (AREA)
  • Magnetic Heads (AREA)
AT06726230T 2005-03-14 2006-03-10 Dünnfilm-getter-schutz ATE458275T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0550649A FR2883099B1 (fr) 2005-03-14 2005-03-14 Protection d'un getter en couche mince
PCT/FR2006/050206 WO2006097652A1 (fr) 2005-03-14 2006-03-10 Protection d'un getter en couche mince

Publications (1)

Publication Number Publication Date
ATE458275T1 true ATE458275T1 (de) 2010-03-15

Family

ID=34977062

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06726230T ATE458275T1 (de) 2005-03-14 2006-03-10 Dünnfilm-getter-schutz

Country Status (7)

Country Link
US (1) US8039285B2 (de)
EP (1) EP1859482B1 (de)
JP (1) JP4889722B2 (de)
AT (1) ATE458275T1 (de)
DE (1) DE602006012285D1 (de)
FR (1) FR2883099B1 (de)
WO (1) WO2006097652A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4844322B2 (ja) * 2006-09-26 2011-12-28 パナソニック電工株式会社 真空封止デバイスの製造方法
FR2950876B1 (fr) * 2009-10-07 2012-02-10 Commissariat Energie Atomique Procede de traitement d'un materiau getter et procede d'encapsulation d'un tel materiau getter
FR2952627A1 (fr) 2009-11-17 2011-05-20 Commissariat Energie Atomique Getter ayant deux temperatures d'activation et structure comportant ce getter
US8395229B2 (en) 2011-03-11 2013-03-12 Institut National D'optique MEMS-based getter microdevice
CA2822484C (en) * 2011-03-11 2015-07-21 Institut National D'optique Mems-based getter microdevice
DE102011056742B4 (de) * 2011-05-09 2019-07-18 Conti Temic Microelectronic Gmbh Steuergerät mit einer Getterschicht in einem Kraftfahrzeug
US9136794B2 (en) 2011-06-22 2015-09-15 Research Triangle Institute, International Bipolar microelectronic device
FR2976932A1 (fr) 2011-06-23 2012-12-28 Commissariat Energie Atomique Structure a materiau getter protege hermetiquement lors de sa realisation
FR2981198B1 (fr) 2011-10-11 2014-04-04 Commissariat Energie Atomique Structure d'encapsulation de dispositif electronique et procede de realisation d'une telle structure
FR2982073B1 (fr) 2011-10-28 2014-10-10 Commissariat Energie Atomique Structure d'encapsulation hermetique d'un dispositif et d'un composant electronique
DE102012209973B4 (de) * 2012-06-14 2024-03-07 Robert Bosch Gmbh Mikromechanische Vorrichtung und Verfahren zur Herstellung einer mikromechanischen Vorrichtung
US9463977B2 (en) * 2012-07-31 2016-10-11 Raytheon Company Sacrificial limiter filter
FR3008190B1 (fr) 2013-07-08 2015-08-07 Commissariat Energie Atomique Procede et dispositif de mesure d'un champ magnetique au moyen d'excitations synchronisees
NO2944700T3 (de) * 2013-07-11 2018-03-17
CN105157853A (zh) * 2015-08-17 2015-12-16 电子科技大学 一种非制冷红外焦平面阵列探测器及其制造方法
DE102015226772A1 (de) * 2015-12-29 2017-06-29 Robert Bosch Gmbh Gettervorrichtung für ein mikromechanisches Bauelement
EP3546748B1 (de) * 2016-11-28 2021-06-30 Inter-University Research Institute Corporation High Energy Accelerator Research Organization Mit nicht-verdampfendem getter beschichtete komponente, kammer , herstellungsverfahren, und herstellungsvorrichtung
US10526199B1 (en) * 2018-09-27 2020-01-07 Taiwan Semiconductor Manufacturing Co., Ltd. High efficiency getter design in vacuum MEMS device
FR3088319B1 (fr) * 2018-11-08 2020-10-30 Ulis Boitier hermetique comportant un getter, composant optoelectronique ou dispositif mems integrant un tel boitier hermetique et procede de fabrication associe
FR3103553B1 (fr) * 2019-11-27 2022-01-14 Commissariat Energie Atomique Procédé de fabrication d’un dispositif de détection comportant une etape de report et de collage direct d’une couche mince munie d’un matériau getter
CN113337800A (zh) * 2020-03-02 2021-09-03 杭州海康微影传感科技有限公司 薄膜吸气剂及其制备方法
CN115432661B (zh) * 2021-05-27 2025-11-25 苏州固锝电子股份有限公司 低应力mems封装结构及其封装方法
WO2025233814A1 (en) * 2024-05-07 2025-11-13 Nano-X Imaging Ltd System and method for increasing operational lifetime of a field emission vacuum tube
FI20245680A1 (en) * 2024-05-28 2025-11-29 Kyocera Tech Oy Activation of goats
CN121288767A (zh) * 2025-12-12 2026-01-09 中国科学院大连化学物理研究所 一种基于锆基合金的高强度复合多孔吸气剂及其制备方法与应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4426769A (en) * 1981-08-14 1984-01-24 Amp Incorporated Moisture getter for integrated circuit packages
JP2000243281A (ja) 1999-02-23 2000-09-08 Canon Inc 画像表示装置およびその製造方法
AU2002237682A1 (en) * 2000-11-27 2002-06-03 Microsensors Inc. Wafer eutectic bonding of mems gyros
US6923625B2 (en) * 2002-01-07 2005-08-02 Integrated Sensing Systems, Inc. Method of forming a reactive material and article formed thereby
US20040189195A1 (en) * 2003-03-24 2004-09-30 Osram Opto Semiconductors Gmbh Devices including, methods using, and compositions of reflowable getters

Also Published As

Publication number Publication date
WO2006097652A1 (fr) 2006-09-21
FR2883099A1 (fr) 2006-09-15
FR2883099B1 (fr) 2007-04-13
US8039285B2 (en) 2011-10-18
US20080213539A1 (en) 2008-09-04
EP1859482B1 (de) 2010-02-17
EP1859482A1 (de) 2007-11-28
JP4889722B2 (ja) 2012-03-07
JP2008532756A (ja) 2008-08-21
DE602006012285D1 (de) 2010-04-01

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Legal Events

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