ATE459100T1 - Keramische elektrostatische haltevorrichtung und deren verwendung - Google Patents

Keramische elektrostatische haltevorrichtung und deren verwendung

Info

Publication number
ATE459100T1
ATE459100T1 AT02741903T AT02741903T ATE459100T1 AT E459100 T1 ATE459100 T1 AT E459100T1 AT 02741903 T AT02741903 T AT 02741903T AT 02741903 T AT02741903 T AT 02741903T AT E459100 T1 ATE459100 T1 AT E459100T1
Authority
AT
Austria
Prior art keywords
electrode
esc
clamping
clamping electrode
chucking device
Prior art date
Application number
AT02741903T
Other languages
English (en)
Inventor
Shu Nakajima
Neil Benjamin
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE459100T1 publication Critical patent/ATE459100T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Jigs For Machine Tools (AREA)
  • Lock And Its Accessories (AREA)
AT02741903T 2001-06-28 2002-06-10 Keramische elektrostatische haltevorrichtung und deren verwendung ATE459100T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/892,634 US6483690B1 (en) 2001-06-28 2001-06-28 Ceramic electrostatic chuck assembly and method of making
PCT/US2002/018093 WO2003003449A2 (en) 2001-06-28 2002-06-10 Ceramic electrostatic chuck and method of fabricating same

Publications (1)

Publication Number Publication Date
ATE459100T1 true ATE459100T1 (de) 2010-03-15

Family

ID=25400273

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02741903T ATE459100T1 (de) 2001-06-28 2002-06-10 Keramische elektrostatische haltevorrichtung und deren verwendung

Country Status (11)

Country Link
US (1) US6483690B1 (de)
EP (1) EP1399964B1 (de)
JP (2) JP4349901B2 (de)
KR (2) KR20090075887A (de)
CN (1) CN1296983C (de)
AT (1) ATE459100T1 (de)
AU (1) AU2002314971A1 (de)
DE (1) DE60235466D1 (de)
IL (1) IL159528A0 (de)
TW (1) TW527264B (de)
WO (1) WO2003003449A2 (de)

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* Cited by examiner, † Cited by third party
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WO2003003449A3 (en) 2003-12-24
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WO2003003449A2 (en) 2003-01-09
TW527264B (en) 2003-04-11
JP2004531907A (ja) 2004-10-14
IL159528A0 (en) 2004-06-01
DE60235466D1 (de) 2010-04-08
KR100916953B1 (ko) 2009-09-14
EP1399964B1 (de) 2010-02-24
CN1529908A (zh) 2004-09-15
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US6483690B1 (en) 2002-11-19
EP1399964A2 (de) 2004-03-24

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