ATE460634T1 - Hochleitungseinsätze verwendende wärmeableitende komponente - Google Patents

Hochleitungseinsätze verwendende wärmeableitende komponente

Info

Publication number
ATE460634T1
ATE460634T1 AT02786813T AT02786813T ATE460634T1 AT E460634 T1 ATE460634 T1 AT E460634T1 AT 02786813 T AT02786813 T AT 02786813T AT 02786813 T AT02786813 T AT 02786813T AT E460634 T1 ATE460634 T1 AT E460634T1
Authority
AT
Austria
Prior art keywords
thermal conductivity
heat dissipation
thickness
insert
dissipation component
Prior art date
Application number
AT02786813T
Other languages
English (en)
Inventor
Daniel Krassowski
Gary G Chen
Original Assignee
Graftech Int Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Graftech Int Holdings Inc filed Critical Graftech Int Holdings Inc
Application granted granted Critical
Publication of ATE460634T1 publication Critical patent/ATE460634T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/905—Materials of manufacture

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Non-Disconnectible Joints And Screw-Threaded Joints (AREA)
AT02786813T 2001-12-13 2002-11-27 Hochleitungseinsätze verwendende wärmeableitende komponente ATE460634T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/015,459 US6758263B2 (en) 2001-12-13 2001-12-13 Heat dissipating component using high conducting inserts
PCT/US2002/038061 WO2003052340A1 (en) 2001-12-13 2002-11-27 Heat dissipating component using high conducting inserts

Publications (1)

Publication Number Publication Date
ATE460634T1 true ATE460634T1 (de) 2010-03-15

Family

ID=21771534

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02786813T ATE460634T1 (de) 2001-12-13 2002-11-27 Hochleitungseinsätze verwendende wärmeableitende komponente

Country Status (9)

Country Link
US (1) US6758263B2 (de)
EP (1) EP1454108B1 (de)
CN (1) CN100380087C (de)
AT (1) ATE460634T1 (de)
AU (1) AU2002351166A1 (de)
DE (1) DE60235647D1 (de)
DK (1) DK1454108T3 (de)
ES (1) ES2341643T3 (de)
WO (1) WO2003052340A1 (de)

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CN100380087C (zh) 2008-04-09
CN1620592A (zh) 2005-05-25
EP1454108A4 (de) 2006-04-19
US20030116312A1 (en) 2003-06-26
ES2341643T3 (es) 2010-06-24
DE60235647D1 (de) 2010-04-22
US6758263B2 (en) 2004-07-06
EP1454108A1 (de) 2004-09-08
WO2003052340A1 (en) 2003-06-26
EP1454108B1 (de) 2010-03-10
HK1078926A1 (zh) 2006-03-24
AU2002351166A1 (en) 2003-06-30
DK1454108T3 (da) 2010-06-14

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