ATE461910T1 - Vorrichtung und verfahren zur sicherung der dichtheit eines hohlraumes, in die eine durchführungsöffnung mündet - Google Patents

Vorrichtung und verfahren zur sicherung der dichtheit eines hohlraumes, in die eine durchführungsöffnung mündet

Info

Publication number
ATE461910T1
ATE461910T1 AT05100341T AT05100341T ATE461910T1 AT E461910 T1 ATE461910 T1 AT E461910T1 AT 05100341 T AT05100341 T AT 05100341T AT 05100341 T AT05100341 T AT 05100341T AT E461910 T1 ATE461910 T1 AT E461910T1
Authority
AT
Austria
Prior art keywords
cavity
substrate
holes
tightness
ensuring
Prior art date
Application number
AT05100341T
Other languages
English (en)
Inventor
Francois Baleras
Guy Parat
Alexandra Cobbe
Catherine Brunet-Manquat
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE461910T1 publication Critical patent/ATE461910T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/097—Interconnects arranged on the substrate or the lid, and covered by the package seal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Led Device Packages (AREA)
  • Measurement Of Radiation (AREA)
  • Casings For Electric Apparatus (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
AT05100341T 2004-01-22 2005-01-20 Vorrichtung und verfahren zur sicherung der dichtheit eines hohlraumes, in die eine durchführungsöffnung mündet ATE461910T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0450118A FR2865467B1 (fr) 2004-01-22 2004-01-22 Dispositif et procede pour assurer l'hermeticite d'une cavite en presence d'un via

Publications (1)

Publication Number Publication Date
ATE461910T1 true ATE461910T1 (de) 2010-04-15

Family

ID=34630693

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05100341T ATE461910T1 (de) 2004-01-22 2005-01-20 Vorrichtung und verfahren zur sicherung der dichtheit eines hohlraumes, in die eine durchführungsöffnung mündet

Country Status (4)

Country Link
EP (1) EP1557394B1 (de)
AT (1) ATE461910T1 (de)
DE (1) DE602005020078D1 (de)
FR (1) FR2865467B1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2890065B1 (fr) * 2005-08-30 2007-09-21 Commissariat Energie Atomique Procede d'encapsulation d'un composant, notamment electrique ou electronique au moyen d'un cordon de soudure ameliore
FR3042308B1 (fr) 2015-10-13 2018-02-16 Commissariat A L'energie Atomique Et Aux Energies Alternatives Boitier pour composants microelectroniques
FR3042642B1 (fr) 2015-10-15 2022-11-25 Commissariat Energie Atomique Procede de realisation d'un dispositif comprenant une micro-batterie
FR3065115B1 (fr) * 2017-04-10 2020-01-24 Ulis Boitier hermetique pour un detecteur de rayonnement infrarouge
IT201700103511A1 (it) 2017-09-15 2019-03-15 St Microelectronics Srl Dispositivo microelettronico dotato di connessioni protette e relativo processo di fabbricazione

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2705832B1 (fr) * 1993-05-28 1995-06-30 Commissariat Energie Atomique Procédé de réalisation d'un cordon d'étanchéité et de tenue mécanique entre un substrat et une puce hybridée par billes sur le substrat.
US6265246B1 (en) * 1999-07-23 2001-07-24 Agilent Technologies, Inc. Microcap wafer-level package

Also Published As

Publication number Publication date
EP1557394A1 (de) 2005-07-27
FR2865467A1 (fr) 2005-07-29
DE602005020078D1 (de) 2010-05-06
EP1557394B1 (de) 2010-03-24
FR2865467B1 (fr) 2007-01-05

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties