ATE463331T1 - Vorrichtung zum trennen einer gestapelten struktur und verwandtes verfahren - Google Patents

Vorrichtung zum trennen einer gestapelten struktur und verwandtes verfahren

Info

Publication number
ATE463331T1
ATE463331T1 AT07820925T AT07820925T ATE463331T1 AT E463331 T1 ATE463331 T1 AT E463331T1 AT 07820925 T AT07820925 T AT 07820925T AT 07820925 T AT07820925 T AT 07820925T AT E463331 T1 ATE463331 T1 AT E463331T1
Authority
AT
Austria
Prior art keywords
stack
periphery
separator
contact
contact point
Prior art date
Application number
AT07820925T
Other languages
English (en)
Inventor
Hubert Moriceau
Sylvie Sartori
Philippe Montmayeul
Christophe Morales
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE463331T1 publication Critical patent/ATE463331T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1961—Severing delaminating means [e.g., chisel, etc.]
    • Y10T156/1967—Cutting delaminating means
    • Y10T156/1972—Shearing delaminating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Centrifugal Separators (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Electron Tubes For Measurement (AREA)
  • Steering Control In Accordance With Driving Conditions (AREA)
  • Load-Engaging Elements For Cranes (AREA)
  • Supplying Of Containers To The Packaging Station (AREA)
AT07820925T 2006-10-06 2007-10-04 Vorrichtung zum trennen einer gestapelten struktur und verwandtes verfahren ATE463331T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0654138A FR2906933B1 (fr) 2006-10-06 2006-10-06 Dispositif de separation d'une structure empilee et procede associe
PCT/EP2007/060548 WO2008040782A1 (fr) 2006-10-06 2007-10-04 Dispositif de separation d'une structure empilee et procede associe.

Publications (1)

Publication Number Publication Date
ATE463331T1 true ATE463331T1 (de) 2010-04-15

Family

ID=37964753

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07820925T ATE463331T1 (de) 2006-10-06 2007-10-04 Vorrichtung zum trennen einer gestapelten struktur und verwandtes verfahren

Country Status (7)

Country Link
US (1) US20120261076A1 (de)
EP (1) EP2091708B1 (de)
JP (1) JP2010505651A (de)
AT (1) ATE463331T1 (de)
DE (1) DE602007005836D1 (de)
FR (1) FR2906933B1 (de)
WO (1) WO2008040782A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2925978B1 (fr) * 2007-12-28 2010-01-29 Commissariat Energie Atomique Procede et dispositif de separation d'une structure.
KR101570917B1 (ko) 2011-04-11 2015-11-20 에베 그룹 에. 탈너 게엠베하 가요성의 캐리어 마운트 및 캐리어 기판을 분리하기 위한 장치 및 방법
EP2795669B1 (de) * 2011-12-22 2020-06-17 EV Group E. Thallner GmbH Biegsame substrathalterung, vorrichtung und verfahren zum lösen eines ersten substrats
FR2995441B1 (fr) 2012-09-07 2015-11-06 Soitec Silicon On Insulator Dispositif de separation de deux substrats
FR3008190B1 (fr) 2013-07-08 2015-08-07 Commissariat Energie Atomique Procede et dispositif de mesure d'un champ magnetique au moyen d'excitations synchronisees
JP6469070B2 (ja) * 2016-12-21 2019-02-13 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 第１の基板を第２の基板から剥離する方法および可撓性の基板保持装置の使用
FR3093715B1 (fr) 2019-03-15 2021-03-05 Soitec Silicon On Insulator Dispositif de maintien pour un ensemble à fracturer
US20220234160A1 (en) * 2019-06-04 2022-07-28 Tokyo Electron Limited Substrate processing apparatus and substrate processing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274018A (ja) * 1998-10-09 1999-10-08 Canon Inc 複合部材の分離方法および半導体基体の作製方法
JP4311702B2 (ja) * 1999-12-08 2009-08-12 キヤノン株式会社 複合部材の分離方法及び薄膜の製造方法
JP2001177080A (ja) * 1999-12-15 2001-06-29 Canon Inc 複合部材の分離方法および貼り合わせ部材の製造方法
FR2823373B1 (fr) * 2001-04-10 2005-02-04 Soitec Silicon On Insulator Dispositif de coupe de couche d'un substrat, et procede associe
FR2834380B1 (fr) * 2002-01-03 2005-02-18 Soitec Silicon On Insulator Dispositif de coupe de couche d'un substrat, et procede associe

Also Published As

Publication number Publication date
EP2091708B1 (de) 2010-04-07
FR2906933A1 (fr) 2008-04-11
WO2008040782A1 (fr) 2008-04-10
FR2906933B1 (fr) 2009-02-13
US20120261076A1 (en) 2012-10-18
JP2010505651A (ja) 2010-02-25
EP2091708A1 (de) 2009-08-26
DE602007005836D1 (de) 2010-05-20

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