ATE463837T1 - Inline-heizelement zur verwendung bei der chemischen halbleiter-nassbearbeitung und herstellungsverfahren dafür - Google Patents

Inline-heizelement zur verwendung bei der chemischen halbleiter-nassbearbeitung und herstellungsverfahren dafür

Info

Publication number
ATE463837T1
ATE463837T1 AT05759168T AT05759168T ATE463837T1 AT E463837 T1 ATE463837 T1 AT E463837T1 AT 05759168 T AT05759168 T AT 05759168T AT 05759168 T AT05759168 T AT 05759168T AT E463837 T1 ATE463837 T1 AT E463837T1
Authority
AT
Austria
Prior art keywords
heating element
protective layer
single crystal
resistive heating
alumina substrate
Prior art date
Application number
AT05759168T
Other languages
English (en)
Inventor
Hongy Lin
Original Assignee
Watlow Electric Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Watlow Electric Mfg filed Critical Watlow Electric Mfg
Application granted granted Critical
Publication of ATE463837T1 publication Critical patent/ATE463837T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
  • Weting (AREA)
AT05759168T 2004-06-14 2005-06-10 Inline-heizelement zur verwendung bei der chemischen halbleiter-nassbearbeitung und herstellungsverfahren dafür ATE463837T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/867,108 US7164104B2 (en) 2004-06-14 2004-06-14 In-line heater for use in semiconductor wet chemical processing and method of manufacturing the same
PCT/US2005/020761 WO2005124829A2 (en) 2004-06-14 2005-06-10 In-line heater for use in semiconductor wet chemical processing and method of manufacturing the same

Publications (1)

Publication Number Publication Date
ATE463837T1 true ATE463837T1 (de) 2010-04-15

Family

ID=34972370

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05759168T ATE463837T1 (de) 2004-06-14 2005-06-10 Inline-heizelement zur verwendung bei der chemischen halbleiter-nassbearbeitung und herstellungsverfahren dafür

Country Status (6)

Country Link
US (1) US7164104B2 (de)
EP (1) EP1774571B1 (de)
JP (1) JP2008504675A (de)
AT (1) ATE463837T1 (de)
DE (1) DE602005020453D1 (de)
WO (1) WO2005124829A2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
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US9835355B2 (en) * 2007-11-01 2017-12-05 Infinity Fluids Corp. Inter-axial inline fluid heater
US20100077602A1 (en) * 2008-09-27 2010-04-01 Wolfgang Kollenberg Method of making an electrical heater
JP5415797B2 (ja) * 2009-03-24 2014-02-12 株式会社Ｋｅｌｋ 流体加熱装置
WO2011005684A1 (en) * 2009-07-08 2011-01-13 American Hometec Non-metal electric heating system and method, and tankless water heater using the same
DE102009034307A1 (de) * 2009-07-21 2011-01-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Hochtemperaturheizung sowie Verfahren zu dessen Herstellung
CN103453272B (zh) * 2013-09-12 2015-07-15 扬中市金元化工电力设备厂 一种管道用加热装置
US20210231345A1 (en) * 2020-01-27 2021-07-29 Lexmark International, Inc. Thin-walled tube heater for fluid
WO2022031791A1 (en) * 2020-08-04 2022-02-10 Micropen Technologies Corporation Fluid conduit assemblies and fluid transport systems
US20250039994A1 (en) 2023-07-27 2025-01-30 Heraeus Precious Metals North America Conshohocken Llc Aluminum based resistive heater
CN120111728B (zh) * 2025-05-09 2025-07-04 宁波市扬天磁能科技有限公司 一种绝电瞬热多层复合厚膜发热体

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US3304459A (en) * 1964-05-21 1967-02-14 Raytheon Co Heater for an indirectly heated cathode
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US3515850A (en) * 1967-10-02 1970-06-02 Ncr Co Thermal printing head with diffused printing elements
FR2142272A5 (de) 1971-06-18 1973-01-26 Cibie Projecteurs
US3875413A (en) * 1973-10-09 1975-04-01 Hewlett Packard Co Infrared radiation source
US3852563A (en) * 1974-02-01 1974-12-03 Hewlett Packard Co Thermal printing head
US4213030A (en) * 1977-07-21 1980-07-15 Kyoto Ceramic Kabushiki Kaisha Silicon-semiconductor-type thermal head
JPS6055549B2 (ja) * 1977-09-08 1985-12-05 関西ペイント株式会社 被膜形成用組成物
US4378489A (en) * 1981-05-18 1983-03-29 Honeywell Inc. Miniature thin film infrared calibration source
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JPH02148675A (ja) * 1988-11-30 1990-06-07 Mitsubishi Electric Corp 小型発熱体
US5155340A (en) * 1989-07-12 1992-10-13 Mitsubishi Denki Kabushiki Kaisha Thin high temperature heater
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Also Published As

Publication number Publication date
US20050274714A1 (en) 2005-12-15
EP1774571A2 (de) 2007-04-18
WO2005124829A3 (en) 2006-05-18
DE602005020453D1 (de) 2010-05-20
US7164104B2 (en) 2007-01-16
WO2005124829A2 (en) 2005-12-29
JP2008504675A (ja) 2008-02-14
EP1774571B1 (de) 2010-04-07

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