ATE464978T1 - Verfahren zur reinigung von ätzkammern mit schleif-suspension - Google Patents

Verfahren zur reinigung von ätzkammern mit schleif-suspension

Info

Publication number
ATE464978T1
ATE464978T1 AT06255599T AT06255599T ATE464978T1 AT E464978 T1 ATE464978 T1 AT E464978T1 AT 06255599 T AT06255599 T AT 06255599T AT 06255599 T AT06255599 T AT 06255599T AT E464978 T1 ATE464978 T1 AT E464978T1
Authority
AT
Austria
Prior art keywords
etching chambers
grinding suspension
cleaning etching
methods
cleaning
Prior art date
Application number
AT06255599T
Other languages
English (en)
Inventor
Ian Martin Davis
David Paul Laube
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of ATE464978T1 publication Critical patent/ATE464978T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C5/00—Devices or accessories for generating abrasive blasts
    • B24C5/02—Blast guns, e.g. for generating high velocity abrasive fluid jets for cutting materials
    • B24C5/04—Nozzles therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C11/00—Selection of abrasive materials or additives for abrasive blasts
    • B24C11/005—Selection of abrasive materials or additives for abrasive blasts of additives, e.g. anti-corrosive or disinfecting agents in solid, liquid or gaseous form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00—Abrasive blasting machines or devices; Plants
    • B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
    • B24C3/325—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for internal surfaces, e.g. of tubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C7/00—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
    • B24C7/0007—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a liquid carrier
    • B24C7/0038—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a liquid carrier the blasting medium being a gaseous stream
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Nozzles (AREA)
  • Coating By Spraying Or Casting (AREA)
AT06255599T 2005-11-14 2006-10-31 Verfahren zur reinigung von ätzkammern mit schleif-suspension ATE464978T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/272,844 US20070111642A1 (en) 2005-11-14 2005-11-14 Apparatus and methods for slurry cleaning of etch chambers

Publications (1)

Publication Number Publication Date
ATE464978T1 true ATE464978T1 (de) 2010-05-15

Family

ID=37758692

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06255599T ATE464978T1 (de) 2005-11-14 2006-10-31 Verfahren zur reinigung von ätzkammern mit schleif-suspension

Country Status (10)

Country Link
US (1) US20070111642A1 (de)
EP (1) EP1785230B1 (de)
JP (1) JP5031329B2 (de)
KR (1) KR101301097B1 (de)
CN (1) CN1970230A (de)
AT (1) ATE464978T1 (de)
DE (1) DE602006013768D1 (de)
IL (1) IL178946A (de)
SG (1) SG132602A1 (de)
TW (1) TWI421935B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101091132B1 (ko) 2010-09-27 2011-12-09 (주)제이솔루션 질소가스 이젝터장치
US9446500B2 (en) * 2012-09-25 2016-09-20 G.D.O. Inc. Underwater abrasive entrainment waterjet cutting method
US9744645B2 (en) * 2012-09-25 2017-08-29 G.D.O. Inc. Abrasive entrainment waterjet cutting
US9815175B2 (en) * 2012-09-25 2017-11-14 G.D.O. Inc Abrasive entrainment waterjet cutting
US9687953B2 (en) * 2014-06-27 2017-06-27 Applied Materials, Inc. Chamber components with polished internal apertures
US10010106B2 (en) * 2015-04-30 2018-07-03 Frito-Lay North America, Inc. Method and apparatus for removing a portion of a food product with an abrasive stream
CN105904330A (zh) * 2016-06-08 2016-08-31 重庆巨源不锈钢制品有限公司 自动抛光装置及其自动抛光方法
US10077966B2 (en) * 2016-08-15 2018-09-18 G.D.O. Inc. Abrasive entrainment waterjet cutting
US10076821B2 (en) * 2016-08-15 2018-09-18 G.D.O. Inc Abrasive entrainment waterjet cutting
CN109210374B (zh) * 2017-06-30 2021-06-08 北京北方华创微电子装备有限公司 进气管路及半导体加工设备
KR102577058B1 (ko) * 2021-04-30 2023-09-11 남근식 표면연마용 워터젯 가공장치

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2200587A (en) * 1937-02-25 1940-05-14 Hydroblast Corp Method and apparatus for sand blasting
US2369576A (en) * 1943-12-20 1945-02-13 Pangborn Corp Blast gun
US2372957A (en) * 1943-12-23 1945-04-03 Pangborn Corp Hydraulic sand feeder
GB1105984A (en) * 1966-02-24 1968-03-13 Abrasive Dev Improvements in and relating to abrasive guns
US4330968A (en) * 1980-05-02 1982-05-25 Fuji Seiki Machine Works, Ltd. Two-tank high water pressure wet blasting machine with separate supply reservoir for abrasive particles
US4776794A (en) * 1986-06-03 1988-10-11 Moshe Meller Cleaning instrument using premixed abrasive liquid
EP0332328B1 (de) * 1988-03-03 1992-09-16 Yoshino Seiki Inc. Kühlmittelsprühsystem für Bohrvorrichtungen
US5575705A (en) * 1993-08-12 1996-11-19 Church & Dwight Co., Inc. Slurry blasting process
US5384990A (en) * 1993-08-12 1995-01-31 Church & Dwight Co., Inc. Water blasting process
WO1997034737A1 (fr) * 1996-03-18 1997-09-25 Honda Giken Kogyo Kabushiki Kaisha Procede et appareil assurant un important renforcement d'un element metallique
US6010546A (en) * 1997-07-24 2000-01-04 Asahi Glass Company, Ltd. Blasting medium and blasting method employing such medium
US5827114A (en) * 1996-09-25 1998-10-27 Church & Dwight Co., Inc. Slurry blasting process
DE69936329T2 (de) * 1998-04-24 2007-10-04 Matsushita Electric Industrial Co., Ltd., Kadoma Verfahren zur herstellung eines keramischen mehrschichtigen substrats
US6224463B1 (en) * 1998-11-02 2001-05-01 J.C.J. Metal Processing, Incorporated Workpiece finishing system and method of operating same
JP2000343435A (ja) * 1999-03-29 2000-12-12 Asahi Glass Co Ltd ブラストメディア及びブラスト方法
FR2801689B1 (fr) * 1999-11-29 2001-12-28 Air Liquide Robinet detendeur avec dispositif de reglage de la basse pression et comportant un systeme d'arret d'urgence
JP2002319556A (ja) * 2001-04-19 2002-10-31 Hitachi Ltd 半導体集積回路装置の製造方法
US6554909B1 (en) * 2001-11-08 2003-04-29 Saint-Gobain Ceramics & Plastics, Inc. Process for cleaning components using cleaning media
US20040202980A1 (en) * 2003-04-14 2004-10-14 Policicchio Piero A. Dental prophylaxis and air appliance
JP2005108889A (ja) * 2003-09-26 2005-04-21 Kyocera Corp 半導体基板の製造方法

Also Published As

Publication number Publication date
SG132602A1 (en) 2007-06-28
EP1785230A2 (de) 2007-05-16
KR20070051707A (ko) 2007-05-18
EP1785230A3 (de) 2007-07-18
US20070111642A1 (en) 2007-05-17
TW200725733A (en) 2007-07-01
IL178946A (en) 2012-10-31
EP1785230B1 (de) 2010-04-21
KR101301097B1 (ko) 2013-08-27
DE602006013768D1 (de) 2010-06-02
CN1970230A (zh) 2007-05-30
IL178946A0 (en) 2007-03-08
JP5031329B2 (ja) 2012-09-19
JP2007173785A (ja) 2007-07-05
TWI421935B (zh) 2014-01-01

Similar Documents

Publication Publication Date Title
DE502004011649D1 (de) Verfahren zur behandlung von substratoberflächen
DE50100177D1 (de) Verfahren zur Oberflächenpolitur von Siliciumscheiben
ATE464978T1 (de) Verfahren zur reinigung von ätzkammern mit schleif-suspension
DE60331042D1 (de) Verfahren zur Bearbeitung von einem Nitrid-Halbleiterwafer
WO2004108617A3 (en) Methods of finishing quartz glass surfaces and components made by the methods
WO2004071975A3 (en) Methods of making glass- ceramic particles
DE502005008355D1 (de) Fräsmaschine sowie Verfahren zum Bearbeiten von Bodenoberflächen
ATE539156T1 (de) Vektoren zur gerichteten klonierung
SE0402456L (sv) Porösa slipartiklar med agglomererat slipmedel och metod för framställning av de agglomererade slipmedlen
TW200511422A (en) Treatment or processing of substrate surfaces
FI20041029L (fi) Menetelmä hartsisidostteisten hiomatyökalujen valmistamiseksi
DE60213710D1 (de) Vorrichtung zur Planarisierung von Wafern
DE10394095D2 (de) Vorrichtung zur Reinigung von Wafern nach dem CMP-Prozeß
SG110190A1 (en) Method for improving the critical dimension uniformity of patterned features on wafers
WO2006009604A3 (en) Vehicular cleaning concentrate
DE60218705D1 (de) Zusammensetzung enthaltend ein gleitmitteladditiv zum schneiden oder schleifen und entsprechendes verfahren
WO2005068386A3 (en) Aqueous composition of an oligomeric fluorosilane and use thereof for surface treatment of optical elements
DE602006009593D1 (de) Verfahren zum Polieren von Halbleiterscheiben
DK1809440T3 (da) Ældningsapparat til at ælde en kunststen
DE10328845B4 (de) Verfahren zur Oberflächenbehandlung einer Halbleiterscheibe
WO2005024100A3 (en) Fibrillar apparatus and methods for making it
WO2005001923A3 (de) Lösung und verfahren zur behandlung eines substrates und ein halbleiterbauelement
ATE419559T1 (de) Verfahren zur reinigung der oberfläche einer photomaske
DE602006007908D1 (de) Vorrichtung und Verfahren zum polieren von Halbleiterscheiben
TW200629404A (en) Manufacturing method of semiconductor device

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties