ATE465497T1 - Spannungsarmer leitfaehiger klebstoff - Google Patents

Spannungsarmer leitfaehiger klebstoff

Info

Publication number
ATE465497T1
ATE465497T1 AT06004488T AT06004488T ATE465497T1 AT E465497 T1 ATE465497 T1 AT E465497T1 AT 06004488 T AT06004488 T AT 06004488T AT 06004488 T AT06004488 T AT 06004488T AT E465497 T1 ATE465497 T1 AT E465497T1
Authority
AT
Austria
Prior art keywords
conductive film
low stress
conductive adhesive
adhesion strength
paste adhesive
Prior art date
Application number
AT06004488T
Other languages
English (en)
Inventor
Chih-Min Cheng
Andrew Collins
Original Assignee
Henkel Ag & Co Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co Kgaa filed Critical Henkel Ag & Co Kgaa
Application granted granted Critical
Publication of ATE465497T1 publication Critical patent/ATE465497T1/de

Links

Classifications

    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01C—PLANTING; SOWING; FERTILISING
    • A01C1/00—Apparatus, or methods of use thereof, for testing or treating seed, roots, or the like, prior to sowing or planting
    • A01C1/02—Germinating apparatus; Determining germination capacity of seeds or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
    • A01G31/00—Soilless cultivation, e.g. hydroponics
    • A01G31/02—Special apparatus therefor
    • A01G31/06—Hydroponic culture on racks or in stacked containers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Environmental Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Physiology (AREA)
  • Soil Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
AT06004488T 2005-03-07 2006-03-06 Spannungsarmer leitfaehiger klebstoff ATE465497T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/073,778 US7326369B2 (en) 2005-03-07 2005-03-07 Low stress conductive adhesive

Publications (1)

Publication Number Publication Date
ATE465497T1 true ATE465497T1 (de) 2010-05-15

Family

ID=36088538

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06004488T ATE465497T1 (de) 2005-03-07 2006-03-06 Spannungsarmer leitfaehiger klebstoff

Country Status (8)

Country Link
US (1) US7326369B2 (de)
EP (1) EP1701361B1 (de)
JP (1) JP4875386B2 (de)
KR (1) KR101325083B1 (de)
CN (1) CN1831073B (de)
AT (1) ATE465497T1 (de)
DE (1) DE602006013734D1 (de)
TW (1) TWI382076B (de)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100044088A1 (en) * 2006-07-05 2010-02-25 Ablestik (Japan) Co. Ltd. Conductive adhesive
CN101275060B (zh) * 2007-03-30 2012-06-20 清华大学 导电胶带及其制造方法
CN101323759B (zh) * 2007-06-15 2014-10-08 清华大学 导电胶带及其制造方法
US8609471B2 (en) * 2008-02-29 2013-12-17 Freescale Semiconductor, Inc. Packaging an integrated circuit die using compression molding
JP5339284B2 (ja) 2008-03-04 2013-11-13 リンテック株式会社 粘着剤組成物及び粘着シート
JP5390881B2 (ja) * 2008-03-04 2014-01-15 リンテック株式会社 粘着剤組成物及び粘着シート
KR101410447B1 (ko) * 2008-03-06 2014-06-20 김종현 전도성이 우수한 전자부품 실장용 전도성 페이스트 및 그제조방법
DE102008014690A1 (de) * 2008-03-18 2009-09-24 Conti Temic Microelectronic Gmbh Verfahren zur Herstellung von Schaltungsträgern
KR100974092B1 (ko) * 2008-05-30 2010-08-04 삼성전기주식회사 탄소나노튜브를 포함하는 도전성 페이스트 및 이를 이용한인쇄회로기판
JPWO2010131655A1 (ja) * 2009-05-13 2012-11-01 日立化成工業株式会社 接着シート
KR101157515B1 (ko) * 2009-06-19 2012-06-20 중앙대학교 산학협력단 도전성 접착제 및 이를 이용한 단자간 접속방법
KR101138799B1 (ko) * 2009-08-20 2012-04-24 제일모직주식회사 이방 도전성 필름용 조성물
KR101225497B1 (ko) * 2009-11-05 2013-01-23 (주)덕산테코피아 도전성 접착제와 그 제조 방법 및 이를 포함하는 전자 장치
KR101260708B1 (ko) 2010-02-01 2013-05-10 이스켐주식회사 무용제형 전도성 도료수지
CN101831264B (zh) * 2010-04-26 2013-02-13 常州合润新材料科技有限公司 一种填充碳纳米管各向同性高性能导热胶粘剂
EP2566908B1 (de) 2010-05-05 2017-12-06 Tyco Electronics Services GmbH Vergiessen für elektronische komponenten
EP2576717B1 (de) * 2010-05-26 2019-02-06 MEGTEC TurboSonic Inc. Leitfähiges haftmittel
US20110315916A1 (en) 2010-06-29 2011-12-29 Dow Global Technologies Inc. Curable composition
JP4832615B1 (ja) * 2010-11-01 2011-12-07 Ｄｏｗａエレクトロニクス株式会社 低温焼結性導電性ペーストおよびそれを用いた導電膜と導電膜の形成方法
CN102153976B (zh) * 2011-03-01 2013-05-08 华南理工大学 一种石墨烯/纳米银环氧导电胶的制备方法
JP5686436B2 (ja) * 2011-03-31 2015-03-18 リンテック株式会社 粘着剤組成物及び粘着シート
GB201116240D0 (en) * 2011-09-20 2011-11-02 Henkel Ag & Co Kgaa Electrically conductive adhesives comprising silver-coated particles
CN102504741A (zh) * 2011-10-26 2012-06-20 中国电器科学研究院有限公司 一种碳纳米管填充型大功率led用高导热导电固晶胶粘剂
US9200184B2 (en) * 2012-05-17 2015-12-01 Henkel IP & Holding GmbH Chain extended epoxy to improve adhesion of conductive die attach film
US8895865B2 (en) 2012-09-07 2014-11-25 Conor P. Lenahan Conductive connections allowing XYZ translation
CN104282356A (zh) * 2013-07-03 2015-01-14 肖淑勇 一种低银含量复合导电银浆及其制备方法
WO2015019667A1 (ja) * 2013-08-06 2015-02-12 千住金属工業株式会社 導電性接合剤およびはんだ継手
TWI651387B (zh) 2013-09-30 2019-02-21 漢高智慧財產控股公司 用於大型晶粒半導體封裝之導電黏晶薄膜及供其製備之組合物
CN103805118B (zh) * 2014-02-21 2015-01-07 厦门大学 一种电子封装用复合导电胶及其制备方法
CN105400460B (zh) * 2014-08-25 2019-04-19 3M中国有限公司 导电胶组合物和胶带及其在太阳能电池组件中的应用
WO2016052664A1 (ja) 2014-10-01 2016-04-07 ナミックス株式会社 樹脂組成物
JP6396189B2 (ja) * 2014-11-27 2018-09-26 日東電工株式会社 導電性フィルム状接着剤、フィルム状接着剤付きダイシングテープ及び半導体装置の製造方法
CN104804687B (zh) * 2015-04-13 2017-03-15 深圳广恒威科技有限公司 导电固晶粘结胶液、导电固晶粘接胶膜、制备方法及应用
EP3294799B1 (de) * 2015-05-08 2024-09-04 Henkel AG & Co. KGaA Sinterbare folien und pasten und verfahren zur verwendung davon
CN104893601B (zh) * 2015-05-19 2017-05-17 中国航空工业集团公司北京航空材料研究院 一种具有两种导电结构的导电胶膜及其制备方法
CN105504678A (zh) * 2015-10-25 2016-04-20 国网山东省电力公司临沂供电公司 一种耐腐蚀的导电材料及其应用
CN105419673A (zh) * 2015-12-29 2016-03-23 舜坦（上海）新材料有限公司 导电地板胶
CN105419674B (zh) * 2016-01-18 2017-12-05 杨宜丰 一种漂浮式全方位导电胶膜
CN105567112B (zh) * 2016-01-18 2018-06-19 杨宜丰 一种各向异性导电胶及其制备方法
CN105810108A (zh) * 2016-04-08 2016-07-27 太仓凯丰电子科技有限公司 Led电容式触摸学习调光屏
WO2018084518A1 (ko) * 2016-11-02 2018-05-11 (주)바이오니아 코어-쉘 구조의 은 코팅된 구리 나노와이어를 포함하는 에폭시 페이스트 조성물 및 이를 포함하는 도전성 필름
TWI720290B (zh) * 2017-05-19 2021-03-01 日商拓自達電線股份有限公司 導電性接著劑
CN107393626A (zh) * 2017-06-27 2017-11-24 西安工程大学 一种热法粉状电子浆料及其制备方法
CN108441151B (zh) * 2018-03-19 2021-04-27 Tcl华星光电技术有限公司 一种碳纳米管导电球、碳纳米管导电胶及液晶显示器
CN108707447A (zh) * 2018-06-13 2018-10-26 昆山建皇光电科技有限公司 强粘结高导电焊接胶
EP4004116A4 (de) 2019-07-31 2023-04-26 Henkel AG & Co. KGaA Elektrisch leitfähige silikonzusammensetzung mit hoher haftfestigkeit
TWI900620B (zh) 2020-08-27 2025-10-11 德商漢高股份有限及兩合公司 導電性單組分型(1k)環氧樹脂調配物
CN119307200B (zh) * 2024-10-18 2025-12-26 深圳市蓝特电路板有限公司 一种导电胶、及其制备方法和应用

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US499136A (en) 1893-06-06 miller
US4695508A (en) 1985-09-06 1987-09-22 The Yokohama Rubber Co., Ltd. Adhesive composition
JP2877309B2 (ja) 1988-01-06 1999-03-31 株式会社東芝 ゴム変性フェノール樹脂の製造方法
US4999136A (en) 1988-08-23 1991-03-12 Westinghouse Electric Corp. Ultraviolet curable conductive resin
US5043102A (en) * 1989-11-29 1991-08-27 Advanced Products, Inc. Conductive adhesive useful for bonding a semiconductor die to a conductive support base
JPH03277650A (ja) * 1990-03-28 1991-12-09 Nissan Motor Co Ltd 接着性にすぐれた導電性樹脂組成物
JPH04332404A (ja) 1991-05-07 1992-11-19 Nec Corp 異方性導電材料及びこれを用いた集積回路素子の接続方法
US5250228A (en) 1991-11-06 1993-10-05 Raychem Corporation Conductive polymer composition
US5620795A (en) * 1993-11-10 1997-04-15 Minnesota Mining And Manufacturing Company Adhesives containing electrically conductive agents
US5645764A (en) * 1995-01-19 1997-07-08 International Business Machines Corporation Electrically conductive pressure sensitive adhesives
US5863988A (en) 1995-12-25 1999-01-26 Tomoegawa Paper Co., Ltd. Liquid adhesive for electronic parts and adhesive tape
DE69710089T2 (de) * 1996-08-16 2002-08-22 Hugh P. Craig Druckfähige zusammensetzungen und deren auftragung auf dielektrische oberflächen für die herstellung von gedruckten leiterplatten
EP0892027B1 (de) 1997-07-17 2003-05-21 Raytheon Company Leitfähiger Epoxidharzklebstoff mit verbessertem Fallwiderstand
US6246123B1 (en) 1998-05-04 2001-06-12 Motorola, Inc. Transparent compound and applications for its use
AU4688699A (en) 1998-06-22 2000-01-10 Loctite Corporation Thermosetting resin compositions useful as underfill sealants
JP2003055583A (ja) * 1998-12-08 2003-02-26 Taiyo Ink Mfg Ltd 光硬化型異方性導電組成物及びそれを用いて形成した異方性導電パターン
US6344155B1 (en) 1999-04-06 2002-02-05 Tomoegawa Paper Co., Ltd. Electrically conductive adhesive composition, electrically conductive adhesive sheet and use thereof
JP4172257B2 (ja) * 2002-11-21 2008-10-29 日立化成工業株式会社 樹脂ペースト組成物及びこれを用いた半導体装置。
CN100343297C (zh) 2003-03-10 2007-10-17 大日本油墨化学工业株式会社 导电性树脂组合物、其制造方法及燃料电池用隔膜
WO2005056675A1 (en) 2003-11-21 2005-06-23 Lord Corporation Dual-stage wafer applied underfills

Also Published As

Publication number Publication date
TW200704743A (en) 2007-02-01
JP4875386B2 (ja) 2012-02-15
KR101325083B1 (ko) 2013-11-06
EP1701361A1 (de) 2006-09-13
US7326369B2 (en) 2008-02-05
TWI382076B (zh) 2013-01-11
DE602006013734D1 (de) 2010-06-02
KR20060097610A (ko) 2006-09-14
EP1701361B1 (de) 2010-04-21
US20060197066A1 (en) 2006-09-07
CN1831073B (zh) 2012-01-18
JP2006249426A (ja) 2006-09-21
CN1831073A (zh) 2006-09-13

Similar Documents

Publication Publication Date Title
ATE465497T1 (de) Spannungsarmer leitfaehiger klebstoff
TW200608066A (en) Laminated optical article
WO2009148722A3 (en) Adhesive encapsulating composition and electronic devices made therewith
WO2009044732A1 (ja) 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
WO2009148716A3 (en) Adhesive encapsulating composition and electronic devices made therewith
AU2003296145A1 (en) Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body
MY151958A (en) Resin composition and semiconductor device produced by using the same.
TW201129670A (en) Adhesive sheet and electronic part
NO20075184L (no) Fluoralkylsilylert MQ harpiks og losningsmiddelfast trykksensitive klebemiddelsammensetning derav
TW200628309A (en) Antistatic adhesion type optical film and image display
WO2009001492A1 (ja) 接着フィルムおよびこれを用いた半導体装置
MY150573A (en) Adhesive composition and adhesion method
DE60217702D1 (de) Behälter mit wiederverschliessbarer, durch einen klebstoff am behälter geklebter abdeckung
ATE510895T1 (de) Hitze-aktiviert verklebbares flächenelement
WO2009038960A3 (en) Flexible epoxy-based compositions
WO2008143253A1 (ja) 接着剤組成物及びこれを用いた接着フィルム
SG148928A1 (en) Integrated circuit package in package system with adhesiveless package attach
MY145363A (en) Adhesive film and method for manufacturing semiconductor device using same
WO2005067607A3 (en) Radiation curable laminating adhesives based on cycloaliphatic carboxylic acid functional monomers
PL401407A1 (pl) Wodna kompozycja klejowa do laczenia elastomerów
SG126882A1 (en) Die attach adhesives with improved stress performance
TW200700524A (en) Adhesive composition for flexible printed wiring board and adhesive film for flexible printed wiring board using it
TWI366592B (en) Epoxy resin adhesion composition and adhesive for optical semiconductor
TW200612534A (en) Bonding structure of device packaging
PL1721056T3 (pl) Konstrukcja klejona

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties