ATE467337T1 - Baugruppe mit einer auf einem tragvorrichtung montierten integrierten schaltung und einer stromversorgungseinrichtung - Google Patents

Baugruppe mit einer auf einem tragvorrichtung montierten integrierten schaltung und einer stromversorgungseinrichtung

Info

Publication number
ATE467337T1
ATE467337T1 AT02710265T AT02710265T ATE467337T1 AT E467337 T1 ATE467337 T1 AT E467337T1 AT 02710265 T AT02710265 T AT 02710265T AT 02710265 T AT02710265 T AT 02710265T AT E467337 T1 ATE467337 T1 AT E467337T1
Authority
AT
Austria
Prior art keywords
power supply
integrated circuit
circuit mounted
supply module
module arrangement
Prior art date
Application number
AT02710265T
Other languages
English (en)
Inventor
Thomas Duerbaum
Reinhold Elferich
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE467337T1 publication Critical patent/ATE467337T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/045—Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dc-Dc Converters (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Direct Current Feeding And Distribution (AREA)
AT02710265T 2001-02-16 2002-02-13 Baugruppe mit einer auf einem tragvorrichtung montierten integrierten schaltung und einer stromversorgungseinrichtung ATE467337T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10107839A DE10107839A1 (de) 2001-02-16 2001-02-16 Anordnung mit einem auf einem Träger montierten integrierten Schaltkreis und einer Stromversorgungsbaugruppenanordnung
PCT/IB2002/000434 WO2002067646A1 (en) 2001-02-16 2002-02-13 Arrangement with an integrated circuit mounted on a bearing means and a power supply module arrangement

Publications (1)

Publication Number Publication Date
ATE467337T1 true ATE467337T1 (de) 2010-05-15

Family

ID=7674655

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02710265T ATE467337T1 (de) 2001-02-16 2002-02-13 Baugruppe mit einer auf einem tragvorrichtung montierten integrierten schaltung und einer stromversorgungseinrichtung

Country Status (8)

Country Link
US (1) US7719850B2 (de)
EP (1) EP1362502B1 (de)
JP (1) JP2004519849A (de)
KR (1) KR20020093915A (de)
CN (1) CN1230056C (de)
AT (1) ATE467337T1 (de)
DE (2) DE10107839A1 (de)
WO (1) WO2002067646A1 (de)

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US7235880B2 (en) * 2004-09-01 2007-06-26 Intel Corporation IC package with power and signal lines on opposing sides
US7149086B2 (en) * 2004-12-10 2006-12-12 Intel Corporation Systems to cool multiple electrical components
TWI339737B (en) * 2005-04-27 2011-04-01 Aehr Test Systems Contactor assembly, cartridge, and apparatus and method for testing integrated circuit of device
JP2007116013A (ja) * 2005-10-24 2007-05-10 Renesas Technology Corp 半導体装置及びそれを用いた電源装置
US8498117B2 (en) * 2006-11-16 2013-07-30 Advanced Micro Devices, Inc. Variable mount voltage regulator
US7989942B2 (en) * 2009-01-20 2011-08-02 Altera Corporation IC package with capacitors disposed on an interposal layer
JP5014470B2 (ja) * 2010-06-28 2012-08-29 三菱電機株式会社 樹脂封止形電子制御装置、及びその製造方法
US9204548B2 (en) * 2012-03-14 2015-12-01 Cisco Technology, Inc Electronic devices mounted on multiple substrates
US9084364B2 (en) * 2012-06-20 2015-07-14 Canon Kabushiki Kaisha Printed circuit board and printed wiring board
EP2736312B1 (de) * 2012-11-27 2017-08-16 Siemens Aktiengesellschaft Automatisierungsgerät mit Kühlkörper
CN104980003B (zh) * 2014-04-01 2017-10-10 台达电子企业管理（上海）有限公司 电源模块及pol电源模块
US10331161B2 (en) * 2014-12-24 2019-06-25 Fujitsu Limited Power supply board
US10440811B2 (en) * 2016-06-30 2019-10-08 Ciena Corporation Active heatsink lid
CN111064344B (zh) * 2018-10-17 2021-07-06 台达电子工业股份有限公司 具有底部金属散热基板的功率模块
US11596052B2 (en) * 2020-06-08 2023-02-28 Intel Corporation Integrated voltage regulator for high performance devices
US11844199B2 (en) * 2022-01-26 2023-12-12 Advanced Semiconductor Engineering, Inc. Electronic device
US12213247B2 (en) 2022-07-14 2025-01-28 Advanced Semiconductor Engineering, Inc. Electronic device
US12381150B2 (en) * 2022-07-21 2025-08-05 Advanced Semiconductor Engineering, Inc. Electronic device
CN116471807A (zh) * 2022-08-01 2023-07-21 成都芯源系统有限公司 一种具有夹层结构的电源模块

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US4551746A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
US5012386A (en) * 1989-10-27 1991-04-30 Motorola, Inc. High performance overmolded electronic package
JPH04351469A (ja) 1991-05-28 1992-12-07 Hitachi Ltd 電子装置の給電構造および電子装置
JP2976605B2 (ja) 1991-08-26 1999-11-10 ソニー株式会社 メモリモジュール
JP3157362B2 (ja) * 1993-09-03 2001-04-16 株式会社東芝 半導体装置
US5734555A (en) * 1994-03-30 1998-03-31 Intel Corporation Shared socket multi-chip module and/or piggyback pin grid array package
EP0717443B1 (de) * 1994-07-04 1999-03-03 Matsushita Electric Industrial Co., Ltd. Integrierte halbleiteranordnung
US5892275A (en) * 1995-08-29 1999-04-06 Intel Corporation High performance power and ground edge connect IC package
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US5811880A (en) * 1996-03-28 1998-09-22 Intel Corporation Design for mounting discrete components inside an integrated circuit package for frequency governing of microprocessors
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Also Published As

Publication number Publication date
WO2002067646A1 (en) 2002-08-29
CN1230056C (zh) 2005-11-30
DE60236253D1 (de) 2010-06-17
DE10107839A1 (de) 2002-09-05
JP2004519849A (ja) 2004-07-02
US20040027802A1 (en) 2004-02-12
CN1457629A (zh) 2003-11-19
EP1362502A1 (de) 2003-11-19
US7719850B2 (en) 2010-05-18
KR20020093915A (ko) 2002-12-16
EP1362502B1 (de) 2010-05-05

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