ATE467895T1 - Leitfähige tinte - Google Patents

Leitfähige tinte

Info

Publication number
ATE467895T1
ATE467895T1 AT05790645T AT05790645T ATE467895T1 AT E467895 T1 ATE467895 T1 AT E467895T1 AT 05790645 T AT05790645 T AT 05790645T AT 05790645 T AT05790645 T AT 05790645T AT E467895 T1 ATE467895 T1 AT E467895T1
Authority
AT
Austria
Prior art keywords
coupling agent
ink
conductive ink
conductive
solvent
Prior art date
Application number
AT05790645T
Other languages
English (en)
Inventor
Yoichi Kamikoriyama
Sumikazu Ogata
Kei Anai
Hiroki Sawamoto
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of ATE467895T1 publication Critical patent/ATE467895T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT05790645T 2004-10-08 2005-10-07 Leitfähige tinte ATE467895T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004296987 2004-10-08
JP2004303863 2004-10-19
PCT/JP2005/018631 WO2006041030A1 (ja) 2004-10-08 2005-10-07 導電性インク

Publications (1)

Publication Number Publication Date
ATE467895T1 true ATE467895T1 (de) 2010-05-15

Family

ID=36148324

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05790645T ATE467895T1 (de) 2004-10-08 2005-10-07 Leitfähige tinte

Country Status (8)

Country Link
US (1) US20090293766A1 (de)
EP (1) EP1835512B1 (de)
JP (1) JPWO2006041030A1 (de)
KR (1) KR20070065379A (de)
AT (1) ATE467895T1 (de)
DE (1) DE602005021251D1 (de)
TW (2) TW200621914A (de)
WO (1) WO2006041030A1 (de)

Families Citing this family (40)

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Publication number Priority date Publication date Assignee Title
JP2007257869A (ja) * 2006-03-20 2007-10-04 Mitsui Mining & Smelting Co Ltd 導電性インキ
JP5065613B2 (ja) * 2006-04-10 2012-11-07 三井金属鉱業株式会社 ニッケルインク
KR100768706B1 (ko) * 2006-06-08 2007-10-19 삼성전기주식회사 잉크젯용 금속 잉크 조성물
KR100777662B1 (ko) * 2006-06-14 2007-11-29 삼성전기주식회사 잉크젯용 전도성 잉크 조성물
EP2032291A2 (de) * 2006-06-19 2009-03-11 Cabot Corporation Metallhaltige nanopartikel, ihre synthese und verwendung
JP2010525504A (ja) * 2007-04-03 2010-07-22 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 光出力装置
WO2009051200A1 (ja) * 2007-10-19 2009-04-23 Jsr Corporation インクジェット印刷用インクおよび電極の製造方法
JP2009096962A (ja) * 2007-10-19 2009-05-07 Jsr Corp インクジェット印刷用インクおよび電極の製造方法
JP2009227825A (ja) * 2008-03-24 2009-10-08 Jsr Corp インクジェット印刷用インク、およびこれを用いたフラットパネルディスプレイ用電極の製造方法
JP5024014B2 (ja) * 2007-12-10 2012-09-12 セイコーエプソン株式会社 導体パターン形成用インク、導体パターンおよび配線基板
EP2315813A4 (de) * 2008-07-25 2012-11-28 Methode Electronics Inc Metallnanopartikel-tintenzusammensetzungen
TW201114876A (en) * 2009-10-29 2011-05-01 Giga Solar Materials Corp Conductive paste with surfactants
CN101818008B (zh) * 2010-03-19 2012-05-23 西安理工大学 一种用于刮开式票据的银浆油墨及其制备方法
KR101803956B1 (ko) * 2010-05-06 2017-12-01 주식회사 동진쎄미켐 대기압에서 소성 가능한 구리 나노입자의 제조방법
CN101935480A (zh) * 2010-09-29 2011-01-05 彩虹集团公司 一种导电油墨及其制备方法
JP5576843B2 (ja) * 2010-12-15 2014-08-20 日本特殊陶業株式会社 導体パターン印刷用インク
JP5304812B2 (ja) * 2011-02-16 2013-10-02 信越化学工業株式会社 導電性パターン形成用組成物及び導電性パターンの形成方法
JP5624915B2 (ja) * 2011-03-03 2014-11-12 株式会社アルバック 金属ナノ粒子分散液
JP5857766B2 (ja) 2012-02-01 2016-02-10 セイコーエプソン株式会社 紫外線硬化型インクジェット用組成物および記録物
JP2015110683A (ja) * 2012-03-22 2015-06-18 旭硝子株式会社 導電インク、導体付き基材及び導体付き基材の製造方法
KR101765706B1 (ko) 2012-05-18 2017-08-07 가부시키가이샤 무라타 세이사쿠쇼 잉크젯용 잉크, 인쇄방법 및 세라믹 전자부품
US9305854B2 (en) 2012-08-21 2016-04-05 Stats Chippac, Ltd. Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package
US9331007B2 (en) 2012-10-16 2016-05-03 Stats Chippac, Ltd. Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages
WO2014106088A1 (en) 2012-12-28 2014-07-03 Nthdegree Technologies Worldwide Inc. Nickel inks and oxidation resistant and conductive coatings
US9799421B2 (en) 2013-06-07 2017-10-24 Heraeus Precious Metals North America Conshohocken Llc Thick print copper pastes for aluminum nitride substrates
EP2822000B1 (de) * 2013-07-03 2020-10-21 Heraeus Precious Metals North America Conshohocken LLC Dicke Kupferdruckpasten für Aluminiumnitridsubstrate
KR101716549B1 (ko) * 2014-11-19 2017-03-15 삼성에스디아이 주식회사 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극
US10636540B2 (en) 2015-03-27 2020-04-28 Heraeus Deutschland GmbH & Co. KG Electro-conductive pastes comprising an oxide additive
US10056508B2 (en) 2015-03-27 2018-08-21 Heraeus Deutschland GmbH & Co. KG Electro-conductive pastes comprising a metal compound
EP3374194B1 (de) * 2015-11-13 2019-08-14 Exatec, LLC. Verfahren zum drucken mit leitfähiger paste
JPWO2017094166A1 (ja) * 2015-12-03 2018-09-20 ハリマ化成株式会社 導電性ペーストの製造方法
US11081253B2 (en) * 2016-11-08 2021-08-03 Dowa Electronics Materials Co., Ltd. Silver particle dispersing solution, method for producing same, and method for producing conductive film using silver particle dispersing solution
JP6972148B2 (ja) 2017-03-01 2021-11-24 ヴァイアヴィ・ソリューションズ・インコーポレイテッドViavi Solutions Inc. ラメラ粒子および製造方法
CN107148154A (zh) * 2017-07-12 2017-09-08 江南大学 一种基于喷墨打印的导电线路印刷工艺
US10843262B2 (en) * 2018-08-02 2020-11-24 Xerox Corporation Compositions comprising eutectic metal alloy nanoparticles
JP7655311B2 (ja) * 2020-04-13 2025-04-02 昭栄化学工業株式会社 Ｎｉペーストおよび積層セラミックコンデンサ
JP7834502B2 (ja) * 2022-02-22 2026-03-24 ノリタケ株式会社 導電性インクジェットインク
KR102781368B1 (ko) * 2022-12-06 2025-03-17 주식회사 티엘비 인쇄회로기판의 제조방법
KR102781365B1 (ko) * 2022-12-06 2025-03-17 주식회사 티엘비 인쇄회로기판의 제조방법
WO2025154696A1 (ja) * 2024-01-18 2025-07-24 富士フイルム株式会社 積層体、積層体の製造方法

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JP3911928B2 (ja) * 1999-10-19 2007-05-09 コニカミノルタホールディングス株式会社 インクジェット記録ヘッド用保存液
JP2002356602A (ja) * 2000-07-28 2002-12-13 Sekisui Chem Co Ltd 着色樹脂エマルジョン、インクジェット印刷用インク、電着液及びカラーフィルター
JP2002109957A (ja) * 2000-09-29 2002-04-12 Jsr Corp 導電性ペースト組成物
TW522062B (en) * 2001-02-15 2003-03-01 Mitsui Mining & Smelting Co Aqueous nickel slurry, method for preparing the same and conductive paste
US7566360B2 (en) * 2002-06-13 2009-07-28 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
CN1671805B (zh) * 2002-07-03 2010-05-26 耐诺泡德斯工业有限公司 烧结温度低的导电纳米油墨及其制备方法
JP4334204B2 (ja) * 2002-11-21 2009-09-30 メルク株式会社 高輝度高彩度虹彩顔料およびその製造方法
JP2004256757A (ja) * 2003-02-27 2004-09-16 Asahi Glass Co Ltd インクジェットプリンタ用の導電性インクおよび製造方法
JP2004277507A (ja) * 2003-03-13 2004-10-07 Jsr Corp 顔料内包ポリマー粒子の水系分散体とその製造方法および水系インク

Also Published As

Publication number Publication date
EP1835512B1 (de) 2010-05-12
WO2006041030A1 (ja) 2006-04-20
EP1835512A1 (de) 2007-09-19
TW200902647A (en) 2009-01-16
TW200621914A (en) 2006-07-01
KR20070065379A (ko) 2007-06-22
US20090293766A1 (en) 2009-12-03
JPWO2006041030A1 (ja) 2008-05-15
TWI308172B (de) 2009-04-01
EP1835512A4 (de) 2008-02-20
TWI308347B (de) 2009-04-01
DE602005021251D1 (de) 2010-06-24

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties