ATE468608T1 - Verpackung von integrierten schaltungen - Google Patents

Verpackung von integrierten schaltungen

Info

Publication number
ATE468608T1
ATE468608T1 AT06787376T AT06787376T ATE468608T1 AT E468608 T1 ATE468608 T1 AT E468608T1 AT 06787376 T AT06787376 T AT 06787376T AT 06787376 T AT06787376 T AT 06787376T AT E468608 T1 ATE468608 T1 AT E468608T1
Authority
AT
Austria
Prior art keywords
pads
circuit
die
integrated circuit
ground
Prior art date
Application number
AT06787376T
Other languages
English (en)
Inventor
Laxminarayan Sharma
Mario Francisco Velez
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Application granted granted Critical
Publication of ATE468608T1 publication Critical patent/ATE468608T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/468—Circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Time-Division Multiplex Systems (AREA)
AT06787376T 2005-07-18 2006-07-14 Verpackung von integrierten schaltungen ATE468608T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US70014305P 2005-07-18 2005-07-18
US11/399,017 US7602050B2 (en) 2005-07-18 2006-04-05 Integrated circuit packaging
PCT/US2006/027462 WO2007011767A1 (en) 2005-07-18 2006-07-14 Integrated circuit packaging

Publications (1)

Publication Number Publication Date
ATE468608T1 true ATE468608T1 (de) 2010-06-15

Family

ID=37459525

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06787376T ATE468608T1 (de) 2005-07-18 2006-07-14 Verpackung von integrierten schaltungen

Country Status (9)

Country Link
US (1) US7602050B2 (de)
EP (1) EP1911092B1 (de)
JP (1) JP4847525B2 (de)
KR (1) KR100943604B1 (de)
CN (1) CN101263598B (de)
AT (1) ATE468608T1 (de)
DE (1) DE602006014412D1 (de)
TW (1) TWI315571B (de)
WO (1) WO2007011767A1 (de)

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SG149725A1 (en) * 2007-07-24 2009-02-27 Micron Technology Inc Thin semiconductor die packages and associated systems and methods
SG149724A1 (en) 2007-07-24 2009-02-27 Micron Technology Inc Semicoductor dies with recesses, associated leadframes, and associated systems and methods
US7825527B2 (en) * 2008-06-13 2010-11-02 Altera Corporation Return loss techniques in wirebond packages for high-speed data communications
JP2010010634A (ja) * 2008-06-30 2010-01-14 Shinko Electric Ind Co Ltd リードフレーム及び半導体装置の製造方法
US8106502B2 (en) * 2008-11-17 2012-01-31 Stats Chippac Ltd. Integrated circuit packaging system with plated pad and method of manufacture thereof
US20100126764A1 (en) * 2008-11-24 2010-05-27 Seagate Technology, Llc die ground lead
KR101113518B1 (ko) * 2009-11-18 2012-02-29 삼성전기주식회사 리드 프레임
US20110115063A1 (en) * 2009-11-18 2011-05-19 Entropic Communications, Inc. Integrated Circuit Packaging with Split Paddle
TWI401776B (zh) * 2009-12-31 2013-07-11 南茂科技股份有限公司 四邊扁平無接腳封裝（ｑｆｎ）結構
CN102201384A (zh) * 2010-03-22 2011-09-28 无锡华润安盛科技有限公司 一种led驱动电路的小外形封装引线框
CN101814480B (zh) * 2010-04-16 2011-08-31 杭州矽力杰半导体技术有限公司 一种芯片封装结构及其封装方法
TWI419290B (zh) * 2010-10-29 2013-12-11 日月光半導體製造股份有限公司 四方扁平無引腳封裝及其製作方法
US9635794B2 (en) 2012-02-20 2017-04-25 Trw Automotive U.S. Llc Method and apparatus for attachment of integrated circuits
JP5894209B2 (ja) * 2014-04-03 2016-03-23 ルネサスエレクトロニクス株式会社 半導体装置
US10128170B2 (en) * 2017-01-09 2018-11-13 Silanna Asia Pte Ltd Conductive clip connection arrangements for semiconductor packages
US11264309B2 (en) * 2019-06-24 2022-03-01 Mediatek Inc. Multi-row QFN semiconductor package
US11515240B2 (en) * 2019-08-01 2022-11-29 Stmicroelectronics S.R.L. Lead frame for a package for a semiconductor device, semiconductor device and process for manufacturing a semiconductor device
CN111900144B (zh) * 2020-08-12 2021-11-12 深圳安捷丽新技术有限公司 高速互连的接地参考形状
JP7097933B2 (ja) * 2020-10-08 2022-07-08 三菱電機株式会社 半導体装置の製造方法

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KR900008995B1 (ko) 1986-12-19 1990-12-17 페어차일드 세미콘덕터 코포레이션 고주파 반도체 소자용 세라믹 패키지
JPH03132063A (ja) * 1989-10-18 1991-06-05 Dainippon Printing Co Ltd リードフレーム
GB2292930B (en) * 1992-06-30 1996-10-02 Caterpillar Inc Material handling machine
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JP3947292B2 (ja) * 1998-02-10 2007-07-18 大日本印刷株式会社 樹脂封止型半導体装置の製造方法
US6025640A (en) * 1997-07-16 2000-02-15 Dai Nippon Insatsu Kabushiki Kaisha Resin-sealed semiconductor device, circuit member for use therein and method of manufacturing resin-sealed semiconductor device
EP0895287A3 (de) * 1997-07-31 2006-04-05 Matsushita Electric Industrial Co., Ltd. Halbleitervorrichtung und Leiterrahmen für dieselbe
JP3031323B2 (ja) * 1997-12-26 2000-04-10 日本電気株式会社 半導体装置とその製造方法
JP3062691B1 (ja) * 1999-02-26 2000-07-12 株式会社三井ハイテック 半導体装置
TW426926B (en) 1999-10-05 2001-03-21 Vanguard Int Semiconduct Corp Integrated circuit package
EP1126522A1 (de) 2000-02-18 2001-08-22 Alcatel Verpackte Halbleiterschaltung mit Radiofrequenz-Antenne
JP3955712B2 (ja) * 2000-03-03 2007-08-08 株式会社ルネサステクノロジ 半導体装置
KR100359304B1 (ko) * 2000-08-25 2002-10-31 삼성전자 주식회사 주변 링 패드를 갖는 리드 프레임 및 이를 포함하는반도체 칩 패키지
JP2002076228A (ja) * 2000-09-04 2002-03-15 Dainippon Printing Co Ltd 樹脂封止型半導体装置
US6433424B1 (en) * 2000-12-14 2002-08-13 International Rectifier Corporation Semiconductor device package and lead frame with die overhanging lead frame pad
DE10247075A1 (de) * 2002-10-09 2004-04-22 Micronas Gmbh Trägereinrichtung für monolithisch integrierte Schaltungen

Also Published As

Publication number Publication date
DE602006014412D1 (de) 2010-07-01
JP2009502045A (ja) 2009-01-22
US20070096268A1 (en) 2007-05-03
TW200746377A (en) 2007-12-16
CN101263598A (zh) 2008-09-10
US7602050B2 (en) 2009-10-13
KR20080026216A (ko) 2008-03-24
KR100943604B1 (ko) 2010-02-24
WO2007011767A1 (en) 2007-01-25
EP1911092A1 (de) 2008-04-16
TWI315571B (en) 2009-10-01
EP1911092B1 (de) 2010-05-19
JP4847525B2 (ja) 2011-12-28
CN101263598B (zh) 2010-09-22

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