ATE469403T1 - Identifizierungsdokument mit kontaktlosem rfid- chip - Google Patents
Identifizierungsdokument mit kontaktlosem rfid- chipInfo
- Publication number
- ATE469403T1 ATE469403T1 AT05781726T AT05781726T ATE469403T1 AT E469403 T1 ATE469403 T1 AT E469403T1 AT 05781726 T AT05781726 T AT 05781726T AT 05781726 T AT05781726 T AT 05781726T AT E469403 T1 ATE469403 T1 AT E469403T1
- Authority
- AT
- Austria
- Prior art keywords
- rfid chip
- identification document
- contactless rfid
- contactless
- page
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
- G06K19/025—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Radar Systems Or Details Thereof (AREA)
- Adornments (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04104216 | 2004-09-02 | ||
| PCT/IB2005/052830 WO2006025017A1 (en) | 2004-09-02 | 2005-08-30 | Identification document with a contactless rfid chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE469403T1 true ATE469403T1 (de) | 2010-06-15 |
Family
ID=35457523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05781726T ATE469403T1 (de) | 2004-09-02 | 2005-08-30 | Identifizierungsdokument mit kontaktlosem rfid- chip |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9152902B2 (de) |
| EP (1) | EP1789915B8 (de) |
| JP (1) | JP2008511893A (de) |
| CN (1) | CN101052978A (de) |
| AT (1) | ATE469403T1 (de) |
| DE (1) | DE602005021515D1 (de) |
| WO (1) | WO2006025017A1 (de) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE602005021515D1 (de) * | 2004-09-02 | 2010-07-08 | Nxp Bv | Identifizierungsdokument mit kontaktlosem rfid-chip |
| JP4382783B2 (ja) | 2006-08-09 | 2009-12-16 | 富士通株式会社 | Rfidタグ |
| JP5006916B2 (ja) * | 2009-08-26 | 2012-08-22 | 富士通株式会社 | Rfidタグ |
| JP5556550B2 (ja) * | 2010-09-30 | 2014-07-23 | 凸版印刷株式会社 | 高強度icカード |
| JP6011124B2 (ja) * | 2012-08-02 | 2016-10-19 | 大日本印刷株式会社 | 非接触及び接触共用icカード、非接触及び接触共用icカードの製造方法 |
| US20140138443A1 (en) * | 2012-11-21 | 2014-05-22 | Black Card Llc | Transaction card |
| US9368371B2 (en) | 2014-04-22 | 2016-06-14 | Applied Materials, Inc. | Retaining ring having inner surfaces with facets |
| US10500695B2 (en) | 2015-05-29 | 2019-12-10 | Applied Materials, Inc. | Retaining ring having inner surfaces with features |
| DE102017115744A1 (de) * | 2017-07-13 | 2019-01-17 | Conductix-Wampfler Gmbh | Vorrichtung und Verfahren zur Erkennung des Verschleißes eines Schleifkontaktes und Schleifleitungssystem |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4578279A (en) * | 1981-05-26 | 1986-03-25 | International Business Machines Corporation | Inspection of multilayer ceramic circuit modules by electrical inspection of unfired green sheets |
| JPS60208289A (ja) * | 1984-03-31 | 1985-10-19 | Dainippon Printing Co Ltd | 光記録材料 |
| US4671255A (en) * | 1985-10-16 | 1987-06-09 | Mcghan Medical Corporation | Tissue expander with self-contained injection reservoir and reinforcing insert |
| GB9011457D0 (en) * | 1990-05-22 | 1990-07-11 | Amblehurst Ltd | Tamper indicating security tape |
| JP3169965B2 (ja) | 1992-08-12 | 2001-05-28 | 沖電気工業株式会社 | Icカード |
| US5528222A (en) * | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
| DE4443980C2 (de) * | 1994-12-11 | 1997-07-17 | Angewandte Digital Elektronik | Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren |
| US6268237B1 (en) * | 1995-04-03 | 2001-07-31 | Aptek Industries, Inc. | Stress-free silicon wafer and a die or chip made therefrom and method |
| US5898370A (en) * | 1997-12-16 | 1999-04-27 | At&T Corp | Security monitoring system and method |
| US6114962A (en) * | 1998-10-15 | 2000-09-05 | Intermec Ip Corp. | RF tag having strain relieved stiff substrate and hydrostatic protection for a chip mounted thereto |
| US7306158B2 (en) * | 2001-07-10 | 2007-12-11 | American Express Travel Related Services Company, Inc. | Clear contactless card |
| DE60127662T2 (de) * | 2000-04-07 | 2007-12-27 | The Chief Controller, Research And Development, Defence Research And Development Organisation Of Ministry Of Defence | Sende-/empfängermodul für aktivphasenarrayantenne |
| JP4575559B2 (ja) | 2000-07-13 | 2010-11-04 | エフアイエス株式会社 | ケトン感応素子 |
| DE10054873C2 (de) | 2000-11-06 | 2002-10-17 | Mada Marx Datentechnik Gmbh | Kontaktlose Chipkarte und Verfahren zur Herstellung einer solchen Chipkarte |
| US6923378B2 (en) * | 2000-12-22 | 2005-08-02 | Digimarc Id Systems | Identification card |
| JP4736191B2 (ja) * | 2001-01-22 | 2011-07-27 | 大日本印刷株式会社 | Icカードとその製造方法 |
| DE10109327A1 (de) * | 2001-02-27 | 2002-09-12 | Infineon Technologies Ag | Halbleiterchip und Herstellungsverfahren für ein Gehäuse |
| US20030211246A1 (en) * | 2001-05-11 | 2003-11-13 | Kydd Paul H. | Additive electronic circuits on thermally unstable substrates |
| FR2826154B1 (fr) * | 2001-06-14 | 2004-07-23 | A S K | Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux |
| JP2003108958A (ja) * | 2001-09-28 | 2003-04-11 | Konica Corp | Icカード及びicカードの製造方法 |
| EP1485867A4 (de) | 2001-12-24 | 2012-02-22 | L 1 Secure Credentialing Inc | Kontakt-chipkarten mit einem dokumentkern, kontaktlose chipkarten mit identifikationsdokument mehrschichtiger struktur auf pet-basis und verfahren zu ihrer herstellung |
| DE10200382B4 (de) | 2002-01-08 | 2006-05-04 | Infineon Technologies Ag | Chipmodul für Chipkarten |
| US20050072849A1 (en) * | 2003-09-03 | 2005-04-07 | Jones Robert L. | Identification document with optical memory and related method of manufacture |
| DE602005021515D1 (de) * | 2004-09-02 | 2010-07-08 | Nxp Bv | Identifizierungsdokument mit kontaktlosem rfid-chip |
| FR2916558B1 (fr) * | 2007-05-21 | 2010-03-12 | Fasver | Vignette adhesive souple de securite dotee d'au moins un microcircuit sans contact pour document officiel |
-
2005
- 2005-08-30 DE DE200560021515 patent/DE602005021515D1/de not_active Expired - Lifetime
- 2005-08-30 US US11/574,325 patent/US9152902B2/en active Active
- 2005-08-30 WO PCT/IB2005/052830 patent/WO2006025017A1/en not_active Ceased
- 2005-08-30 CN CNA200580037871XA patent/CN101052978A/zh active Pending
- 2005-08-30 AT AT05781726T patent/ATE469403T1/de not_active IP Right Cessation
- 2005-08-30 JP JP2007529116A patent/JP2008511893A/ja not_active Withdrawn
- 2005-08-30 EP EP20050781726 patent/EP1789915B8/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US9152902B2 (en) | 2015-10-06 |
| EP1789915A1 (de) | 2007-05-30 |
| WO2006025017A1 (en) | 2006-03-09 |
| JP2008511893A (ja) | 2008-04-17 |
| EP1789915B8 (de) | 2010-07-14 |
| CN101052978A (zh) | 2007-10-10 |
| EP1789915B1 (de) | 2010-05-26 |
| DE602005021515D1 (de) | 2010-07-08 |
| US20080218308A1 (en) | 2008-09-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |