ATE470886T1 - Damaszen-fotomaske für die extrem-ultraviolett- lithographie (euvl) und herstellungsverfahren - Google Patents
Damaszen-fotomaske für die extrem-ultraviolett- lithographie (euvl) und herstellungsverfahrenInfo
- Publication number
- ATE470886T1 ATE470886T1 AT02742415T AT02742415T ATE470886T1 AT E470886 T1 ATE470886 T1 AT E470886T1 AT 02742415 T AT02742415 T AT 02742415T AT 02742415 T AT02742415 T AT 02742415T AT E470886 T1 ATE470886 T1 AT E470886T1
- Authority
- AT
- Austria
- Prior art keywords
- euvl
- extreme ultraviolet
- damascen
- ultraviolet lithography
- production process
- Prior art date
Links
- 238000001900 extreme ultraviolet lithography Methods 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000006096 absorbing agent Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 230000000153 supplemental effect Effects 0.000 abstract 2
- 238000000206 photolithography Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
Landscapes
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/919,680 US6593041B2 (en) | 2001-07-31 | 2001-07-31 | Damascene extreme ultraviolet lithography (EUVL) photomask and method of making |
| PCT/US2002/022104 WO2003012546A2 (en) | 2001-07-31 | 2002-07-11 | Damascene extreme ultraviolet lithography (euvl) photomask and method of making |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE470886T1 true ATE470886T1 (de) | 2010-06-15 |
Family
ID=25442465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02742415T ATE470886T1 (de) | 2001-07-31 | 2002-07-11 | Damaszen-fotomaske für die extrem-ultraviolett- lithographie (euvl) und herstellungsverfahren |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6593041B2 (de) |
| EP (1) | EP1412817B1 (de) |
| CN (1) | CN1695093A (de) |
| AT (1) | ATE470886T1 (de) |
| AU (1) | AU2002315549A1 (de) |
| DE (1) | DE60236663D1 (de) |
| TW (1) | TWI289725B (de) |
| WO (1) | WO2003012546A2 (de) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6577442B2 (en) * | 2001-09-27 | 2003-06-10 | Intel Corporation | Reflective spectral filtering of high power extreme ultra-violet radiation |
| US20040131947A1 (en) * | 2003-01-07 | 2004-07-08 | International Business Machines Corporation | Reflective mask structure and method of formation |
| US7420653B2 (en) * | 2003-10-02 | 2008-09-02 | Asml Netherlands B.V. | Lithographic projection apparatus, mirror, method of supplying a protective cap layer, device manufacturing method and device manufactured accordingly |
| FR2863772B1 (fr) * | 2003-12-16 | 2006-05-26 | Commissariat Energie Atomique | Procede de reparation d'erreurs de motifs realises dans des couches minces |
| US7169514B2 (en) * | 2003-12-31 | 2007-01-30 | Intel Corporation | Extreme ultraviolet mask with molybdenum phase shifter |
| KR100604938B1 (ko) * | 2005-05-27 | 2006-07-28 | 삼성전자주식회사 | 극자외선 노광용 반사마스크 및 그 제조방법 |
| FR2894346B1 (fr) * | 2005-12-02 | 2012-03-30 | Commissariat Energie Atomique | Masque de photolithographie en extreme ultra-violet, a cavites absorbantes |
| US7402469B1 (en) * | 2007-01-12 | 2008-07-22 | Applied Micro Circuits Corporation | System and method for selectivity etching an integrated circuit |
| US8361689B2 (en) * | 2007-11-05 | 2013-01-29 | Eastman Kodak Company | Negative charge control agents and their preparation |
| US7930657B2 (en) * | 2008-01-23 | 2011-04-19 | Micron Technology, Inc. | Methods of forming photomasks |
| WO2010113700A1 (ja) * | 2009-04-02 | 2010-10-07 | 凸版印刷株式会社 | 反射型フォトマスクおよび反射型フォトマスクブランク |
| JP5696666B2 (ja) | 2009-12-04 | 2015-04-08 | 旭硝子株式会社 | Euvリソグラフィ用光学部材およびeuvリソグラフィ用反射層付基板の製造方法 |
| TWI464529B (zh) | 2009-12-09 | 2014-12-11 | 旭硝子股份有限公司 | EUV microfilm with anti-reflective substrate, EUV microsurgical reflective mask substrate, EUV microsurgical reflective mask and manufacturing method of the reflective substrate |
| KR20130007533A (ko) | 2009-12-09 | 2013-01-18 | 아사히 가라스 가부시키가이샤 | Euv 리소그래피용 광학 부재 |
| US8764995B2 (en) | 2010-08-17 | 2014-07-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Extreme ultraviolet light (EUV) photomasks, and fabrication methods thereof |
| JP5691677B2 (ja) * | 2011-03-10 | 2015-04-01 | 凸版印刷株式会社 | 反射型フォトマスクの位相欠陥修正方法 |
| US8492054B2 (en) | 2011-03-25 | 2013-07-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mechanisms for patterning fine features |
| NL2010025A (en) | 2012-01-17 | 2013-07-18 | Asml Netherlands Bv | Lithographic mask, lithographic apparatus and method. |
| WO2013156328A2 (en) * | 2012-04-18 | 2013-10-24 | Asml Netherlands B.V. | Mask for lithographic apparatus and methods of inspection |
| US8658333B2 (en) * | 2012-06-04 | 2014-02-25 | Nanya Technology Corporation | Reflective mask |
| JP2014096483A (ja) * | 2012-11-09 | 2014-05-22 | Toppan Printing Co Ltd | 反射型マスクおよびその製造方法 |
| US9069253B2 (en) * | 2013-03-13 | 2015-06-30 | Nanya Technology Corportion | Mask structure |
| US9310675B2 (en) | 2013-03-15 | 2016-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Extreme ultraviolet light (EUV) photomasks, and fabrication methods thereof |
| DE102013108872B4 (de) * | 2013-03-15 | 2018-05-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fotomasken für extrem ultraviolettes Licht (EUV) sowie Herstellungsverfahren dieser |
| US9575412B2 (en) | 2014-03-31 | 2017-02-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for reducing pole imbalance by adjusting exposure intensity |
| CN105093817A (zh) * | 2014-05-23 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | 一种光掩模图案的修复方法 |
| DE102014216458A1 (de) | 2014-08-19 | 2016-02-25 | Carl Zeiss Smt Gmbh | Optisches Element mit einer Beschichtung zur Beeinflussung von Heizstrahlung und optische Anordnung |
| KR102246876B1 (ko) | 2014-10-22 | 2021-04-30 | 삼성전자 주식회사 | 극자외선 리소그래피 장치용 반사형 마스크 및 그 제조방법 |
| US9551924B2 (en) * | 2015-02-12 | 2017-01-24 | International Business Machines Corporation | Structure and method for fixing phase effects on EUV mask |
| KR102520797B1 (ko) | 2015-10-15 | 2023-04-12 | 삼성전자주식회사 | 반사형 포토마스크 및 그 제조 방법 |
| US10908496B2 (en) * | 2016-04-25 | 2021-02-02 | Asml Netherlands B.V. | Membrane for EUV lithography |
| EP3454120B1 (de) * | 2017-09-09 | 2024-05-01 | IMEC vzw | Verfahren zur herstelling von euv retikeln und retikel für euv-lithographie |
| US11143951B2 (en) * | 2018-04-30 | 2021-10-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Pellicle for an EUV lithography mask and a method of manufacturing thereof |
| US20200124957A1 (en) * | 2018-10-17 | 2020-04-23 | Astrileux Corporation | Photomask having reflective layer with non-reflective regions |
| KR102567180B1 (ko) * | 2020-04-21 | 2023-08-16 | 에이지씨 가부시키가이샤 | Euv 리소그래피용 반사형 마스크 블랭크 |
| US11171044B1 (en) | 2020-05-08 | 2021-11-09 | International Business Machines Corporation | Planarization controllability for interconnect structures |
| US11815804B2 (en) * | 2021-04-22 | 2023-11-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | EUV mask blank and method of making EUV mask blank |
| US12353120B2 (en) * | 2021-07-30 | 2025-07-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | EUV photo masks and manufacturing method thereof |
| DE102022208658A1 (de) * | 2022-08-22 | 2024-02-22 | Carl Zeiss Smt Gmbh | Zwischenprodukt zur Herstellung eines optischen Elements für eine Projektionsbelichtungsanlage, optisches Element für eine Projektionsbelichtungsanlage, Verfahren zur Herstellung eines Zwischenprodukts und Verfahren zur Herstellung eines optischen Elements |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5935733A (en) * | 1996-04-05 | 1999-08-10 | Intel Corporation | Photolithography mask and method of fabrication |
| US5958629A (en) * | 1997-12-22 | 1999-09-28 | Intel Corporation | Using thin films as etch stop in EUV mask fabrication process |
| US5935737A (en) * | 1997-12-22 | 1999-08-10 | Intel Corporation | Method for eliminating final euv mask repairs in the reflector region |
| US5928817A (en) * | 1997-12-22 | 1999-07-27 | Intel Corporation | Method of protecting an EUV mask from damage and contamination |
| FR2797060B1 (fr) * | 1999-07-29 | 2001-09-14 | Commissariat Energie Atomique | Structure pour masque de lithographie en reflexion et procede pour sa realisation |
-
2001
- 2001-07-31 US US09/919,680 patent/US6593041B2/en not_active Expired - Lifetime
-
2002
- 2002-07-11 CN CNA028120469A patent/CN1695093A/zh active Pending
- 2002-07-11 EP EP02742415A patent/EP1412817B1/de not_active Expired - Lifetime
- 2002-07-11 AU AU2002315549A patent/AU2002315549A1/en not_active Abandoned
- 2002-07-11 WO PCT/US2002/022104 patent/WO2003012546A2/en not_active Ceased
- 2002-07-11 DE DE60236663T patent/DE60236663D1/de not_active Expired - Fee Related
- 2002-07-11 AT AT02742415T patent/ATE470886T1/de not_active IP Right Cessation
- 2002-07-22 TW TW091116239A patent/TWI289725B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE60236663D1 (de) | 2010-07-22 |
| WO2003012546A2 (en) | 2003-02-13 |
| CN1695093A (zh) | 2005-11-09 |
| EP1412817B1 (de) | 2010-06-09 |
| WO2003012546A3 (en) | 2003-12-18 |
| US6593041B2 (en) | 2003-07-15 |
| TWI289725B (en) | 2007-11-11 |
| AU2002315549A1 (en) | 2003-02-17 |
| EP1412817A2 (de) | 2004-04-28 |
| US20030027053A1 (en) | 2003-02-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |