ATE472824T1 - Eingekapseltes mikroelektronisches smd bauelement,insbesondere für eine aktive implantierbare medizinische vorrichtung und herstellungsverfahren - Google Patents

Eingekapseltes mikroelektronisches smd bauelement,insbesondere für eine aktive implantierbare medizinische vorrichtung und herstellungsverfahren

Info

Publication number
ATE472824T1
ATE472824T1 AT99403134T AT99403134T ATE472824T1 AT E472824 T1 ATE472824 T1 AT E472824T1 AT 99403134 T AT99403134 T AT 99403134T AT 99403134 T AT99403134 T AT 99403134T AT E472824 T1 ATE472824 T1 AT E472824T1
Authority
AT
Austria
Prior art keywords
medical device
production method
implantable medical
active implantable
smd component
Prior art date
Application number
AT99403134T
Other languages
English (en)
Inventor
Campenhout Yves Van
Dominique Gilet
Thierry Legay
Hubert Bono
Original Assignee
Ela Medical Sa
Tronic S Microsystems
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ela Medical Sa, Tronic S Microsystems filed Critical Ela Medical Sa
Application granted granted Critical
Publication of ATE472824T1 publication Critical patent/ATE472824T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Electrotherapy Devices (AREA)
  • Prostheses (AREA)
  • Dicing (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Micromachines (AREA)
AT99403134T 1998-12-14 1999-12-14 Eingekapseltes mikroelektronisches smd bauelement,insbesondere für eine aktive implantierbare medizinische vorrichtung und herstellungsverfahren ATE472824T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9815759A FR2787241B1 (fr) 1998-12-14 1998-12-14 Composant microelectronique cms enrobe, notamment pour un dispositif medical implantable actif, et son procede de fabrication

Publications (1)

Publication Number Publication Date
ATE472824T1 true ATE472824T1 (de) 2010-07-15

Family

ID=9533941

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99403134T ATE472824T1 (de) 1998-12-14 1999-12-14 Eingekapseltes mikroelektronisches smd bauelement,insbesondere für eine aktive implantierbare medizinische vorrichtung und herstellungsverfahren

Country Status (6)

Country Link
US (1) US6251703B1 (de)
EP (1) EP1011133B1 (de)
JP (1) JP4778599B2 (de)
AT (1) ATE472824T1 (de)
DE (1) DE69942540D1 (de)
FR (1) FR2787241B1 (de)

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SE521415C2 (sv) * 1998-02-17 2003-10-28 Hans Goeran Evald Martin Metod för att framställa en gassensortillhörig detektor, samt en detektor framställd enligt metoden
KR100319609B1 (ko) 1999-03-09 2002-01-05 김영환 와이어 어래이드 칩 사이즈 패키지 및 그 제조방법
US6707149B2 (en) * 2000-09-29 2004-03-16 Tessera, Inc. Low cost and compliant microelectronic packages for high i/o and fine pitch
SG127684A1 (en) * 2002-08-19 2006-12-29 Micron Technology Inc Packaged microelectronic component assemblies
US6841883B1 (en) * 2003-03-31 2005-01-11 Micron Technology, Inc. Multi-dice chip scale semiconductor components and wafer level methods of fabrication
US7169691B2 (en) * 2004-01-29 2007-01-30 Micron Technology, Inc. Method of fabricating wafer-level packaging with sidewall passivation and related apparatus
KR100651124B1 (ko) * 2004-11-08 2006-12-06 삼성전자주식회사 Ｗｂｇａ형 반도체 패키지 및 그 제조방법
US7371676B2 (en) * 2005-04-08 2008-05-13 Micron Technology, Inc. Method for fabricating semiconductor components with through wire interconnects
US20060261498A1 (en) * 2005-05-17 2006-11-23 Micron Technology, Inc. Methods and apparatuses for encapsulating microelectronic devices
US7393770B2 (en) * 2005-05-19 2008-07-01 Micron Technology, Inc. Backside method for fabricating semiconductor components with conductive interconnects
US7589406B2 (en) * 2005-06-27 2009-09-15 Micron Technology, Inc. Stacked semiconductor component
US7307348B2 (en) * 2005-12-07 2007-12-11 Micron Technology, Inc. Semiconductor components having through wire interconnects (TWI)
US7659612B2 (en) 2006-04-24 2010-02-09 Micron Technology, Inc. Semiconductor components having encapsulated through wire interconnects (TWI)
US7833456B2 (en) * 2007-02-23 2010-11-16 Micron Technology, Inc. Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
US8168458B2 (en) * 2008-12-08 2012-05-01 Stats Chippac, Ltd. Semiconductor device and method of forming bond wires and stud bumps in recessed region of peripheral area around the device for electrical interconnection to other devices
US9899442B2 (en) 2014-12-11 2018-02-20 Invensas Corporation Image sensor device
US11069734B2 (en) 2014-12-11 2021-07-20 Invensas Corporation Image sensor device
US10204893B2 (en) 2016-05-19 2019-02-12 Invensas Bonding Technologies, Inc. Stacked dies and methods for forming bonded structures
US10269756B2 (en) 2017-04-21 2019-04-23 Invensas Bonding Technologies, Inc. Die processing
US10217720B2 (en) 2017-06-15 2019-02-26 Invensas Corporation Multi-chip modules formed using wafer-level processing of a reconstitute wafer
US10727219B2 (en) 2018-02-15 2020-07-28 Invensas Bonding Technologies, Inc. Techniques for processing devices
US11276676B2 (en) 2018-05-15 2022-03-15 Invensas Bonding Technologies, Inc. Stacked devices and methods of fabrication
WO2020010136A1 (en) 2018-07-06 2020-01-09 Invensas Bonding Technologies, Inc. Molded direct bonded and interconnected stack
WO2020010265A1 (en) 2018-07-06 2020-01-09 Invensas Bonding Technologies, Inc. Microelectronic assemblies
US11296053B2 (en) 2019-06-26 2022-04-05 Invensas Bonding Technologies, Inc. Direct bonded stack structures for increased reliability and improved yield in microelectronics
US11742314B2 (en) 2020-03-31 2023-08-29 Adeia Semiconductor Bonding Technologies Inc. Reliable hybrid bonded apparatus
US11631647B2 (en) 2020-06-30 2023-04-18 Adeia Semiconductor Bonding Technologies Inc. Integrated device packages with integrated device die and dummy element
US11728273B2 (en) 2020-09-04 2023-08-15 Adeia Semiconductor Bonding Technologies Inc. Bonded structure with interconnect structure
US11764177B2 (en) 2020-09-04 2023-09-19 Adeia Semiconductor Bonding Technologies Inc. Bonded structure with interconnect structure
EP4315411A4 (de) 2021-03-31 2025-04-30 Adeia Semiconductor Bonding Technologies Inc. Direktbindungsverfahren und -strukturen
US12604771B2 (en) 2021-10-28 2026-04-14 Adeia Semiconductor Bonding Technologies Inc. Direct bonding methods and structures

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US4613891A (en) * 1984-02-17 1986-09-23 At&T Bell Laboratories Packaging microminiature devices
JP2738568B2 (ja) * 1989-09-06 1998-04-08 新光電気工業株式会社 半導体チップモジュール
JP3258764B2 (ja) * 1993-06-01 2002-02-18 三菱電機株式会社 樹脂封止型半導体装置の製造方法ならびに外部引出用電極およびその製造方法
US5714800A (en) * 1996-03-21 1998-02-03 Motorola, Inc. Integrated circuit assembly having a stepped interposer and method
KR0179920B1 (ko) 1996-05-17 1999-03-20 문정환 칩 사이즈 패키지의 제조방법
KR100231276B1 (ko) * 1996-06-21 1999-11-15 황인길 반도체패키지의 구조 및 제조방법
DE19702186C2 (de) * 1997-01-23 2002-06-27 Fraunhofer Ges Forschung Verfahren zur Gehäusung von integrierten Schaltkreisen
US5893726A (en) * 1997-12-15 1999-04-13 Micron Technology, Inc. Semiconductor package with pre-fabricated cover and method of fabrication
US6109369A (en) * 1999-01-29 2000-08-29 Delphi Technologies, Inc. Chip scale package

Also Published As

Publication number Publication date
EP1011133A1 (de) 2000-06-21
EP1011133B1 (de) 2010-06-30
JP4778599B2 (ja) 2011-09-21
DE69942540D1 (de) 2010-08-12
FR2787241B1 (fr) 2003-01-31
JP2000236044A (ja) 2000-08-29
FR2787241A1 (fr) 2000-06-16
US6251703B1 (en) 2001-06-26

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